Quellan and Fulcrum Join Forces to Deliver Advanced Interconnect for Next Generation Data Centers

Companies Demonstrate High-density Mezzanine Card for Rapid Deployment of

Ultra-thin Data Center Interconnects

TAMPA, Fla. - SuperComputing 2006 Conference - Nov. 14 /Xinhua-

PRNewswire/ -- Quellan, a leader in analog signal integrity devices and

Fulcrum Microsystems, a leader in high performance interconnect devices,

today announced the industry’s first extended reach CX4 mezzanine card. The

card is for use with the Fulcrum FocalPoint switch reference design, which

will allow OEMs to attain up to 40 meters of reach on up to 24 ports of 10-

Gigabit Ethernet seamlessly.

"Increasing the reach of 10G Ethernet at an attractive price point will

help accelerate its adoption in the data center," said Harry Quackenboss,

Chairman and CEO of Woven Systems. "Quellan’s Lane Manager devices drive

copper cable distances substantially farther than the standards specify,

minimizing the need for expensive fiber optic interconnects."

The mezzanine cards are populated with Quellan’s QLx4300 Lane Manager

Chips that actively remove impairments and compensate for channel loss,

allowing data center managers to use ultra-thin 30 gauge CX4 cabling for

increased airflow, density and manageability or extend the reach of

traditional 24 gauge cable to up to 40 meters.

"Signal integrity and low latency are critical parameters for next

generation data centers," said Joel Goergen, Chief Scientist at Force10

Networks. "Quellan’s products address both these issues in a very low power

consumption device. Well done!"

The FocalPoint FM2224 is a breakthrough 10-Gigabit Ethernet switch chip

with 200ns of total latency, making Ethernet the new cost-effective and high-

performance choice for storage, computing and networking backplane and

interconnect applications. The FM2224 features 24 integrated 10-Gigabit

Ethernet interfaces, each of which can be configured to operate in 10Gbps,

2.5 Gbps and 10/100/1000 modes.

"Our customers are eager to reduce weight and improve density in their

data center interconnects," said Bob Nunn CEO of Fulcrum. "Our collaboration

with Quellan has yielded a ready-to-go solution to address these issues."

"Clearly, next generation data center interconnects are challenged by

reach, weight and density issues -- and the only way to achieve this is with

low power, smart silicon at each end," said Tony Stelliga, Chairman and CEO

of Quellan, Inc. "Next generation high density switches can now run up to 4

times farther on cabling that is just one third the size and weight of

existing copper interconnects."

Quellan is demonstrating both its Q:ACTIVE(TM) semiconductor technology

for active cabling and its mezzanine card in booth 235 at the 2006

SuperComputing Conference in Tampa, Florida to address the growing need for

data center reach and density improvements.

About Fulcrum Microsystems, Inc.

Fulcrum Microsystems Inc. is a fabless semiconductor company focused on

developing interconnect switch chips for next-generation board and system

designs. The company’s devices change the paradigm for interconnect,

offering low latency, fine-grained flow control and high throughput, which

combine to simplify board design and to build in more flexibility and higher

performance. More information can be found at http://www.fulcrummicro.com .

About Quellan Incorporated

Quellan specializes in analog components that improve the performance and

functionality of electronic equipment by removing channel impairments and

noise. Quellan serves the Enterprise, Telecom, Broadcast, Automotive and

Consumer Electronics markets. Privately held, Quellan’s investors include

Menlo Ventures, Cordova Ventures and Samsung Ventures Investment Corporation.

For more information call 408-774-0084 or visit http://www.quellan.com .