SHANGHAI and SHENZHEN, China, June 26, 2026 /PRNewswire/ -- Held from June 24 to 26, the 13th MWC Shanghai 2026 opens its doors. TWSC showcases its full lineup of self-developed storage products, delivering robust support for efficient data flow and stable operation across diverse scenarios including end devices, computing centers and industrial communications, and advancing the integrated development of communications and AI as well as industrial digital transformation.

I. Terminal & Edge AI: High-speed, Low-power Local Storage Solutions

TWSC exhibits embedded storage products including UFS, LPDDR and eMMC. QLC UFS 2.2 (128GB–512GB) is designed for tablets and high-capacity smart terminals. QLC eMMC (128GB–512GB) adopts self-developed LDPC algorithms and intelligent wear-leveling firmware to boost read-write stability, suitable for lightweight AIoT devices such as smart home appliances. For AI PCs and gaming desktops, the brand also launches PCIe 5.0 SSD (available in DRAM and DRAM-less versions) paired with DDR4 and DDR5 memory to flexibly meet varying performance, capacity and cost requirements of different terminals.

II. Enterprise-grade Storage for AI Computing & Data Centers: Handling High-concurrency Data Processing

Complete enterprise storage solutions are offered for high-load computing scenarios such as servers and cloud computing. The TE5133 PCIe 5.0 SSD adopts domestically developed controllers and the NVMe 1.4 protocol, equipped with enterprise-grade features including power-loss protection, atomic write and multi-stream scheduling. The TS3160 SATA SSD covers capacities from 240GB to 3.84TB, delivering sequential read/write speeds of 540/510MB/s and random performance up to 99K/45K IOPS for server system disks and business data storage. DDR5 RDIMM reaches a maximum speed of 6400MT/s, combining dual ECC error correction and signal anti-interference design to satisfy real-time caching and concurrent computing demands of computing clusters.

III. Industrial Intelligent Network Communication Storage: Ensuring Long-term Stable Equipment Operation

Wide-temperature and high-durability industrial storage solutions are rolled out for round-the-clock running switches, base stations and gateways. The PNM4300 industrial DDR (8GB–32GB) supports wide-temperature operation with LDPC error correction. The NS1300 mSATA SSD adopts an 8GB–32GB pSLC architecture, operating reliably between -40℃ and 85℃ with built-in LDPC correction and PLP power-loss protection, perfect for continuous write tasks such as base station log recording and edge device storage.

IV. Integrated Full-stack Self-development, Custom R&D and Large-scale Intelligent Manufacturing Delivery

With integrated in-house R&D capabilities spanning controllers, firmware and modules, TWSC provides customized adaptation and reliability verification to match communication equipment's unique demands on interfaces, capacity, temperature range and write endurance. Two intelligent manufacturing bases in Futian and Guangming form a complete system for mass production, testing and delivery, covering the whole process from prototype validation to large-scale deployment for customers.

TWSC keeps refining its full-stack AI-plus-storage capabilities to supply more reliable storage infrastructure for the communications industry.

TAIPEI, June 3, 2026 /PRNewswire/ -- COMPUTEX 2026 opened in Taipei on June 2 under the theme "AI Together". TWSC showcased its full-stack AI storage solutions to demonstrate systematic storage competence covering data centers, smart terminals and various IoT use cases.

For data center and enterprise-grade AI, TWSC underpins its technology with self-developed H3361 dual-mode enterprise SSD controller and delivers an all-in-one enterprise storage lineup including TE5133 PCIe SSD, TS3160 SATA SSD and DDR5 RDIMM modules, catering to AI compute clusters with high-concurrency access and low-latency storage performance.

For smart terminals and personal computing, its PCIe 5.0 SSD comes in DRAM-cached and DRAM-less variants for high-end gadgets and power-efficient thin devices respectively. DDR5 U/SO-DIMM memory modules equipped with PMIC and On-die ECC also support optional CKD configuration to boost multitasking efficiency and operational stability.

For embedded and edge hardware, TWSC's first mass-produced QLC NAND UFS ranges from 128GB to 1TB, delivering cost-effective and dependable storage for AI-enabled endpoints.

For mobile office, video backup and consumer electronics scenarios, TWSC supplies flexible customized solutions including PSSD, mUDP, UDP and PCBA.

Leveraging coordinated smart manufacturing bases in Futian and Guangming, TWSC integrates large-scale shipment with advanced product validation to drive widespread commercialization of AI across diverse sectors via comprehensive storage technologies.

SHENZHEN, China, May 13, 2026 /PRNewswire/ -- The official launch ceremony of TWSC Guangming Intelligent Manufacturing Base was successfully held at Guangming Science City, Shenzhen.

Strategic Positioning: A High-End Storage Manufacturing and Validation Platform for the AI Era

Driven by surging demand from AI applications, storage solutions are evolving from general-purpose hardware toward mission-critical AI infrastructure, requiring superior throughput, ultra-low latency and continuous operational stability.

As a pivotal high-end storage manufacturing initiative for the AI era, TWSC Guangming Intelligent Manufacturing Base serves as the company's high-end manufacturing and test & validation center. Focused on enterprise-grade and embedded storage products, the base aims to build a world-class intelligent manufacturing platform for high-end storage in China. Its official launch marks a critical milestone in TWSC's strategic upgrade of high-end manufacturing capabilities.

Upon full ramp-up, the base will deliver an integrated high-end manufacturing system covering intelligent production, test & validation and large-scale delivery. It will support mass production and comprehensive testing of enterprise-grade SSDs, RDIMMs and embedded storage products, further strengthening high-reliability validation and scalable manufacturing capacity.

Core Advantages: AGV+MES-Driven Unmanned End-to-End Production Line, Upgrading TWSC's SMT Intelligent Manufacturing

End-to-End Automated Manufacturing System

To ensure high-quality introduction and scalable delivery of high-performance storage products, the Guangming Base has deployed an industry-leading intelligent SMT manufacturing system. It adopts large-scale AGV intelligent logistics to realize fully unmanned material flow across production, inspection and logistics processes.

Data-Driven Intelligent Lean Manufacturing

Powered by MES system, intelligent dispatch center and end-to-end data management platform, the base enables digital collaboration and full traceability in manufacturing, testing, quality assurance and fulfillment. This significantly improves production efficiency, product consistency and cross-functional operational synergy.

Advanced Validation: High-Reliability Testing Capabilities for Leading Mainstream Platforms

Catering to AI servers, data centers and intelligent terminals, the Guangming Intelligent Manufacturing Base has established a robust high-reliability test and validation system to meet demands for efficient, stable and secure storage performance.

On one hand, the base features a comprehensive validation cluster equipped with hundreds of high-performance servers and a one-stop enterprise-grade storage test line, delivering high-stress validation capabilities for AI servers and data centers. It also provides a dedicated embedded validation platform supporting DDR die testing and validation of eMMC, UFS, LPDDR and other embedded storage products, enhancing compatibility and stability verification across multiple protocols and platforms.

On the other hand, TWSC is actively building a comprehensive AI storage technology laboratory focused on proprietary firmware development. This ensures reliable product operation in AI large model and data center scenarios, while continuously improving validation efficiency and scenario adaptability.

Currently, TWSC has two intelligent manufacturing bases with a total area of over 40,000 square meters, further consolidating its end-to-end capabilities spanning R&D, intelligent manufacturing and large-scale delivery. The company will continue to enhance high-end storage manufacturing efficiency and global customer service, accelerating the deployment of full-stack AI storage solutions.

SHENZHEN, China, April 15, 2026 /PRNewswire/ -- The Global Sources Electronics Fair was successfully held in Hong Kong, spotlighting industry-wide technology trends driven by AI applications. TWSC, under the theme "Full-Stack AI + Storage Solutions," focused on enabling diverse consumer electronics scenarios. By advancing storage technologies and enhancing scenario-level synergy, the company aims to better align storage solutions with a wide range of end-device requirements.

I. Storage Solutions for Multi-Scenario Applications

As AI continues to proliferate in end-user devices, consumer electronics are shifting from generic configurations to application-specific combinations. High-performance and high-spec products are accelerating their market adoption, driving up the total value of end devices.

Storage, as a foundational component, must not only accommodate the growing bandwidth and capacity demands brought by local inference and multitasking workloads but also help optimize system configurations and balance costs amid fluctuating raw material prices. As a result, storage has become a critical factor affecting the end-user experience.

AI PCs & High-Performance End Devices

With the gradual deployment of local inference and large language models, AI model execution is increasingly constrained by terminal DRAM capacity. Dynamic scheduling between DRAM and SSD is becoming common, transforming storage from a passive data repository into an active participant in system-level data orchestration.

To address such scenarios, TWSC offers M.2 SSD products covering PCIe 5.0/4.0/3.0 interfaces, paired with DDR5 U/SO-DIMM memory modules. The PCIe 5.0 SSD delivers read speeds up to 14 GB/s, while DDR5 memory supports speeds up to 7200 MT/s, enabling balanced bandwidth and capacity to efficiently support model loading and data processing. Intelligent data management and cache optimization strategies further improve system responsiveness and operational stability.

Smart Wearables & Embedded Devices

As AI functions expand into more terminal devices and smart home ecosystems grow, there is increasing demand for local processing power and real-time responsiveness.

For emerging embedded applications such as smart wearables, action cameras, and outdoor electronic devices, TWSC provides embedded storage solutions including eMMC, UFS, and LPDDR4X/5X. Designed with low power consumption and high integration, these solutions address constraints of form factor, energy efficiency, and reliability, ensuring sustained operation even in challenging environments.

II. CUSU: A Consumer-Facing Portfolio of Multi-Form-Factor Products

CUSU, the consumer storage sub-brand under TWSC, leverages the company's full-stack capabilities spanning controller ICs, firmware algorithms, and scenario-specific tuning. Targeting e-sports gamers, content creators, and general consumers, CUSU offers a diverse product lineup including SSDs, memory modules, and portable storage. With a global sales network covering online and offline channels across multiple countries and regions, and supported by a stable supply chain and channel enablement system, CUSU addresses varying user needs for performance, capacity, and convenience, further expanding the boundaries of consumer electronics applications.

As AI continues to take root in consumer electronics, application scenarios are becoming increasingly diverse, making storage a pivotal element in the end-user experience. TWSC remains committed to leveraging its full-stack storage capabilities to flexibly address the evolving needs of multi-scenario consumer electronics, making every data read and write faster and more reliable.

SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.

Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.

As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.

Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.

AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.

TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.

Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.

Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.

Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.

TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.

High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.

TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.

Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.

DUBAI, UAE, Oct. 14, 2025 /PRNewswire/ -- The global tech event GITEX GLOBAL 2025 opened at the Dubai World Trade Centre. TWSC presented its full-stack customized consumer storage products and solutions, leveraging innovative storage technologies to empower AI and high-performance computing, accelerate global expansion, and support the growth of the AI ecosystem.

AI Drives New Opportunities in the Middle East

Driven by the global wave of AI-powered digitalization, consumer electronics have become a key growth engine for the storage market. Leveraging its strategic location connecting Asia, Europe, and Africa, along with supportive national policies, the Middle East is rapidly emerging as a hub for technology investment. This presents Chinese storage companies with important opportunities for technology export and supply chain collaboration. TWSC is using GITEX as a platform to deepen its regional presence, advancing its transition from "going global" to "integrating locally."

Full-Stack Smart Storage Solutions for Diverse Scenarios

Targeting AI devices and creative applications, TWSC showcased three major categories of consumer storage products:

• Solid-State Drives (SSD): Supporting PCIe 4.0/5.0 standards, with read speeds up to 12,000MB/s and capacities up to 4TB, featuring intelligent thermal control and high-temperature stability.
• DDR5 Memory Modules: Offering capacities up to 96GB, supporting one-click overclocking beyond 10,000MHz, significantly enhancing gaming and AI multitasking performance.
• Mobile Storage Series: PSSD and MicroSD products with high-speed transmission, shock resistance, and heat tolerance, suitable for drones and action cameras.

Localization and Collaboration for Industrial Synergy

As part of its globalization strategy, TWSC is evolving from "product export" to "ecosystem integration." Leveraging its intelligent manufacturing base and R&D centers, the company is building localized channels and service networks to provide fast, customized, and one-stop support for regional customers. At the same time, TWSC is deepening cooperation with local partners in areas such as firmware customization and technical certification, driving coordinated and mutually  beneficial growth across the regional supply chain.

Looking ahead

TWSC will continue to leverage its end-to-end technological strengths in "Chip & Firmware & Scenario" to expand its global footprint and deliver high-performance, customized storage solutions for the AI era.

SHENZHEN, China, Sept. 29, 2025 /PRNewswire/ -- The Indonesia Global Sources Exhibition was held successfully in Jakarta, where TWSC, a global provider of storage solutions, made its debut appearance. TWSC showcased a range of new consumer storage products tailored for Southeast Asian customers, highlighting its portfolio of fully customized SSDs, DDR memory, and mobile storage devices. The showcase underscored TWSC's innovation capabilities and market strategy in line with the growing trends of AI and intelligent applications.

New Consumer Products to Meet Diverse Application Scenarios

At the exhibition, TWSC unveiled multiple new products designed for everyday entertainment, mobile office use, and professional content creation. The lineup included high-performance PCIe 5.0 SSDs, DDR5 modules, ultra-high-capacity microSD cards, and high-speed portable PSSDs. By enhancing capacity, speed, and reliability, these products are well-suited to diverse consumer electronics applications, addressing users' increasing demands for faster data transfer and larger storage.

End-to-End Customization for Differentiated Delivery

With Southeast Asia's rising demand for consumer electronics and storage ,TWSC leverages its self-developed controller chips, intelligent manufacturing system, and global supply chain resources to build a "Chip + Algorithm + Scenario" full-stack capability. This enables TWSC to deliver differentiated and customized storage solutions tailored to various industries and customer requirements, creating greater flexibility and value in storage applications.

Looking Ahead

TWSC will continue accelerating its overseas market expansion. Through technological innovation and localized services, the company is committed to delivering scenario-based storage experiences that are flexible and adaptive to the needs of regional customers.

SHENZHEN, China, Sept. 22, 2025 /PRNewswire/ -- The rapid evolution of artificial intelligence is accelerating the upgrade of computing infrastructure. As a core hardware component, storage is undergoing comprehensive improvements in both capacity and performance. Leveraging its full-stack self-developed technology and systematic product roadmap, TWSC is actively expanding into the enterprise storage sector, delivering innovative solutions for high-value scenarios such as AI servers and data centers, and driving breakthroughs for domestic storage in critical fields.

AI Servers and Data Centers Drive Storage Upgrades as Localization Opportunities Emerge

The explosive growth of AI and related technologies has created surging demand for training and inference data, propelling high-performance SSDs to become a core storage configuration in data centers and AI servers. With their high bandwidth and low latency, SSDs can significantly enhance data processing efficiency.

According to IDC, the Chinese enterprise SSD market reached USD 6.25 billion in 2024, a year-on-year increase of 187.9%, and is expected to exceed USD 9.1 billion by 2029. Meanwhile, international vendors still hold over 65% market share, leaving a rapidly opening window for domestic alternatives.

Since 2023, TWSC has been building its enterprise storage business, establishing five R&D centers in Shenzhen, Hangzhou, Chengdu, Beijing, and Changsha. The company has assembled specialized teams in chip design, firmware development, and hardware engineering, while also strengthening product testing and mass production capabilities. TWSC is committed to addressing the full spectrum of enterprise SSD technologies, deeply aligning with the requirements of AI computing and data center infrastructure. From product R&D to large-scale delivery, TWSC continuously enhances its full-stack capabilities, offering industry-leading manufacturing capacity and quality assurance.

Full-Stack Self-Developed Technology to Build High-Performance Enterprise Storage Solutions

Enterprise storage demands high performance, low latency, high reliability, and strong stability. As one of the few domestic companies with end-to-end self-developed capabilities spanning controller chips, firmware algorithms, hardware design, and manufacturing, TWSC leverages its robust enterprise R&D and testing teams to deliver complete enterprise storage solutions. These include PCIe/SATA SSDs and RDIMM memory modules, developed through systematic hardware engineering, innovative firmware optimization, and in-depth media application research.

Joint Validation with Key Customers to ensure stable integration

TWSC has built one of China's leading enterprise R&D and testing laboratories, equipped with advanced tools such as PCIe Gen5 protocol analyzers, high-speed logic analyzers, and PCIe Gen5 high-performance thermal chambers. The lab operates with over 1,000 servers covering mainstream CPUs and server platforms worldwide. TWSC has also established joint reliability testing labs, covering everything from component-level validation to full-system compatibility testing.

Through multi-platform customization and validation, TWSC products deliver both performance and reliability in AI and data center environments. The company has successfully entered the core supply chains of leading cloud providers, achieving stable large-scale shipments.

"5+2+N" Global Supply Chain Strategy to Ensure Efficient Delivery

TWSC integrates "R&D & Products + Manufacturing + Delivery" under its "5+2+N" global supply chain framework, combining five R&D centers with two smart manufacturing bases to advance industrial collaboration and resource integration.

To further strengthen production and delivery, TWSC has increased its investment in the "PCIe SSD Controller and Module Project" from 499 million yuan to 743 million yuan, adding a new facility in Guangming District, Shenzhen as a core in-house capacity supplement. Moving forward, TWSC will rely on its dual smart manufacturing bases in Futian and Guangming District to integrate validation capabilities and laboratory resources, forming a full-chain guarantee from R&D to mass production. This will enhance the rapid responsiveness of AI storage products and better meet market demand for high-quality, reliable, and customized storage solutions, reinforcing TWSC 's ability to deliver enterprise storage products with stable, high standards.

Looking Ahead

TWSC will continue to strengthen its full-stack enterprise storage technology, fully supporting AI computing and data center development. By advancing large-scale deployment of domestic high-end storage, TWSC is committed to enabling greater self-sufficiency and high-quality growth in China's storage industry.

TAIPEI, May 23, 2025 /PRNewswire/ -- From May 20 to 23, 2025, TWSC made its debut at COMPUTEX 2025, one of the world's leading technology exhibitions, under the theme "Transcending Intelligence, Ascending Full-Stack Solutions." The company showcased a full range of storage products and solutions designed to support next-generation AI and computing applications.

As AI adoption accelerates, storage technology is becoming more scenario-driven. TWSC provides tailored "One Solution for One Scenario" services based on its full-chain capabilities in chips, algorithms, and application scenarios, accurately addressing the diverse needs of smart terminals, industrial control, servers, and other fields.

Full-Stack Storage Matrix Unleashes Efficiency

TWSC highlighted high-throughput, low-latency solutions at the event, including PCIe 5.0 SSDs, DDR5, eMMC, UFS, and LPDDR series. Combining performance and efficiency, these products enable AI inference and edge computing applications.

According to TWSC's 2024 annual report, the company reported revenue of RMB 4.773 billion, a 168.74% increase year-over-year. Embedded storage sales reached RMB 843 million, rising by 1730.6%, while high-speed PCIe SSD sales grew 979%, becoming a major growth driver.

The company now offers scenario-based solutions across enterprise, embedded, consumer, and industrial applications, building a strong foundation for global growth through advanced storage modules.

Full-Stack Self-Developed Capabilities Build Competitive Edge

To enhance control over the industrial chain, TWSC has developed an integrated "wafer-to-product" scenario-based service capability, enabling differentiation through media analysis, chip design, firmware optimization, and packaging control.

TWSC uses its "5+1+N" global supply chain network to ensure smooth coordination across R&D, production, and delivery. With a robust validation system and adaptive quality control, the company aligns product quality closely with customer needs.

From chips to scenarios, and data to value — TWSC's participation highlights the shift of storage technology from basic functions to intelligent services. By integrating industrial resources and expanding application scenarios, the company is building an open and collaborative innovation ecosystem for smart storage.

About TWSC: Shenzhen Techwinsemi Technology Co., Ltd. (Stock Code: 001309.SZ) was established in 2008 and specializes in integrated circuit solutions for storage controllers and modules. The product line covers four major series: SSD, embedded storage, DDR, and portable storage — offering reliable storage solutions for high-value applications such as smart terminals, data centers.

For more information please visit https://en.twsc.com.cn/, and follow TWSC on Facebook and Linkedin.

HONG KONG, April 14, 2025 /PRNewswire/ -- On April 11, 2025, TWSC showcases full-stack customization capabilities at Global Sources Consumer Electronics Show, highlighting AI PC and QLC NAND flash memory innovations to enhance data value through tech advancements.

Optimized Performance & Tech Upgrades for High-Load Scenarios

Addressing core storage upgrade needs in capacity, speed, and reliability, TWSC showcased high-performance PCIe 4.0 SSD, TB-scale micro SD card and high-speed portable storage for demanding scenarios. Its sub-brand CUSU K5 PSSD secured the Best Product Design Awards during the event.

Full-Stack Customization Meets Diverse Scenario Demands

TWSC builds a vertically integrated ecosystem from controller chip design to product delivery through consolidated R&D, smart manufacturing, and supply chain resources. Its "One Scenario, One Solution" framework enables scenario-specific storage optimization across smart devices, industrial controls, and servers, transitioning services from standardization to tailored solutions for multi-industry applications.

April 24-26: TWSC will debut scenario-driven innovations at Global Sourcing Fair VIETNAM. Stay tuned for more breakthroughs!

About TWSC

Shenzhen Techwinsemi Technology Co., Ltd. (Stock Code: 001309) is a national high-tech enterprise and major "Little Giant" enterprise, specializing in special new technologies and focusing on the innovative research and development of storage controller and module solutions. The products line covers four major series: SSD, embedded storage, DDR and portable storage, which have been widely applied in various application scenarios such as data centers, NEV, mobile phones, tablets and security cameras.

For more information please visit https://www.twsc.com.cn, and follow TWSC on Facebook and Linkedin.