Semiconductors
OPPO, AlpsenTek and Qualcomm Boost AI Motion, Image Quality For Mobile Apps
LAS VEGAS, Jan. 11, 2024 /PRNewswire/ -- OPPO, AlpsenTek and Qualcomm Technologies, Inc. have teamed up with the goal of enhancing innovative Hybrid Vision Sensing (HVS) technology, to better extracting valuable motion and image data to enhance picture quality for mobile phone applications. OPPO...
WEKA Achieves NVIDIA DGX BasePOD Certification
With NVIDIA DGX BasePOD Certification Complete, WEKA Sets Its Sights on NVIDIA DGX SuperPOD Certification
Beken Releases BK7258 Low-Power Audio and Video Solution
LAS VEGAS, Jan. 10, 2024 /PRNewswire/ -- Beken Corporation (SSE: 603068.SH) has officially launched the BK7258 low-power audio and video solution. BK7258 is a highly integrated audio and video Wi-Fi SoC chip. This solution is widely used in AIoT applications such as smart locks, low-power doorbel...
Beken Releases BK3633 Apple Find My Network Accessory Solution
LAS VEGAS, Jan. 10, 2024 /PRNewswire/ -- Beken Corporation (SSE: 603068.SH) has officially announced the release of the Apple Find My network accessory solution. The solution is based on Beken's BK3633 SoC, enabling products to join Apple's Find My Network. It can be used both as an anti-loss tag...
Beken Releases BK7257 AirPlay 2.0 Audio Solution
LAS VEGAS, Jan. 10, 2024 /PRNewswire/ -- Beken Corporation (SSE: 603068.SH) has officially launched its Apple AirPlay 2.0 audio solution based on BK7257, Beken's latest Wi-Fi Audio SoC, enabling products to leverage Apple's AirPlay feature, extensively applicable in speakers, sound bars, and othe...
UGREEN Announces Its Next-Generation Network Attached Storage Devices into International Market at CES 2024
LAS VEGAS, Jan. 10, 2024 /PRNewswire/ -- Ugreen, a leading brand in consumer electronics, is announcing a new collaboration with Intel during the unveiling of the new UGREEN NASync Network Attached Storage devices on the first day of 2024 CES. This development signifies a substantial leap forward...
Chroma ATE Advancing Versatility in Testing
By Stephen Las Marias, EE Times Asia TAOYUAN, Jan. 10, 2024 /PRNewswire/ -- The breakneck speed of innovation and evolution happening in the semiconductor manufacturing space requires capital equipment that can accommodate several device generations and applications to justify the cost of owners...
DEEPX Unveils 'All-in-4 AI Total Solution' at CES 2024: Four AI Chips Transforming On-Device AI Market
- All-in-4 AI Total Solution comprises four chips spanning various performance levels, each with different features and interfaces optimized for diverse edge applications. - After demonstrating the originality of its technology with engineering products last year, DEEPX conducted pre-produc...
ChipMOS REPORTS 22.2% YoY INCREASE IN 4Q23 REVENUE AND 21.1% YoY INCREASE IN DECEMBER 2023 REVENUE
HSINCHU, Jan. 10, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
Black Sesame Technologies, Together with JOYNEXT and Its Subsidiary NESINEXT, Highlight Cross-domain Fusion at CES 2024
LAS VEGAS, Jan. 9, 2024 /PRNewswire/ -- On January 9, 2024, Black Sesame Technologies, in collaboration with JOYNEXT, and its subsidiary NESINEXT, unveiled an array of innovative software solutions at CES 2024. Highlights included the nCCU (Central Computing Unit) built on its Wudang C1200 Series...
Cross-Domain Integration New Match Point| ThunderX Launches Company's First cabin-Driving Integration Solution Based on Snapdragon Ride Flex System-on-Chip
LAS VEGAS, Jan. 9, 2024 /PRNewswire/ -- On January 9, the International Consumer Electronics Show 2024 (referred to as: CES 2024) grandly opened inLas Vegas, it showcases the latest trends and directions in the field of consumer electronics every year.At this year's CES 2024,ThunderX,a subsidiary...
Beken Corporation Announces Integration of Alexa Connect Kit on Its Wi-Fi Chipsets
LAS VEGAS, Jan. 9, 2024 /PRNewswire/ -- Beken Corporation (SSE: 603068.SH), a leading supplier of IoT connectivity chipsets and solutions, is excited to announce the successful integration of Alexa Connect Kit (ACK) onto its flagship chip BK7235. By incorporating ACK into the Beken platform, cus...
LG Innotek to showcase powerful competencies in Mobility and AI at CES 2024
* #3701, Comprised of 3 zones: 'Mobility, AI and Future Pathway' * Unveil The mockup of future autonomous vehicle equipped with 18 types of key electronic parts * Display Core technologies for high-efficiency large-scale data analysis being required by the growing Al market, and package subs...
Meet the New Lenovo Brand SSD Line
SINGAPORE, Jan. 9, 2024 /PRNewswire/ -- The solid-state drive (SSD) market size will grow fromUSD 55.69 billion in 2023 to USD 125.05 billion by 2028, a CAGR of 17.56% during 2023-2028, according to research by MordorIntelligence[1]. Much of that growth will be driven by consumers as interest acc...
Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports
MILPITAS, Calif., Jan. 8, 2024 /PRNewswire/ -- Electronic System Design (ESD) industry revenue increased 25.2% to$4,702.4 million in the third quarter of 2023 from the$3,756.3 million logged in the third quarter of 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest...
ITRI Exhibits AI Display and Entertainment and Robotics Technologies at CES 2024
LAS VEGAS, Jan. 8, 2024 /PRNewswire/ -- The Industrial Technology Research
Institute (ITRI)
SurplusGLOBAL's CEO, Bruce Kim, Has Been Elected as a Members of The National Academy of Engineering of Korea
SEOUL, South Korea, Jan. 8, 2024 /PRNewswire/ -- Bruce Kim, the CEO of SurplusGLOBAL, a legacy semiconductor equipment platform company, has been honored as an outstanding engineer by the National Academy of Engineering of Korea for his contributions to the semiconductor ecosystem. He has been r...
DEEPX CEO Lokwon Kim to Speak at CES 2024 Panel on the Future of AI Hardware and Chips
Lokwon Kim represents global AI chip companies at a panel on innovations enabling the on-device AI era * DEEPX CEO Lokwon Kim will discuss timing and plans for on-device AI at CES 2024 panel * DEEPX to exhibit ultra-low power AI chip solutions in North Hall, Booth #8953 LAS VEGAS and SEOUL, ...
ARTERY AT32 MCU-based Solutions for High-speed Multi-Functional Peripheral
HSINCHU, Jan. 5, 2024 /PRNewswire/ -- Office facilities are always fundamental to business. To save manpower and promote efficiency, more and more user-friendly office equipment have been introduced, and one of the most brilliant device is the multi-functional peripheral (MFP) that integrates co...
Montage Technology Introduces 4th-Gen DDR5 RCDs Enabling Data Rates up to 7200 MT/s
SHANGHAI, Jan. 5, 2024 /PRNewswire/ -- Montage Technology, a leading data processing and interconnect IC company, today introduced its 4th-gen DDR5 Registering Clock Driver (RCD), also called DDR5 RCD04, to the industry. Designed for DDR5 RDIMM memory modules, this chip supports blazing-fast data...
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