TAOYUAN, Aug. 12, 2026 /PRNewswire/ -- Compal Electronics (Compal; TWSE: 2324) today held the opening ceremony for its Daxi AI Server Manufacturing Center, officially launching next-generation AI server manufacturing capacity. The facility marks a significant milestone in Compal's global AI manufacturing strategy and reinforces its commitment to strengthening its role in the global AI supply chain.

The ceremony was hosted by Compal Chairman Ray Chen and attended by distinguished guests including Taoyuan City Mayor Simon Chang, Taoyuan City Council Speaker Chiu Yi-Sheng, Legislator Chiu Jo-Hua, Taoyuan City Councilors Lee Po-Fang and Liang Wei-Chao, and Taoyuan City Department of Economic Development Director Chang Cheng, who joined together to celebrate this important milestone. Their presence underscores Compal's long-term commitment to Taiwan and its determination to further strengthen its strategic position within the global AI supply chain.

As demand for AI, high-performance computing (HPC), and large-scale data centers continues to grow rapidly, global demand for AI servers is also accelerating. To capitalize on these opportunities, Compal has been actively expanding its AI server R&D and manufacturing capabilities. In May this year, the Company announced its investment in the Daxi facility, including property acquisition, facility upgrades, and the deployment of advanced manufacturing equipment, with a total investment of NT$4.03 billion.

The launch of the Daxi Manufacturing Center will further enhance Compal's competitiveness in AI server manufacturing, supply chain resilience, and global fulfillment capabilities.

The Daxi facility occupies approximately 7,654 square meters of land with a total floor area of approximately 21,706 square meters. The site will focus on the production of AI server systems (L10) and rack-level solutions (L11) and is expected to begin contributing revenue progressively starting in the 4Q 2026. With the addition of the Daxi Manufacturing Center, Compal's AI server system production capacity is expected to double, while adding new rack manufacturing capabilities to support the growing demand for AI servers and data center infrastructure.

The Daxi AI Server Manufacturing Center will incorporate Compal's proprietary liquid-cooling technology and focus on rack-level system integration, advanced cooling technologies, and high-density AI infrastructure manufacturing capabilities. These technologies are designed to address the increasing demands for higher power consumption, greater computing density, and enhanced reliability in AI server deployments, while delivering more stable and energy-efficient solutions for customers.

From a global manufacturing perspective, the Daxi Manufacturing Center will complement Compal's existing production sites in Taiwan, Vietnam, and the United States. Through this coordinated manufacturing network, Compal will offer customers greater regional manufacturing flexibility, enhanced order support, and improved global delivery capabilities to meet the increasingly diverse supply chain requirements of AI customers worldwide.

Ray Chen, Chairman of Compal Electronics stated: "Compal is accelerating its transformation into an AI-centric company. In the AI server market, our customer base has expanded from traditional PC ODM customers into the NeoCloud, which has become a key driver of the rapid growth of our server business this year. Going forward, we will further expand our presence among Hyperscaler and Enterprise customers." He further added, "AI is changing the world, and manufacturing capability will determine who can truly turn AI into reality. The opening of the Daxi Manufacturing Center is not only an expansion of our production capacity, but also a meaningful enhancement of Compal's overall capabilities across the AI supply chain. Combined with the planned full-scale ramp-up of our Texas facility in the United States next year, we are highly confident in the growth momentum of our AI server business in 2027."

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com 

TAIPEI, June 4, 2026 /PRNewswire/ -- As artificial intelligence rapidly transitions from experimentation to large-scale production deployment, demand for AI factories, AI cloud infrastructure, and high-performance computing capacity continues to accelerate. Compal Electronics ("Compal"; TWSE: 2324), a leading provider of server and AI infrastructure solutions, is supporting this transformation through advanced computing platforms designed for next-generation AI workloads and large-scale AI service delivery.

As organizations continue to expand the use of AI across software development, content creation, video generation, and intelligent business operations, infrastructure has become a critical foundation for delivering reliable and scalable AI services. At the same time, enterprises are actively exploring new AI-driven workflows and agentic AI applications, driving demand for larger-scale and more capable AI infrastructure.

As part of this effort, Japan-based AI infrastructure provider Datasection Inc. utilizes Compal's SGX30-2 AI server platform to support the expansion of its AI cloud platform and computing infrastructure. As demand for generative AI, coding assistants, video generation services, AI agents, and large-scale inference workloads continues to grow, scalable AI infrastructure has become increasingly important for delivering production-grade AI services across the Asia-Pacific region.

Designed for next-generation accelerated computing environments, Compal's SGX30-2 AI server platform delivers the compute density, scalability, and operational efficiency required for modern AI factories. Optimized for AI and HPC workloads from training to inference, the platform supports a broad range of compute-intensive applications, including large-scale inference, AI service deployment, and emerging agentic AI workloads. By enabling customers to efficiently scale computing resources, the platform helps accelerate the deployment of production-ready AI environments.

"AI is rapidly moving beyond experimentation into large-scale production environments," said Alan Chang, Vice President of Compal Infrastructure Solutions Business Group. "As AI factories, AI cloud services, and large-scale inference workloads continue to expand, infrastructure scalability, system integration, and operational efficiency have become critical success factors. Through collaboration with ecosystem partners such as Datasection, Compal is committed to helping customers build the computing foundation required to support the next generation of AI innovation and service delivery."

As demand for AI computing infrastructure continues to grow, Compal remains committed to advancing innovation across compute, power, and cooling technologies. By working closely with customers and ecosystem partners, the company aims to accelerate the deployment of AI factories, large-scale AI infrastructure, and intelligent services that support the future of AI at scale.

Under this engagement, GMI Cloud will adopt high-performance GPU server platforms designed to support the growing demands of large-scale AI training and inference workloads. The deployment will serve as a key foundation for GMI Cloud's continued expansion in AI-driven services and data-centric applications.

As demand for AI compute continues to accelerate, cloud providers are scaling infrastructure to support increasingly complex workloads, including large language models, large-scale inference services, agentic AI systems, and real-time AI applications. Compal supports this deployment with its expertise in high-density server design, advanced thermal architecture, and system integration, enabling efficient and reliable infrastructure deployment at scale.

"As AI workloads rapidly evolve toward large-scale inference and emerging agentic AI applications, infrastructure requirements are shifting toward higher density, greater efficiency, and faster deployment cycles," said Alan Chang, Vice President of Infrastructure Solutions Business Group at Compal. "We are pleased to support GMI Cloud in building an AI infrastructure optimized for next-generation inference and real-world AI deployment."

"As AI shifts from model experimentation to real-world deployment, scalable inference infrastructure becomes increasingly critical," said Alex Yeh, Founder and CEO of GMI Cloud. "Through this collaboration with Compal, we are expanding the infrastructure foundation needed to support agentic AI workloads and scalable inference services globally."

In addition to the infrastructure deployment, Compal and GMI Cloud will jointly showcase their latest collaboration at COMPUTEX 2026.

At the Compal booth (M0804), visitors will be able to explore GMI Cloud's latest agentic AI and inference-driven application scenarios, demonstrating how advanced infrastructure enables real-world deployment of next-generation AI services.

GMI Cloud will also feature Compal's high-performance AI server platform, the Compal SGX30-2, at its booth (R0302). The system is designed to support NVIDIA HGX B300 platform, delivering the performance and scalability required for large-scale AI training and inference workloads. With an optimized design for high-density deployment, advanced thermal management, and system-level integration, the platform provides a robust foundation for next-generation AI infrastructure.

This collaboration reflects Compal's continued role in supporting emerging cloud providers and AI infrastructure operators as they expand capacity and bring new services to market. With a global manufacturing footprint and a robust supply chain, Compal is well-positioned to support customers in deploying AI systems efficiently across regions.

About Compal

Founded in 1984, Compal is a global technology leader delivering PC platforms, cloud and AI servers, and smart device solutions for leading brands worldwide. Learn more at https://www.compal.com

About GMI Cloud

GMI Cloud is a Silicon Valley-based AI infrastructure company delivering full-stack GPU cloud and AI platform solutions for scalable AI deployment. Learn more at gmicloud.ai.

As AI workloads continue driving rapid growth in power density and thermal demands, Compal is expanding beyond traditional server manufacturing to deliver more integrated, deployment-ready AI infrastructure solutions for cloud service providers, enterprises, and large-scale AI factories. Through its collaboration with Exascale Labs, Compal is further strengthening its ability to integrate compute, cooling, and power infrastructure into scalable AI data center deployments tailored to evolving customer requirements.

At COMPUTEX 2026, Compal will present a full AI infrastructure showcase inside its booth, integrating AI servers, liquid cooling, and data center infrastructure technologies. The showcase includes Compal's latest AI server platforms, including OG231-2-L1 and SGX30-2, alongside its Coolant Distribution Unit (CDU) liquid cooling technologies. In collaboration with Exascale Labs, the exhibit will also feature Modular Data Center (MDC) and Solid-State Transformers (SST) based HVDC power architecture technologies, highlighting how integrated compute, cooling, and power infrastructure can help customers accelerate AI deployment while improving scalability and energy efficiency.

By combining rack-scale compute platforms, direct liquid cooling, and flexible infrastructure integration, Compal enables customers to customize deployments based on workload, power availability, and data center environments while reducing deployment complexity and accelerating time-to-service.

"AI infrastructure is no longer just about server performance — customers now require integrated solutions spanning compute, cooling, and power," said Alan Chang, Vice President, ISBG at Compal. "By combining Compal's AI server and liquid cooling technologies with Exascale's modular infrastructure and HVDC capabilities, we are helping customers deploy scalable AI infrastructure faster and more efficiently."

"We continue to see growing demand for more flexible and rapidly deployable AI infrastructure," said Hoansoo Lee, CEO at Exascale Labs. "Through this collaboration with Compal, we are pleased to combine modular data center and HVDC power technologies with Compal's integrated capabilities in AI servers and liquid cooling to showcase a next-generation AI infrastructure solution designed for high-density AI environments."

Compal's AI infrastructure showcase will be on display throughout COMPUTEX 2026 at booth M0804.

About Compal

Founded in 1984, Compal is a global technology leader delivering PC platforms, cloud and AI servers, and smart device solutions for leading brands worldwide. Learn more at https://www.compal.com

The NVIDIA Vera Rubin architecture integrates the NVIDIA Vera CPU, NVIDIA Rubin GPU, NVIDIA NVLink 6 Switch, NVIDIA BlueField-4 DPU, NVIDIA Spectrum-X Ethernet and NVIDIA ConnectX-9 SuperNIC to form a comprehensive heterogeneous computing architecture. Powered by NVLink 6 switching technology, the NVL72 rack-scale configuration delivers up to 260 TB/s of total bandwidth and enables 3.6 TB/s of all-to-all bandwidth per GPU, supporting MoE models and large-scale training and inference workloads.

Compal is introducing the SG231-2-L1, based on NVIDIA HGX Rubin NVL8. The core value of the SG231-2-L1 includes:

• High-Density Accelerated Architecture: Integrates eight NVIDIA Rubin GPUs within a 2U chassis, maximizing compute density and space efficiency.
  
  
• Advanced Inference Performance: Delivers up to 400 petaFLOPS (NVFP4), supporting LLM training and inference, generative AI, and HPC workloads.
  
  
• High-Bandwidth GPU Interconnect: Powered by NVIDIA NVLink 6, enabling up to 28.8TB/s of GPU-to-GPU bandwidth for enhanced multi-GPU scalability.
  
  
• Scalable Memory Architecture: Supports up to 2.3TB of GPU memory and 176TB/s of memory bandwidth for memory-intensive AI applications.
  
  
• High Power Density with Liquid Cooling: Sustains approximately 24kW of system power through optimized direct liquid-cooling design for stable, sustained performance.
  
  
• Rack-Level Deployment Readiness: Designed for seamless integration into high-density AI racks, supporting scalable expansion from single nodes to data center deployments.

In its booth, Compal is also featuring an NVIDIA Vera CPU HPM module based on NVIDIA HGX system, highlighting engineering readiness and manufacturing capabilities aligned with the NVIDIA Vera Rubin platform. As heterogeneous computing architectures continue to evolve, coordinated CPU-GPU design has become a critical factor for data centers.

Complementing this showcase, Compal is also introducing support for the new NVIDIA RTX PRO 4500 Blackwell Server Edition—featuring 32GB GDDR7 memory and up to 800 GB/s bandwidth, enabling efficient acceleration for AI inference, data processing, and visual computing workloads.

Alan Chang, Vice President of Compal's Infrastructure Systems Business Group, stated: "Competition in AI infrastructure has shifted from single-node performance comparisons to overall deployment efficiency and long-term scalability. As the NVIDIA HGX Rubin NVL8 platform advances in both performance and power density, data center architecture must evolve accordingly. We are strengthening not only compute capability, but also the load-bearing and expansion capacity of the entire infrastructure stack, enabling customers to establish sustainable deployment models for next-generation AI workloads."

As AI workloads continue to scale, data center competitiveness is increasingly defined by ecosystem alignment and holistic architectural integration. Through its showcase at GTC 2026, Compal demonstrates engineering strength in high-density GPU systems and liquid cooling solutions while reinforcing its long-term strategic engagement within the NVIDIA technology ecosystem.

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

At the exhibition, Compal will demonstrate a complete deployment configuration composed of three physical rack units integrating high-density compute nodes, high-power electrical infrastructure, and liquid cooling systems. The Power Rack features an AcBel-designed power rack architecture, while the Liquid Cooling Rack integrates Rayonnant CDU Cabinet Rack systems and piping infrastructure to establish a coordinated power and thermal management environment. Together, these elements form a synergistic operating architecture that enables visitors to observe next-generation AI infrastructure logic and system relationships under near real-world data center conditions.

The exhibit includes high-density system designs based on NVIDIA HGX system and NVIDIA MGX architecture, featuring deployments built on NVIDIA HGX Rubin NVL8 and NVIDIA HGX B300 system. Presented at rack scale, the showcase illustrates practical build-out models for next-generation AI infrastructure. With the introduction of the NVIDIA Rubin GPUs and the rollout of NVIDIA HGX B300 and other new system architectures, compute density and power requirements continue to increase, raising the bar for data center power delivery capacity, energy efficiency, and thermal management.

Against this backdrop, data center construction is progressively shifting from node-centric design toward rack-level infrastructure planning. This change in deployment scale elevates platform selection and system integration capabilities as critical factors in long-term enterprise investment decisions.

The parallel evolution of NVIDIA HGX and NVIDIA MGX platforms reflects the continuity of NVIDIA's technology roadmap. For system providers, the ability to stay aligned with this development cadence has become a key competitive differentiator. Compal's presence at NVIDIA GTC 2026 underscores its integration capabilities and strategic positioning within this evolving industry landscape.

At GTC, Compal's automotive electronics team will showcase an infrared perception system demonstrating real-time AI inference capabilities for next-generation vehicle applications. In the medical and life sciences domain, Compal will also present two technical poster sessions at GTC—"GPU Annealer Molecular Docking with Fast Screening and Accurate Ranking" and "Generative Antibody Factory: GPU-Accelerated Diffusion Model & Protein Language Model for Nanobody Discovery," focusing on accelerated molecular docking and generative antibody design. These AI workloads can be deployed on Compal's high-density GPU server platform (SX420-2A), demonstrating how rack-level compute architecture supports drug discovery and scientific AI research.

Alan Chang, Vice President of Compal's Infrastructure Systems Business Group, commented, "The evolution of AI is driven not only by breakthroughs in silicon performance, but also by advancements in infrastructure-level collaboration. Through our long-standing collaboration with NVIDIA, we are positioned at the forefront of technology transitions, preparing for the next phase of deployment. As the industry advances toward higher compute density and larger-scale workloads, we aim to deliver sustained integration value across platform generations."

Compal will also host a featured session on March 16 at 2:00 p.m., titled "Synergy at Scale: Unify Compute, Power and Cooling," where it will share its planning philosophy for high-density AI environments.

As AI infrastructure upgrade cycles accelerate, competitive differentiation is shifting from standalone system performance to holistic architectural integration. At GTC 2026 (Booth 107), Compal will demonstrate tangible rack-level deployment achievements, offering the industry a practical perspective on how next-generation platforms are being realized within modern data centers.

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

This year, Compal Electronics (Compal; Stock Code: 2324) is joining forces with the Industrial Technology Research Institute (ITRI) to present a series of core technologies successfully transferred from ITRI to Compal. Featured technologies include baseband transceivers, beam acquisition and tracking, as well as baseband and RF testing solutions—demonstrating Taiwan's end-to-end capabilities across R&D, system integration, commercialization, and mass production of satellite ground equipment.

In the areas of antenna and system development, Compal will showcase its one-stop R&D and manufacturing capabilities—from antenna module design, RF and baseband integration, to full system completion. This highlights Taiwan's competitive advantage in producing highly integrated satellite ground terminals at scale while ensuring robust supply chain coordination.

Through the close collaboration between Compal and ITRI, the transferred technologies have already been incorporated into ground equipment and successfully validated in real-field environments. The teams achieved end-to-end communication testing for LEO (Low Earth Orbit) satellite ground systems, marking a significant milestone where technologies advanced from lab-level verification to real-world application. During testing, the system demonstrated high technological maturity through beam acquisition and tracking processes, further confirming its readiness for commercial deployment.

The fully integrated system has also passed key commercial requirements—including stability, repeatability, and manufacturability—accelerating productization and facilitating broader market adoption.

Leveraging the global visibility of Satellite 2026, Compal and ITRI will jointly showcase Taiwan's industrial achievements in satellite ground equipment and critical communication technologies. This collaboration strengthens Taiwan's position in the global satellite communications supply chain and deepens opportunities for international cooperation.

About Compal
Established in 1984, Compal has grown into a leading global manufacturer of computers and smart devices, partnering with top-tier brands worldwide. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively expanded into new growth areas, including cloud servers, automotive electronics, smart medica, and advanced communications. More information, please visit: https://www.compal.com

The SG720-2A / OG720-2A features a 7U high-performance AI server powered by dual AMD EPYC™ processors, supporting up to eight AMD Instinct™ MI325X GPUs with forward compatibility for MI355X architecture, and up to eight AMD Pensando™ Pollara 400 AI NICs for scale-out infrastructure. Designed for high-density computing and optimal thermal efficiency, the chassis features an 850 mm depth and modular, tool-less service design, enabling seamless integration into both EIA 19-inch and Open Rack v3 21-inch environments.

In addition, the system supports hot-swappable PCIe slots, allowing rapid network module replacement without downtime to maximize operational flexibility and system uptime.

The platform is equipped with the ZutaCore^® HyperCool^® 2-Phase DLC liquid cooling solution, maintaining stable and reliable performance even under high-density and extreme computing workloads. Testing results show that the system achieves a total PUE (Power Usage Effectiveness) as low as 1.05 and a pPUE (Partial PUE) around 1.01, delivering over 5% higher energy efficiency compared with traditional single-phase liquid-cooling systems.

In addition, the platform supports both single-phase and two-phase liquid-cooling architectures, providing data centers with greater deployment flexibility and helping balance performance, power efficiency, and sustainability in high-density computing environments.

The SG223-2A-I leverages a 2U dual AMD EPYC™ processors supporting up to eight PCIe GPU accelerators. Designed for immersion cooling, the system uses a high-conductivity dielectric fluid to enhance heat transfer efficiency, ensuring GPU stability under heavy workloads while significantly reducing energy consumption. With its open GPU-compatible design, the SG223-2A-I can accommodate a variety of high-performance accelerators, supporting diverse AI and HPC workloads. This solution provides a high-efficiency, low-carbon, and sustainable approach to next-generation data center cooling.

Compal continues to deepen its collaboration with AMD, jointly developing next-generation servers based on the upcoming AMD EPYC™ CPUs, codenamed "Venice." Compal plans to launch these new server models next year, extending its architectural philosophy to deliver higher performance and better energy efficiency for AI and HPC workloads.

Beyond hardware innovation, Compal has partnered with AMI to integrate intelligent management capabilities into its server platforms. This enables remote monitoring, automated maintenance, and dynamic resource orchestration, enhancing efficiency and operational resilience in high-density AI data centers.

During the exhibition, Compal and AMI will co-host a session titled "Revolutionizing AI at Scale" at the Compal booth #4232, highlighting optimized approaches to AI server architecture and intelligent data center management.

Alan Chang, Vice President of Compal's Infrastructure Systems Business Unit, stated: "The rapid evolution of AI and HPC is driving data centers toward architectures centered on liquid cooling and memory interconnect technologies. Compal remains committed to advancing this transformation through innovative design and system integration, building the next generation of high-performance, energy-efficient, and intelligent data center infrastructure that enables sustainable computing worldwide."

About Compal
Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

Media Contact
Jack Wang   Vice president and Spokesperson   +886-2-8797-8588   Investor@compal.com

In terms of compute power, Compal is showcasing its latest AI server, the SGX30-2 / 10U, built on NVIDIA HGX B300 platform. The system leverages the NVIDIA Blackwell architecture and supports up to eight NVIDIA Blackwell Ultra GPUs connected through fifth-generation NVIDIA NVLink for ultra-high-bandwidth data exchange between GPUs. It also features dual Intel® Xeon® 6 processors, delivering exceptional multi-core performance and high-speed memory channels. 

Designed for large-scale AI model training, inference, and high-performance computing (HPC) workloads, the SGX30-2 achieves outstanding throughput and energy efficiency through deep coordination between CPUs and GPUs. The Xeon® 6 architecture supports DDR5 and PCIe 5.0 interfaces and integrates Intel Advanced Matrix Extensions and AI-optimized instruction sets, enabling real-time task balancing and resource sharing between general-purpose and AI inference operations, making the SGX30-2 a true next-generation computing platform for the AI generation.

Another highlight, The SX420-2A, based on NVIDIA MGX reference architecture, features a 4U high-density design compatible with both EIA 19-inch and ORv3 21-inch racks, and supports up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs. This NVIDIA RTX PRO Server from Compal is available in configurations that support the latest high-performance networking technologies, including NVIDIA BlueField-3 DPUs and NVIDIA ConnectX-8 SuperNICs with built-in PCIe Gen 6 switch, further enhancing data center connectivity and scalability. With this powerful combination, enterprises can accelerate a range of enterprise workloads, including AI reasoning, agentic AI, digital twins, robotics simulation, and scientific research. Compared with the previous generation, NVIDIA RTX PRO 6000 Blackwell GPU delivers over 5X higher performance for AI inference and physical simulation workloads, while significantly increasing performance per dollar.

At the system level, Compal will demonstrate next-generation architectures for memory expansion and data-flow optimization. In this evolving design, the system establishes a direct data path between GPU memory and storage through Peripheral Component Interconnect Express (PCIe) interfaces, combined with intelligent Direct Memory Access (DMA) offload and low-latency data-transfer mechanisms. This approach transforms traditional Non-Volatile Memory Express (NVMe) storage into a memory-extended layer, enabling near-Dynamic Random Access Memory (DRAM) access speeds while reducing Central Processing Unit (CPU) workload. In addition, Remote Direct Memory Access (RDMA) technology over InfiniBand or RDMA over Converged Ethernet (RoCE) protocols allows direct data movement between servers and data-center nodes, enabling cross-node memory sharing and flexible resource allocation.

By integrating these key technologies, Compal showcases an AI data-center framework that is unified, reconfigurable, and energy-efficient, advancing from traditional PCIe-based systems toward a new generation of GPU-Direct Storage ideal for high-performance computing (HPC) architectures.

The SC25 exhibit will also highlight Compal's multi-tier thermal portfolio spanning air cooling, liquid cooling, and immersion cooling technologies. Through innovative heat-management design, Compal demonstrates how AI servers can sustain stable performance under extreme power density while maintaining optimal energy efficiency, a key step toward sustainable data-center operations.

Alan Chang, Vice President of Compal's Infrastructure Systems Business Unit, stated: "The rise of generative AI and HPC is shifting data centers from compute-centric to data-centric architectures, with Storage-as-Memory at the core. As storage reaches memory-class latency and bandwidth, data flows seamlessly across storage, memory, and compute layers—forming a unified, reconfigurable resource pool. Compal is committed to driving this evolution through advanced system integration and heterogeneous computing technologies, enabling a new era of data-driven and energy-efficient infrastructure."

Exhibition Information

• Event: Supercomputing Conference 2025 (SC25)
• Date: November 17–20, 2025
• Location: St. Louis, MO, USA
• Booth: #4232

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

Media Contact

Jack Wang   Vice president and Spokesperson   +886-2-8797-8588   Investor@compal.com

In terms of compute power, Compal is showcasing its latest AI server — SGX30-2 / 10U — based on the NVIDIA HGX B300 platform. The system is built on the NVIDIA Blackwell architecture, supports eight NVIDIA Blackwell Ultra GPUs connected with fifth-generation NVIDIA NVLink, and features dual Intel® Xeon® 6 processors, purpose-built for large-scale AI model training, inference, and HPC (high-performance computing) workloads.

NVIDIA Blackwell Ultra GPUs are based on NVIDIA Blackwell architecture, provides up to 2.1 TB of HBM3e memory and 1.8 TB/s GPU-to-GPU NVLink bandwidth, for a total interconnect bandwidth of 14.4 TB/s, ensuring low-laten, high-speed access to massive working sets. It delivers 144 PFLOPS of FP4 inference performance and approximately 72 PFLOPS of FP8 performance, representing a 7x increase in compute performance compared to the previous NVIDIA Hopper generation. This design enables enterprises to perform high-throughput training and efficient inference on a single platform, significantly shortening AI model development and deployment cycles.

The showcase also featured CXL (Compute Express Link) and RDMA (Remote Direct Memory Access) technologies for AI (Artificial Intelligence) Memory Expansion, addressing the growing memory bottlenecks in workloads such as large language model training and HPC. Through the CXL.mem protocol, servers can seamlessly access pooled SCM (Storage-Class Memory)-based Memory Expanders within a rack, enabling CPUs and GPUs to process larger datasets beyond HBM (High Bandwidth Memory) limits with cache-coherent efficiency.

Within the evolving memory architecture, bridging GPU memory and storage a direct path through PCIe interface. It's intelligent DMA (Direct Memory Access) offload and low-latency data-path design transform conventional NVMe (Non-Volatile Memory Express) storage into a memory-like extension, realizing the Storage-as-Memory concept that enables high-speed data access without increasing CPU overhead.

Extending beyond the rack, RDMA allows direct data movement across servers and data centers via InfiniBand or RoCE (RDMA over Converged Ethernet) networks, supporting large-scale memory disaggregation and resource pooling. Together, these technologies redefine how data flows across AI clusters, creating a unified, reconfigurable, and energy-efficient infrastructure that evolves from today's PCIe-based systems toward next-generation GPU direct storage and CXL-enabled architectures.

With this comprehensive showcase, Compal demonstrates a clear, practical path from today's infrastructure to the data center of the future, and underscores its role as a true system integrator — not just a technology provider, but a long-term strategic partner for enterprises in their digital transformation journey," said Alan Chang, Vice President of the Infrastructure Solutions Business Group at Compal.

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

Media Contact

Jack Wang  Vice president and Spokesperson  +886-2-8797-8588  Investor@compal.com

In recent years, the server market has shifted beyond raw compute performance, placing increasing emphasis on energy efficiency and scalability. Compal continues to deepen its collaboration with NVIDIA, addressing enterprise requirements for high performance, flexibility, and efficiency, helping accelerate AI factory and inference platform deployment, and shortening time-to-market.

"AI has moved beyond proof-of-concept to become a central pillar of enterprise digital transformation. Our collaboration with NVIDIA focuses on integrating compute, networking, and cooling technologies to help customers build scalable and sustainable AI infrastructure. We warmly invite attendees to visit us at OCP25 and experience our latest AI platform demonstration accelerated by NVIDIA," said Alan Chang, Vice President of the Infrastructure Solutions Business Group at Compal.

The showcase will also feature PCIe-based memory pooling technology built on CXL (Compute Express Link) and RDMA (Remote Direct Memory Access) architectures, demonstrating next-generation data center innovations in memory expansion, dynamic resource allocation, and low-latency interconnects.

By leveraging advanced interconnect technologies such as PCIe Gen5 (Peripheral Component Interconnect Express, Generation 5), NVMe-oF (Non-Volatile Memory Express over Fabrics), and CXL Fabric, the solution enables high-bandwidth data exchange and resource pooling across server nodes. This architecture further integrates memory and storage tiers, driving the realization of the Storage-as-Memory concept, allowing data to be accessed at near main-memory speed while enhancing overall system performance, scalability, and efficiency.

The on-site demonstration will highlight multi-terabyte memory pooling capabilities and cache-coherency technologies, offering attendees a firsthand look at how these innovations enable a more efficient, flexible, and energy-optimized AI data center infrastructure.

To tackle the thermal demands of high-performance GPUs, Compal will unveil two innovative liquid cooling servers at the OCP Global Summit 2025: the OG720-2A-L2 ORv3 7OU 8x AMD Instinct™ GPUs Direct-to-Chip Liquid-Cooled AI Server and the SG223-2A-I 2U 8x GPU Immersion Cooling Server. These demonstrations will highlight how both solutions sustain optimal performance and energy efficiency under maximum load, enabling data centers to achieve a partial Power Usage Effectiveness (pPUE) below 1.1. The systems provide a scalable and efficient framework for next-generation high-density AI and HPC deployments.

OCP Global Summit 2025 will take place in San Jose Convention Center, California, USA. Visitors to Compal's Booth C35 will gain insight into how AI, CXL, and advanced liquid cooling technologies are shaping the next decade of data centers — and will have the opportunity to engage directly with Compal's engineering team to discuss optimal solutions for performance, efficiency, and cost.

About Compal
Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

Media Contact
Jack Wang   Vice president and Spokesperson   +886-2-8797-8588   Investor@compal.com

LAS VEGAS, Sept. 9, 2025 /PRNewswire/ -- In response to AI's surging power demands and unprecedented computing needs, Compal, a pioneer in high-performance AI server platforms, and ZutaCore®, a leader in waterless direct-to-chip liquid cooling, have joined forces to create integrated server and cooling solutions that revolutionize data center efficiency, reliability, and sustainability. The collaboration will be on display at Yotta 2025, booth #316.

"Partnering with ZutaCore allows us to bring truly transformative cooling technology into our high-performance server portfolio," said Alan Chang, Vice President of the Infrastructure Solutions Business Unit, Compal. "The combination of our engineering expertise and ZutaCore's HyperCool® platform enables data centers to scale AI workloads more sustainably and cost-effectively."

My D. Truong, ZutaCore CTO, said the partnership delivers the best of both technologies designed for AI's most demanding workloads—from hyperscale data centers to the edge. "With Edge AI accelerating faster than ever, cooling becomes a critical enabler of real-time intelligence,' he said. "Our waterless two-phase direct-to-chip cooling uses a non-conductive, non-corrosive dielectric fluid that instantly removes heat at the source, keeping processors cool even in the most constrained edge environments. Unlike water-based systems, it is 100% IT-safe—even in the unlikely event of a leak, it will not harm hardware. This breakthrough allows operators to deploy AI closer to where data is generated, while maximizing performance per rack, slashing energy costs, and advancing sustainability goals without compromising reliability."

From Innovation to Implementation: Next-Generation Platforms

At Yotta 2025, attendees will see two Compal platforms built with ZutaCore's HyperCool® waterless liquid cooling, proving how advanced cooling translates into real-world gains in density, efficiency, performance and reliability.

• SG720-2A-L2 (7U 8-GPU UBB)
  Designed for next-generation AI acceleration, this system features AMD Instinct™ MI325X GPUs and is ready for the upcoming MI355X. Its 850mm chassis delivers maximum flexibility: it fits seamlessly into today's EIA 19-inch racks—the universal rack size used in nearly every data center—while also supporting ORv3 (Open Rack Version 3) infrastructure, a new open standard from the Open Compute Project backed by Meta and Microsoft that enables hyperscale efficiency and sustainability. Supporting both ensures compatibility with today's environments and future-readiness for tomorrow's. A modular, tool-less design streamlines maintenance and upgrades, while liquid cooling integration enables an impressive PUE (Power Usage Effectiveness) score as low as 1.04–1.1
• SD221-8A-L2 (2U 4-Node Dual Processor)
  Built for high-density computing, this platform redefines efficiency with a 2U4N architecture and waterless two-phase cooling, achieving an industry-leading pPUE (partial Power Usage Effectiveness) of 1.01. pPUE measures efficiency at the rack level, showing how little extra energy is needed beyond the servers themselves. Unlike water-based systems, ZutaCore's cooling uses a non-conductive, non-corrosive dielectric heat transfer fluid that is completely IT-safe, protecting hardware even in the event of a leak. This design minimizes risk, ensures reliability under heavy AI workloads, and combines sustainability with peace of mind.

"PUE and pPUE are the industry's gold standards for energy efficiency," noted Truong. "A perfect score of 1.0 means every watt of power goes into computing, with none wasted on cooling. Reaching values this close to 1.0 is a breakthrough that redefines sustainable, high-performance data center operations."

ZutaCore's Cooling Technology Brings Game-Changing Benefits

ZutaCore's waterless, direct-to-chip liquid cooling, with its exclusive pool boiling technology, represents a fundamental shift from traditional air or single-phase liquid cooling. Instead of moving heat away gradually, it removes it instantly at the source by turning liquid into vapor, keeping processors consistently cool even under the most extreme workloads.

For operators, the impact is immediate:

• Higher performance per rack — Run more AI and HPC workloads in the same footprint.
• Lower energy costs — Drive PUE and pPUE closer to the ideal of 1.0, cutting power bills dramatically.
• Greater reliability — Eliminate risks of condensation, corrosion, or hardware damage.
• Sustainability gains — Reduce both water and electricity use, accelerating ESG progress.

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

With generative AI and LLMs driving increasingly intensive compute demands, enterprises are placing greater emphasis on infrastructure that offers both performance and adaptability. The SG720-2A/OG720-2A emerges as a robust solution, combining high-density GPU integration and flexible liquid cooling options, positioning itself as an ideal platform for next-generation AI training and inference workloads.

Key Technical Highlights:

• Support for up to eight AMD Instinct MI350 Series GPUs (including MI350X / MI355X): Enables scalable, high-density training for LLMs and generative AI applications.
• Dual cooling architecture – Air & Liquid Cooling: Optimized for high thermal density workloads and diverse deployment scenarios, enhancing thermal efficiency and infrastructure flexibility. The two-phase liquid cooling solution, co-developed with ZutaCore®, leverages the ZutaCore® HyperCool® 2-Phase DLC liquid cooling solution, delivering stable and exceptional thermal performance, even in extreme computing environments.
• Advanced architecture & memory configuration: Built on the CDNA 4 architecture with 288GB HBM3E memory and 8TB/s bandwidth, supporting FP6 and FP4 data formats, optimized for AI and HPC applications.
• High-speed interconnect performance: Equipped with PCIe Gen5 and AMD Infinity Fabric™ for multi-GPU orchestration and high-throughput communication, reducing latency and boosting AI inference efficiency.
• Comprehensive support for mainstream open-source AI stacks: Fully compatible with ROCm™, PyTorch, TensorFlow, and more—enabling developers to streamline AI model integration and accelerate time-to-market.
• Rack compatibility & modular design: Supports EIA 19" and ORv3 21" rack standards with modular architecture for simplified upgrades and maintenance in diverse data center environments.

Compal has maintained a long-standing, strategic collaboration with AMD across multiple server platform generations. From high-density GPU design and liquid cooling deployment to open ecosystem integration, both companies continue to co-develop solutions that drive greater efficiency and sustainability in data center operations.

"The future of AI and HPC is not just about speed, it's about intelligent integration and sustainable deployment. Each server we build aims to address real-world technical and operational challenges, not just push hardware specs. SG720-2A/ OG720-2A is a true collaboration with AMD that empowers customers with a stable, high-performance, and scalable compute foundation." said Alan Chang, Vice President of the Infrastructure Solutions Business Group at Compal.

The series made its debut at Advancing AI 2025 and was concurrently showcased at the ISC 2025 in Europe. Through this dual-platform exposure, Compal is further expanding its global visibility and partnership network across the AI and HPC domains, demonstrating a strong commitment to next-generation intelligent computing and international strategic development.

For more information, visit the website: https://www.compalserver.com

AMD, Instinct, ROCm, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com

Discover Compal's flagship server, the SX420-2A and SX224-2A, powered by the industry-leading the NVIDIA RTX PRO™ 6000 Blackwell Server Edition

• The SX420-2A 4U AI Server, making its debut, is engineered on the NVIDIA MGX architecture and optimized for deep AI-HPC applications. It features a flexible rack design that supports both EIA 19 "and ORV3 21" configurations, and it can be configured with up to 8 RTX PRO 6000 Blackwell GPUs—significantly boosting data center compute performance and resource utilization.
• The SX224-2A 2U AI Server, integrates NVIDIA MGX architecture with an AMD x86 platform, offering highly flexible configuration options. It is engineered for future compatibility and optimized for diverse computing workloads—whether AI-HPC or AI-Graphics—allowing for tailored performance adjustments.

RTX PRO™ 6000 Blackwell GPU delivers top-tier performance: equipped with 96GB of ultra-fast GDDR7 memory and featuring a passively cooled thermal design, it ensures stable operation under extreme loads, providing revolutionary acceleration for both agentic and physical AI, as well as for scientific computing, graphics, and video applications. Combining this exceptional GPU performance, the SX420-2A and SX224-2A are undoubtedly one of the most competitive solutions in the industry.

SX220-1N: Scalable AI/HPC and Future-Proof Flexible Computing Platforms

• SX220-1N 2U AI Server is designed for giant-scale AI and HPC applications, featuring the NVIDIA GH200 Grace Hopper™ Superchip and employing NVIDIA NVLink-C2C technology to deliver a coherent memory pool. This enables faster memory speeds and massive bandwidth to tackle large-scale computational tasks.

This comprehensive product lineup not only satisfies the rigorous requirements of diverse data center applications but also heralds a new era in enterprise computing technology. Industry professionals attending GTC 2025 are encouraged to visit Compal's booth (#1809) to explore its latest technological innovations in AI-HPC and high-performance computing.

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information on Compal server, please visit https://www.compalserver.com/

The SG720-2A/OG720-2A 7U AI server not only supports 8x AMD Instinct™ MI325X GPUs —built on the advanced CDNA 3 architecture up to 896GB/s Infinity Fabric™ bandwidth, which achieves a theoretical FP16 performance of approximately 20.9 PFLOPs with sparsity and exceeds 41.8 PFLOPs with sparsity in FP8 computations—but also incorporates total 2TB of high-speed HBM3E memory in the platform with up to 48TB/s of memory bandwidth, delivering unparalleled compute power and ultra-fast data access for large-scale AI inference and data processing. Additionally, it is equipped with the ZutaCore® HyperCool® 2-Phase DLC liquid cooling solution, and the synergistic integration of these technologies elevates the SG720-2A/OG720-2A's performance and operational stability to unprecedented levels.

With an optimized 850mm chassis depth, the SG720-2A/OG720-2A seamlessly integrates into a standard EIA 19" 1-meter-deep rack or Open Rack v3-compatible setup. It enhances power efficiency and simplifies management with front-facing, hot-pluggable I/Os, making it a scalable and high-performance solution for data centers.

Its modular architecture facilitates straightforward maintenance and upgrades, with independent component replacement that minimizes downtime, while hot-swappable PCIe slots offer the crucial advantage of minimizing downtime and maximizing efficiency by allowing for network card replacement or upgrades without shutting down the entire system.

Compal recently conducted an experiment to evaluate the efficiency of direct-to-chip liquid cooling methods, revealing that ZutaCore's HyperCool technology achieved an impressively low partial Power Usage Effectiveness (pPUE) of 1.01. In comparative testing against single-phase liquid cooling, HyperCool consistently outperformed across all test conditions with 5% lower pPUE, demonstrating its superior efficiency and effectiveness in optimizing thermal management. This benchmark cements HyperCool as a game-changing solution for sustainable, high-performance data centers.

At CloudFest 2025, Compal, in partnership with ZutaCore®, showcases cutting-edge core technologies and solutions for the data centers of the future. In addition to showcasing the all-new SG720-2A/OG720-2A, other leading-edge server technologies are also on display. Interested visitors are warmly invited to visit the exhibit and explore the latest advancements in AI and HPC technologies.

CloudFest 2025 – Compal Booth
Dates: March 17–20, 2025
Location: Europa-Park, Germany
Booth Number: R07

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information on Compal server, please visit https://www.compalserver.com/

At this highly anticipated event, Compal will unveil several high-performance GPU servers focused on optimizing AI training, accelerating data center operations, and supporting large-scale HPC applications. Attendees will have the opportunity to preview GPU servers based on the NVIDIA MGX architecture, along with other high-density computing solutions designed for next-generation computing environments. In addition, Compal has already started shipping servers equipped with the NVIDIA GH200 Grace Hopper™ Superchip, with expectations for larger shipment volumes in the future, reflecting strong market demand and confidence.

Compal stated "GTC 2025 is the ideal platform to showcase our latest AI-HPC innovations, and we are honored to collaborate with industry-leading partners, including power solutions expert AcBel Polytech Inc., chassis leader Chenbro, software development pioneer Infinitix, globally renowned memory manufacturer Samsung Electronics, and ZutaCore®, a leader in zero-emissions data center cooling with HyperCool® technology." Additionally, Compal's partners will present keynote speeches at the Compal booth, sharing insights into cutting-edge technologies and innovative solutions, as well as exploring future trends in high-performance computing.

Expanding AI and 5G Integration

Leveraging its deep expertise in 5G RF, PHY layer, and Open Radio Access Network (O-RAN), Compal continues to innovate in wireless communication technology. Recently, Compal launched the AI server SX220-1N, which integrates NVIDIA Aerial with 5G base stations to create an AI RAN solution. By utilizing AI technology, this solution enhances network intelligence and efficiency, enabling cognitive automated testing for 5G systems, improving spectrum utilization, and expanding coverage, ultimately reducing operational costs.

As AI applications continue to drive industry transformation, Compal is dedicated to building cutting-edge GPU server architectures to help businesses efficiently handle compute-intensive workloads. Attendees at GTC 2025 will have the opportunity to explore Compal's latest breakthroughs and gain insights into next-generation AI infrastructure.

In addition to debuting at GTC 2025, Compal will also showcase its advanced GPU servers at the CloudFest event in Europe, highlighting its global innovation in AI and HPC solutions. For European audiences who are unable to attend GTC 2025, CloudFest offers an alternative opportunity to explore Compal's latest AI and HPC server technologies.

About Compal

Founded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2024, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 6 manufacturers and has consistently ranked among the Forbes Global 2000 and Fortune Global 500 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information on Compal server, please visit https://www.compalserver.com/

Official U.S. Launch of the Hestia NTN IoT Dongle

APAL, a global enterprise and IoT solutions provider, will officially announce the U.S. launch of the Hestia NTN IoT Dongle, which will be available on Amazon. This expansion underscores APAL's commitment to delivering innovative connectivity solutions for mobile assets and IoT applications.

Product Highlights: Redefining IoT Connectivity

The Hestia NTN IoT Dongle seamlessly integrates satellite communications with terrestrial networks, supporting 3GPP NTN IOT with satellite two-way communication, and terrestrial network such as: LoRaWAN, WI-SUN FAN and BLE MESH and extended connectivity. This ensures uninterrupted connectivity even in areas without traditional mobile network coverage.

Key Advantages:

1. Global Seamless Coverage: Ideal for remote environments such as oceans, deserts, and mountainous regions.
2. Two-Way Communication: Supports satellite uplink and downlink for remote device control.
3. Ultra-Low Power Consumption: Designed for long-term standby, meeting outdoor deployment needs.
4. Plug-and-Play: Built-in Modbus RS485 interface ensures compatibility with industrial and IoT devices without complex configurations.

APAL states: "The launch of Hestia marks the beginning of an 'always-connected' IoT era. Whether for agricultural monitoring, cross-border logistics, or emergency communications, we provide reliable and cost-effective solutions."

Strategic Collaboration: The Future of Smart Energy Management

APAL also announced a strategic partnership with Creative5, Inc. to jointly enter the rapidly growing Satellite IoT market. The companies will leverage their technological strengths to develop smart energy management solutions for remote areas, including applications in UAVs, Unmanned Surface Vehicles (USVs), and other future technologies.

The collaboration will focus on energy-intensive scenarios, integrating LoRaWAN with NTN communications for applications such as satellite-enabled smart meters, agricultural and fishery monitoring, and disaster response. By enabling real-time data transmission and efficient energy management, this initiative aims to enhance operational efficiency and reduce costs.

U.S. Launch on Amazon

To accelerate market expansion, the Hestia NTN IoT Dongle will be available for purchase on Amazon starting March 2025. The initial launch will feature the standard NTN version, followed by NTN+LoRaWAN, WI-SUN FAN and BLE MESH variants. Enterprise customers can also customize solutions via the APAL website, with value-added services such as data analytics software integration.

Satellite 2025: A Grand Showcase in Washington, D.C.

Compal will debut innovative Satellite Solutions and Hestia Dongle at Satellite 2025 in Washington, D.C., from March 10-13 (Booth #2353), demonstrating:

1. Smart Agriculture: Integrating satellite communications with drones to collect field sensor data via LoRaWAN for precision irrigation.
2. Emergency Rescue: Deploying emergency communication stations in remote areas for real-time first-response alerts.
3. Energy Management: Utilizing smart meters and energy management platforms to enhance renewable energy efficiency and cost savings.
4. Transport Tracking: Enabling real-time tracking of intercontinental shipping containers, solving the "last-mile" data gap in logistics.

Visit Compal and APAL at Booth #2353 to explore the future of satellite-enabled IoT connectivity.

About Compal

Established in 1984, COMPAL has grown to the worldwide leading computer and smart devices manufacturer, which is ranked as a Taiwan Top 6 large scale manufacturer and a Global Fortune 500 company. COMPAL invests in product diversification for years and starts its 5G technologies business since 2018. It offers wild solutions and complete portfolio, including 5G O-RAN, 5G small cells, 5G wireless modules as well as 5G smart wearable devices, satellite user terminal equipment and IoT solutions. With a comprehensive product portfolio that covers various domains, COMPAL is steadily advancing its leadership position in the field of 5G applications. More information: https://www.compal.com/5g/

About APAL

Established in 2019, with the advanced R&D/manufacturing of Compal and vertical integration capabilities in global distribution of Palcom, APAL provides enterprise customers one-stop services, and optimize processes such as workflow, manufacturing, and design. This enables us to fulfill the needs of different vertical applications in the field of telecommunication and IoT. More information: https://www.apaltec.com/hestia/