Industry Leaders Combine Expertise to Deliver Best-in-Class Test and Packaging Capabilities
EINDHOVEN, Netherlands and TAIPEI, Taiwan, Feb. 2 /Xinhua-PRNewswire-FirstCall/ -- NXP Semiconductors, formerly Philips Semiconductors, and Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311; NYSE: ASX) today announced the signing of a Memorandum of Understanding to form a joint venture (JV) in Suzhou, China focused on semiconductor testing and packaging. It is planned that NXP will hold a 40 percent share while ASE will hold the remaining 60 percent. Terms of the agreement are subject to final negotiations between NXP and ASE and the receipt of necessary approvals from regulatory authorities. No financial details will be disclosed.
The JV will serve the international and domestic Chinese markets, focusing on testing and packaging of a wide range of semiconductors in areas such as mobile communications, consumer electronics and automotive products. Since the new company will be located at NXP's existing manufacturing site in Suzhou, China, the parties expect that the JV will be able to quickly and efficiently serve customers and meet the required fast time-to-market requirements necessary to compete in the high tech arena. The JV is expected to begin operations in Q2 2007. NXP will contribute its existing testing and packaging operation in Suzhou as its initial investment into the JV. This JV does not affect the other testing and packaging sites for NXP in Asia and Europe.
"We're pleased to be able to strengthen our relationship with ASE through the formation of this JV and appreciate the willingness of governments to help in this regard," said Ajit Manocha, Chief Manufacturing Officer, NXP Semiconductors. "The JV combines the expertise of both companies to provide high-quality, competitive products to address the needs of electronics manufacturers around the world."
"NXP has been a leader in semiconductors for more than 50 years, bringing a unique blend of innovative processes, manufacturing capabilities and advanced product development to the industry," said Dr. Tien Wu, Chief Operating Officer, ASE. "ASE is the world's largest independent provider of IC packaging and testing services. We look forward to working together with NXP to strengthen our leadership position and bring additional value to our customers."
About NXP Semiconductors
NXP is a top 10 semiconductor company founded by Philips more than 50 years ago. Headquartered in the Netherlands, the company has 38,000 employees working in 26 countries across the world. NXP creates semiconductors, system solutions and software that deliver better sensory experiences in mobile phones, personal media players, TVs, set-top boxes, identification applications, cars and a wide range of other electronic devices. News from NXP is located at http://www.nxp.com .
About ASE
ASE, Inc. is the world's largest independent provider of IC packaging services and, together with its subsidiary ASE Test Limited (Nasdaq: ASTSF), the world's largest independent provider of IC testing services, including front-end engineering testing, wafer probing and final testing services. ASE's international customer base of more than 200 customers include such leading names as ATI Technologies Inc., CSR plc, Freescale Semiconductor, Inc., IBM Corporation, NVIDIA Corporation, NXP, Qualcomm Incorporated, RF Micro Devices Inc., ST Microelectronics N.V. and VIA Technologies, Inc. With advanced technological capabilities and a global presence spanning Taiwan, Korea, Japan, Singapore, Malaysia and the United States, ASE has established a reputation for reliable, high quality products and services. For more information, visit ASE's website at http://www.aseglobal.com .
Note to Editors
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Forward-looking Statements
This release may contain certain forward-looking statements with respect to the financial condition, results of operations and business of NXP and ASE and certain plans and objectives of NXP and ASE with respect to these items. By their nature, forward-looking statements involve risk and uncertainty because they relate to events and depend on circumstances that will occur in the future and there are many factors that could cause actual results and developments to differ materially from those expressed or implied by these forward-looking statements.
Media contacts:
NXP Semiconductors
Europe:
Heather Drake
Tel: +31-40-27-65949
Email: heather.drake@nxp.com
USA
Paul Morrison
Tel: +1-408-474-8769
Email: paul.morrison@nxp.com
Greater China
Terry Chiang
Tel: +886-2-8170-9992
Mobile: +886-935-123-978
Email: terry.chiang@nxp.com
APAC
Mark Chisholm
Tel: +81-3-3740-4792
Email: mark.chisholm@nxp.com
ASE
Freddie Liu, Vice President
Tel: +886-2-8780-5489
Email: freddie_liu@aseglobal.com
Clare Lin, Director (US Contact)
Tel: +1-408-986-6524
Email: clare.lin@aseus.com
