Agreement aimed at expediting customer designs utilizing CEVA DSP cores for a range of applications, including communications, connectivity, imaging, vision, audio and voice
MOUNTAIN VIEW, Calif. and SHANGHAI, March 19, 2014 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, Brite Semiconductor (Shanghai) Corporation, a leading IC design and turnkey service provider, and Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), today jointly announced a collaboration to provide hard macro versions of CEVA's DSP cores for customers wishing to reduce the risk and design cycle time for their SoC projects. Under the agreement, Brite Semiconductor has licensed a range of CEVA DSP core technologies solely to develop fully optimized application-specific hard macros that will be manufactured at SMIC's foundry.
"CEVA's DSP cores and platforms lead the industry in terms of performance and power efficiency, and we are delighted to partner with them and SMIC to offer our customers fully optimized designs that reduce risk and expedite time-to-market for a wide range of applications," said Dr. Charlie Zhi, President & CEO of Brite Semiconductor. "Through the close collaboration with CEVA and SMIC, we are bringing significant value and expertise to our customers who seek to take advantage of CEVA's industry-leading DSP core technologies."
"Partnering with CEVA and Brite to deliver fully integrated platforms using our advanced processes and technologies will enable us to better serve our customers seeking increased performance and more energy-efficient solutions," said Dr. Tianshen Tang, senior vice president of SMIC Design Service. "Our foundry is the most advanced in mainland China and the addition of support for CEVA's latest DSP cores further extends our capabilities and leadership in China's burgeoning semiconductor industry."
"China is a highly strategic market for CEVA, with a rapidly expanding semiconductor industry developing some of the most innovative technologies in mobile and consumer electronics industries," said Gideon Wertheizer, CEO of CEVA. "Our DSPs for communications, connectivity, imaging, vision, audio and voice lead the industry in terms of performance and power efficiency and now our customers can gain access to them easier than ever. This collaboration between CEVA, SMIC and Brite aims to help companies to truly differentiate their SoCs with minimal design risk."
Under the agreement, Brite and SMIC will provide complete design and manufacturing services - including the incorporation of the CEVA DSP core hard macros into SMIC's design databases. The hard macro solutions resulting from the collaboration will enable SMIC customers to utilize their foundry process with minimum integration cost, accelerated integration time and reduced risk.