TAIPEI, Sept. 16, 2026 /PRNewswire/ -- As AI PCs, high-performance computing, high-refresh-rate gaming, professional AV, commercial displays, and immersive applications continue to evolve, global AV transmission technology is moving toward a new generation of higher bandwidth, higher resolution, and higher refresh rates.

Wieson Technologies announced that its independently developed WIESON Ultra96 Cable 2-meter has successfully completed testing and certification procedures with the HDMI Forum Authorized Testing Centers (ATC), officially obtaining HDMI^® Ultra96 Cable certification, with the product model AB9856-40113020-00. This achievement marks an important technical and certification milestone for Wieson Technologies' HDMI^® 2.2 Ultra96 Cable product, further establishing its position in the 96Gbps next-generation high-speed AV transmission product portfolio.

The product testing was conducted by UL Solutions, an HDMI Forum Authorized Testing Centers (ATC). Through UL Solutions' high-speed transmission product testing and verification services, Wieson Technologies completed the relevant certification process, demonstrating the company's technical capabilities in high-speed cable design, signal integrity, and product quality control.

HDMI^® 2.2 represents an important development milestone in HDMI technology. Compared to the HDMI 2.1-era Ultra High Speed HDMI^® Cable's maximum bandwidth of 48Gbps, the new-generation Ultra96 HDMI^® Cable supports a maximum bandwidth of 96Gbps, providing new transmission capabilities for higher-resolution, higher-refresh-rate, and high-bandwidth AV applications.

HDMI^® 2.2 also introduces the Latency Indication Protocol (LIP), helping to improve AV synchronization requirements in multi-device configurations environments; the Ultra96 HDMI^® Cable provides the HDMI 2.2 ecosystem with a cable solution supporting up to 96Gbps of bandwidth.

According to HDMI^® requirements, both Ultra96 HDMI^® Cable and Ultra High Speed HDMI^® Cable are covered under the Ultra HDMI Cable Certification Program. Different cable constructions and cable lengths are required to undergo the applicable testing and certification procedures.

Wieson Technologies has long specialized in high-speed connector and high-speed cable technology, continuously investing in high-frequency materials, signal integrity, impedance control, connector design, and high-speed product testing capabilities. The successful certification of the 2-meter Ultra96 Cable further validates Wieson's technical capability in developing next-generation high-speed AV transmission products.

For related products, please visit Wieson Technologies' official website: https://www.wieson.com/Ultra96HDMlCable

TAIPEI, Sept. 3, 2026 /PRNewswire/ -- As embodied AI, artificial intelligence (AI), and smart manufacturing continue to advance, collaborative robots are being adopted at an accelerating pace across new energy, electronics manufacturing, automotive, and industrial automation applications, driving a corresponding rise in demand for highly reliable connectors, flexible cables, and durable interconnect solutions.

Wieson Technology Co., Ltd. and Guangdong Huayan Robotics Co., Ltd. today announced the formal signing of a strategic cooperation Memorandum of Understanding (MOU). The two companies will combine Wieson Technology's technical and supply chain capabilities in connectors, flexible cables, and custom R&D/manufacturing with Guangdong Huayan Robotics' strengths in complete collaborative robot systems, application scenarios, and market development, establishing a cooperation model of "Early-Stage Custom Development + Joint Validation + Market Synergy," working together to bring embodied AI and smart manufacturing applications to market.

Three Key Areas of Cooperation: From Technology Development to Market Deployment

Centered on real-world robotics application needs, the two companies will deepen cooperation in the following three areas:

• Early-Stage Custom Development:Huayan provides complete-robot requirements and application scenarios, and Wieson engages early in product development, customizing highly reliable connectors, flexible cables, and related interconnect solutions based on each robot's spatial configuration, motion characteristics, and operating environment.
  
  
• Joint Validation: The two companies will share real-machine testing environments and technical resources, jointly validating flex durability, reliability, and real-world operating requirements to improve integration efficiency between components and the complete robot system.
  
  
• Market Synergy:Huayan will draw on its industry customer resources in new energy, smart manufacturing, and related sectors, while Wieson will leverage its global customer base and manufacturing footprint, jointly driving robots and related component solutions into a wider range of application markets.

Integrating Complete-Robot Applications with High-Reliability Interconnects: WIESON Partners with Huayan to Enter the AI Robotics Market

GN Wang, Chairman of Guangdong Huayan Robotics, stated:

"Collaborative robots continue to evolve toward higher sensitivity, greater degrees of freedom, and more complex application scenarios, placing higher demands on component flexibility, reliability, and customization. Wieson Technology's R&D and manufacturing capabilities in connectors and flexible cables allow it to participate early in robot product design and validation. Through this partnership, the two companies will further integrate complete-robot applications with component technology, accelerating the deployment of embodied AI and smart manufacturing applications."

Jeff Chen, Chairman of Wieson Technology, stated:

"Embodied AI and AI robotics represent an important direction for the next stage of smart manufacturing. Wieson will leverage its R&D and manufacturing strengths in highly reliable connectors, flexible cables, and complete interconnect solutions, combining early-stage custom development with integrated market resources to jointly expand, together with Huayan, into emerging markets such as AI robotics, new energy, and industrial automation."

Working Together to Expand the Next-Generation Smart Manufacturing Market

Looking ahead, Wieson Technology and Guangdong Huayan Robotics will continue to deepen their cooperation, focusing on embodied AI, AI robotics, smart manufacturing, new energy, and industrial automation, and driving collaboration that spans component technology development, complete-machine validation, and market deployment to accelerate the commercialization of related products and solutions.

Regarding the changes in revenue and profit in the first half, the automotive segment was mainly affected by the decline in mainland China's domestic auto sales market, while the smart electronics segment was mainly affected by memory chips being concentrated in AI applications and prices surging several-fold, leading customers to reduce order demand for the company's smart electronic components in order to control costs, as well as customers delaying pull-in due to chip supply shortages. Despite facing external environmental challenges, the company maintained gross margin above 20% through cost control and product mix optimization, laying a solid foundation for operations and technology development in the second half of the year.

For the second half of 2026, as AI technology gradually expands from cloud computing to physical application endpoints, the global robotics market and AI server demand are entering a phase of technological upgrading. Wieson Technologies will increase R&D investment in three main new business areas — robotics, thermal transfer, and high-frequency high-speed — raising R&D expenses to approximately 7% of revenue, to advance product deployment and technology upgrades.

Robotics Market: Integrating Four Key Technologies As industrial automation deepens, AI, autonomous mobile, and humanoid robots are gradually moving from R&D validation into factories, logistics, and service settings, driving related components toward higher reliability, high-speed transmission, high power, and greater integration. Wieson Technologies will position itself around "Connection × Data × Power × Thermal" as its core, focusing on key applications such as robotic joints, motor drives, sensors, controllers, machine vision, and edge AI computing. The company will strengthen its signal, power, and communication connection solutions, and extend its high-speed data transmission and thermal management technologies to meet the needs of next-generation robots for real-time computing, precise control, and long-term stable operation. By integrating these four core technology capabilities, Wieson plans to move from being a single-component supplier toward becoming an integrated solutions provider, continuing to expand into the industrial robot, mobile robot, and humanoid robot markets.

Advanced Thermal Transfer Business Unit: Developing Diverse AI Thermal Management Solutions Currently, high-bandwidth memory (HBM) for AI servers consumes a large amount of wafer capacity, and memory suppliers have shifted their focus toward enterprise-grade products, resulting in a structural shortage of consumer-grade GDDR memory, which in turn affects PC and notebook shipments and raises PC costs. In response to these market changes, Wieson's Thermal Transfer Business Unit continues to advance technology development. For the LGA9324 series CPUs to be launched by Intel and the SP8 series CPUs to be launched by AMD in the fourth quarter of 2026, Wieson has completed testing and validation of the corresponding server CPU thermal module thermal management solutions. In addition, to address the thermal management needs of GPUs or ASICs in PCIe and OAM architectures for AI computing power, the R&D team provides customized thermal simulation analysis and develops both active and passive thermal modules. To meet the thermal management target of up to 800W for next-generation consumer graphics cards, Wieson has also developed air-cooling and AIO liquid-cooling modules (WATERCOOLER), offering customers a diverse range of cooling options.

High-Speed Transmission Business Unit: Developing High-Speed and High-Reliability Applications Wieson continues to invest in the development of high-frequency, high-speed products and the upgrading of automated production processes for the Server, Storage, IPC, and HPC markets. To further upgrade its high-speed transmission connector analysis and manufacturing technologies, the company has invested in a 67G high-frequency network analyzer and automated test equipment to meet customers' stringent requirements for signal stability and data transmission speed across different application environments, providing high-stability, low-loss product options and helping customers smoothly develop and mass-produce next-generation products.

Overall, Wieson Technologies will maintain stable financial operations and continued investment in R&D resources. By integrating connections, data, power, and thermal technologies, the company will continue to monitor market demand and provide technology solutions aligned with the development trends of AI and smart manufacturing, striving to meet global customers' product development and application needs in the second half of the year.

To seize the growth opportunity in the AI Vision market, Wieson Technologies Co., Ltd. and South Korean high-speed interface IC design company Sugars Co., Ltd. have officially signed a strategic Memorandum of Understanding (MOU). The two companies will combine Sugars' R&D capabilities in AI Vision ICs, MIPI high-speed interfaces, and real-time data transmission technology with Wieson Technologies' strengths in high-speed connectors, high-speed cable assemblies, electronic subsystem integration, and global manufacturing footprint to jointly develop high-speed video transmission and system integration solutions.

Through technical exchange, global customer collaboration, and market promotion, this partnership will focus on expanding into high-growth applications including AI Vision, smart automotive, AI robotics, smart healthcare, industrial automation, and Edge AI. By combining high-speed interface ICs with high-speed interconnect and system integration technologies, the two companies will jointly build an AI Vision Connectivity Solution, helping customers improve development efficiency, reduce system complexity, and accelerate the commercialization of AI Vision applications.

Sugars CEO Lee Hyung-gyoo stated:

"Since its founding, Sugars has remained focused on innovation in high-speed interface IC technology. After becoming the first in the industry to commercialize a 24Gbps mobile video interface IC in 2023, we have continued to invest in the development of next-generation MIPI high-speed interface technology, striving to deliver innovative products that meet market needs. With an R&D team boasting over 30 years of experience, we will continue to place innovation, high performance, and high quality at our core, providing more competitive solutions for the global AI application market and creating greater value for the development of Korea's semiconductor industry."

Wieson Technologies CEO Chen Hung-chin stated:

"This collaboration with Sugars is not only an integration of both companies' technological strengths, but also represents an important milestone for the AI Vision high-speed interconnect ecosystem. By combining Sugars' R&D capabilities in high-speed interface ICs with Wieson Technologies' high-speed interconnect, electronic subsystem integration, and global manufacturing footprint, the two companies will jointly deliver high-speed video transmission solutions to accelerate the commercialization of AI Vision applications. Going forward, Wieson Technologies will continue to advance toward becoming a Total Solution Provider, working together with Sugars to deepen our presence in markets such as AI Camera, AI robotics, smart automotive, smart healthcare, and industrial automation—delivering globally competitive, next-generation high-speed interconnect solutions."