BUFFALO GROVE, Ill., Aug. 31 /Xinhua-PRNewswire-FirstCall/ --
Eagle Test Systems, Inc. (Nasdaq: EGLT), announced that Carsem, a leading provider of turn-key assembly and test services including wafer probe, final test, product engineering and test program/hardware development for the semiconductor industry, has selected Eagle Test Systems as their mixed-signal and analog platform of choice for true parallel multi-site test.
Carsem plans to utilize the Eagle Test platform in their development and production facilities for Power Management, Industrial, Automotive, and some Data Converter device test applications. Eagle Test was chosen based on a set of Carsem specific criteria which includes installed base, long term viability, OEE performance, test economics, and global support capabilities.
"The Eagle Test platform enables us to offer parallel, multi-site testing to address a wide range of customers' products with superior cost-of-test economics," said WT Chim, General Manager of Test Operations for Carsem Malaysia. "Eagle's parallel capabilities were a key factor in our decision process. With multiple facilities in Malaysia and China, Eagle continues to demonstrate their commitment to Carsem's success."
"Since Carsem is a major player in the assembly and test of MLP products, the decision to name Eagle their platform of choice speaks very highly of our ability to deliver high volume test solutions," stated Dale Buxton, Vice President Asian Operations for Eagle Test. "We consider Carsem to be an extremely valuable relationship and look forward to sharing continued success."
About Eagle Test Systems, Inc.
Eagle Test designs, manufactures, sells and services high-performance automated test equipment for the semiconductor industry. The company's products are used to test analog, mixed-signal and radio frequency (RF) semiconductors that are used in products such as digital cameras, MP3 players, automotive electronics, cellular telephones, computers and peripherals. The company was founded in 1976 and has offices located throughout the world in Asia, North America and Europe, with corporate headquarters in Buffalo Grove, Illinois. Please visit http://www.eagletest.com for more information.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.