The BK7259: An Edge AI Powerhouse

The BK7259 is a highly integrated cognitive hub built on a single die, replacing the inefficient multi-chip hardware stacks of the past. By combining high-definition video, advanced audio, precise motor control, and dedicated AI processing in one platform, RiseLink provides the "body and nervous system" of intelligent devices so developers can focus on building the unique "soul" of their products.

Key features include:

• Powerful local compute: Dual Cortex-M55 cores and an Arm Ethos-U65 microNPU delivering 0.3 TOPS of AI acceleration
• Unified memory architecture: Enables the NPU, GPU, and CPU to operate simultaneously without frame drops, supporting real-time tracking and natural language processing
• Privacy and security: Supports fully on-device 3D face recognition in under 200 ms, ensuring biometric data never leaves the device
• Ultra-low power consumption: Achieves less than 60 µA keep-alive current and 2 µA deep sleep current, making high-performance AI possible on a single battery

The R2 Unified AI Developer Platform

Alongside the BK7259, RiseLink is debuting the R2 Unified AI Developer Platform, designed to reduce friction and accelerate intelligent product development.

Platform highlights include:

• Rapid prototyping: Verified drivers for popular sensors including GC2145 and OV2640, as well as support for specialized circular displays such as ST7701S
• Standardized tools: Built on the Armino SDK with support for CMSIS-NN and TensorFlow Lite Micro, enabling streamlined deployment across diverse workloads
• Interactive community: Supported by RiseLink's Reddit forum and Discord channel, where developers can collaborate directly with RiseLink engineers

Vision and Leadership at Embedded World 2026

RiseLink's presence at Embedded World 2026 is further highlighted by leadership engagements at the event:

• Exhibitor's Forum talk: CEO Dr. Pengfei Zhang will present "From Hearing to Seeing: Powering Battery-First Embodied AI with the BK7259" at the Exhibitor Forum in Hall 3 / Booth 3-611 on Thursday, March 12, at 14:30
• Media spotlight: Diana Zhu, Head of the United States for RiseLink, was featured in an Embedded World 2026 video interview discussing RiseLink's commitment to delivering more compute with lower power consumption for the global smart home ecosystem

Strategic Showcase with Tuya Smart

RiseLink continues its long-term collaboration with Tuya Smart (NYSE: TUYA; HKEX: 2391) to support scalable intelligent device infrastructure. At Embedded World 2026, the companies are jointly showcasing:

• T5 AI Series products: Including the T5 AI board, a developer kit with integrated microphones and cameras for deploying LLM agents and AI-driven toys
• Smart home and smart energy solutions: Featuring Tuya smart locks with local 3D face recognition to keep biometric data secure and private, as well as Tuya's all-in-one smart energy-saving solution, which uses AI-driven 24/7 monitoring and threshold alerts to improve energy efficiency and cost-effectiveness

Visit RiseLink at Embedded World 2026

Location: Hall 3, Booth 3-656
Experience: Live demonstrations of the BK7259 Edge AI powerhouse and the R2 Unified AI Developer Platform

About RiseLink Technologies
RiseLink is a chip design company shipping over 300 million chips annually. Its technology powers products for global brands including Samsung, LG, Haier, and Midea.

About Tuya Smart
Tuya Smart is a global AI cloud platform service provider that enables businesses to rapidly build smart commercial solutions across energy, real estate, and other industries.

During CES week, ChooChoo was showcased across multiple media outlets, including KLAS News Now (CBS Las Vegas), WBTS (NBC Boston), KSNV-TV (NBC Las Vegas), and the nationally syndicated Anna & Raven Show, reflecting growing interest in how edge AI can be applied thoughtfully and responsibly to children's learning products.

A Research-Backed Approach to Early Reading

ChooChoo helps children build language and early reading skills through interactive read-aloud, rather than passive listening. Its design is inspired by interactive (dialogic) reading methods from Yale's early childhood language development research, which have been shown to significantly improve children's language abilities in as little as one month when used consistently.

ChooChoo was created by Dr. Diana Zhu (Yale PhD), combining academic research with warm, playful product design for children ages 3–6. Through natural conversation and adaptive storytelling, ChooChoo:

• Engages children in back-and-forth dialogue during stories
• Introduces and reinforces vocabulary in meaningful context
• Supports comprehension, emotional language, and confidence
• Adapts to each child's pace, interests, and learning progress

An optional parent app allows caregivers to view reading progress, vocabulary learned, and how the system adapts over time.

Powered by RiseLink Edge AI: Low Latency, Ultra-Low Power, and Privacy by Design

ChooChoo is built on RiseLink's edge AI and wireless connectivity platform, including ultra-low-power AI SoCs such as the BK7259-class chips, designed specifically for always-on, edge-AI devices.

By performing key intelligence directly on the device, RiseLink's chips enable:

• Low-latency responses, critical for natural, frustration-free child interaction
• Ultra-low power consumption, extending battery life for daily use
• Privacy and security by design, with sensitive interactions processed locally rather than continuously streamed to the cloud

This edge-first architecture allows ChooChoo to feel responsive and "alive," while giving parents confidence that their child's data and interactions are handled securely.

Proven Edge AI Technology at Global Scale

RiseLink's edge AI and connectivity chips are already deployed at massive global scale, powering billions of connected devices worldwide across smart home, consumer electronics, and intelligent hardware categories. The company ships 200M+ units annually in AI-native device scenarios, demonstrating production-grade reliability and maturity.

RiseLink is a long-term silicon partner to leading global brands across consumer electronics and smart devices, including LG, Samsung, Midea, and Hisense, bringing industrial-grade performance, security, and efficiency to next-generation products—including AI-powered toys.

Redefining AI-Powered Toys

ChooChoo represents a new generation of AI-native toys—products that move beyond scripted playback to become responsive, adaptive companions grounded in research, safety, and real-world reliability.

Its debut at CES 2026, combined with national and local media coverage, underscores how edge AI and ultra-low-power chip design can unlock meaningful, child-safe learning experiences—without compromising privacy, responsiveness, or battery life.

Through curated ecosystem conversations, hands-on workshops, and an invitation-only industry gathering, RiseLink highlighted its role as a connective platform for companies building intelligent devices—bridging chips, algorithms, and real-world product deployment. More information about RiseLink is available at https://riselink.ai.

Aligning the Physical AI Stack: From Silicon to Shipping Products

At CES 2026, RiseLink convened founders, product leaders, and platform partners across the physical AI ecosystem for "The Blueprint for Physical AI: AI-Native Hardware Mixer," an invitation-only gathering designed to foster alignment across the full AI stack.

The event brought together companies spanning AI models, platforms, and device deployment — including MiniMax, Agora, Wyze, Nanit, Luka AI, WowCube, Fuzozo, Dify, and other emerging builders — to exchange lessons on moving AI from cloud-centric architectures into production-ready, intelligent devices.

Conversations centered on how edge intelligence, ultra-low-power connectivity, and system-level design must come together to enable real-world AI experiences, from smart homes and robotics to AI companions and educational devices.

Reflecting on the shift underway, Dr. Pengfei Zhang, CEO of RiseLink Technologies, shared:

"The future of AI is physical. Intelligence must live where interaction happens — inside devices that are always on, power-efficient, and designed with trust at the core. Building that future requires deep collaboration across chips, algorithms, and product teams."

Across discussions, a consistent theme emerged: the next generation of AI products will be defined not by isolated breakthroughs, but by ecosystem-level collaboration — where silicon, algorithms, and applications are co-designed from day one.

From Ecosystem Alignment to a Shipping Product: ChooChoo, an AI Early Education Toy

That ecosystem alignment was made tangible at CES with the introduction of ChooChoo, an AI-powered early education toy that brings together edge intelligence, ultra-low-power connectivity, and conversational AI in a child-friendly device.

Created and introduced by Dr. Diana Zhu, Head of U.S. at RiseLink, ChooChoo is designed to support early language development through interactive reading and dialogue-driven storytelling. By running intelligence closer to the device, ChooChoo enables responsive, always-on interaction while prioritizing privacy, safety, and reliability—attributes that are increasingly critical as AI moves into everyday environments.

ChooChoo serves as a real-world demonstration of how the physical AI stack comes together in practice: AI algorithms optimized for edge deployment, hardware designed for power efficiency, and system-level integration that enables products to move from concept to scalable deployment. More information about ChooChoo is available at https://choochoostudio.com.

Building the Physical AI Ecosystem—Together

Across CES 2026, RiseLink reinforced its role as an ecosystem connector for the physical AI era. The company is actively seeking to collaborate with:

• Algorithm and AI model companies developing directly on edge chips
• Smart toy, robotics, and smart home companies bringing AI into everyday environments
• Solution and platform partners building production-ready systems on RiseLink silicon

By enabling collaboration across silicon, software, and system design, RiseLink aims to help partners move faster from prototype to production—supporting a new generation of intelligent, connected devices designed for life beyond the screen.

To learn more about RiseLink Technologies, visit https://riselink.ai.

Ecosystem partners and collaborators may contact Dr. Diana Zhu at diana@riselink.ai. RiseLink development boards and select end products are available for purchase through Digi-Key at https://www.digikey.com/en/supplier-centers/riselink  

The panel was moderated by John Harrison, Partner at EY, and featured:

• Darcy Clarkson, Chief Executive Officer — Region North America (Appliances Division), Bosch
• Greg Fyke, President and CEO, ecobee
• Charlotte Maines, Director, Devices Advertising, Amazon Devices
• Dr. Pengfei Zhang, CEO, RiseLink Technologies Inc.

During the discussion, Dr. Zhang emphasized that as smart homes scale toward dozens of always-connected devices, the industry must rethink system architecture to support reliability, responsiveness, and user trust. "The future smart home will not be cloud-dependent by default," he noted. "It will be Matter-ready, intelligent at the edge, and designed around real-world constraints like power, latency, and privacy."

Three Pillars Driving Smart Home Adoption

Dr. Zhang outlined three core technology pillars shaping the next generation of smart-home platforms:

Dual-Band Wi-Fi 6 Connectivity

With device density continuing to rise, dual-band Wi-Fi 6 is becoming essential infrastructure for the modern home. Its improved capacity and efficiency enable stable performance across both high-bandwidth devices and latency-sensitive applications.

Ultra-Low-Power System Design

To unlock true ubiquity, smart devices must operate untethered. RiseLink's system-on-chip architecture focuses on ultra-low-power operation, allowing sensors, controllers, and interactive devices to run for years on a single battery without sacrificing performance.

Edge AI for Privacy-First Intelligence

Addressing growing consumer concern around data security, Dr. Zhang positioned edge AI as a foundational shift in smart-home design. By processing voice, vision, and sensor data locally on the chip, RiseLink enables advanced intelligence while keeping sensitive user data inside the home.

Real-Time Conversational AI, Running On-Device

As a live example of these principles in action, Dr. Zhang highlighted RiseLink's latest Edge-AI Wi-Fi processors, which support real-time conversational AI directly on device. Local processing enables near-instant response times, reduced cloud dependency, and stronger privacy guarantees.

RiseLink also introduced Choo Choo the Dragon, an interactive AI reading companion for children, as a flagship demonstration of edge intelligence. Powered by RiseLink's Edge-AI processor, Choo Choo engages children through natural, real-time dialogue to support interactive storytelling and learning—while ensuring conversations remain private and locally processed.

"The integration of high-performance Wi-Fi 6 with on-device AI is redefining how people interact with smart environments," said Dr. Zhang. "With products like Choo Choo the Dragon, we're demonstrating that intelligent, conversational experiences can be responsive, power-efficient, and privacy-preserving at the same time."

About Dr. Pengfei Zhang and RiseLink Technologies

Dr. Pengfei Zhang is the Founder and CEO of RiseLink Technologies Inc., a leading provider of wireless connectivity and edge-AI system-on-chips for smart-home and IoT devices. A graduate of Tsinghua University and UCLA, Dr. Zhang brings more than two decades of experience in the global semiconductor industry. Under his leadership, RiseLink has become a key innovator in high-performance, ultra-low-power wireless solutions powering next-generation smart devices worldwide.

LAS VEGAS, Jan. 2, 2026 /PRNewswire/ -- RiseLink, a global provider of high-performance, ultra-low-power Wi-Fi and AIoT system-on-chips (SoCs), today announced a series of activities at CES® 2026, highlighting how its edge AI and connectivity technologies are enabling scalable, production-ready smart devices.

At CES 2026, RiseLink CEO Dr. Pengfei Zhang will participate in an official CES Smart Home panel, "The Latest in Smart Devices and Smart Home Integration," alongside leaders from Amazon, Bosch, Ecobee, and EY. More information about the session is available via the official CES program: https://www.ces.tech/schedule/the-latest-in-smart-devices-and-smart-home-integration/

"RiseLink focuses on enabling edge AI through ultra-low-power, cost-effective system-on-chips that allow smart devices to scale reliably from prototype to production," said Dr. Pengfei Zhang. "As AI moves onto devices, efficiency and integration become just as important as model capability."

In addition, ChooChoo, an AI-powered interactive reading toy built on RiseLink's ultra-low-power Wi-Fi and edge-AI chips, has been selected for broadcast as part of the official CES programming, demonstrating conversational AI running efficiently on-device in a production-ready consumer product.

"ChooChoo brings research-driven interaction to life on the edge," said Dr. Diana Zhu, Head of U.S. at RiseLink and creator of ChooChoo. ChooChoo will be demoed live at the RiseLink booth (Venetian Expo Hall A–D, Booth 53117).

RiseLink will host "The Blueprint for Physical AI: AI-Native Hardware Mixer @ CES 2026," an invitation-only gathering for founders, product leaders, chipmakers, and system architects building AI-native smart devices. The mixer takes place in Las Vegas on Thursday, January 8, 2026 (6:00–9:00 p.m.) and will feature focused networking and discussions on scaling edge AI from chip to production-ready devices. Attendance is limited; registration is available at https://luma.com/9igbskoz.

RiseLink will exhibit at CES 2026, Venetian Expo Hall A–D, Booth 53117, showcasing its latest Wi-Fi MCU and AIoT platforms designed for strong RF performance, deep system integration, and industry-leading ultra-low-power operation across smart home devices, AI-enabled consumer products, and emerging intelligent applications.

To schedule a meeting with the RiseLink team during CES, visit:
https://calendly.com/riselink/meet-with-riselink

For more information, visit https://riselink.ai.

About RiseLink
RiseLink is the international headquarters and innovation hub for Beken Corporation (SSE: 603068), a leading fabless semiconductor company specializing in wireless communication and AIoT solutions. RiseLink focuses on bringing high-performance, low-power Wi-Fi and edge-AI technologies to smart home devices, AI-enabled consumer products, and emerging intelligent applications worldwide.