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Texas Instruments Newest Wireless Infrastructure Processor Propels Emerging Market Applications Within GSM, TD-SCDMA and WiMAX

2006-12-04 14:28 2929

3GHz Multi-Core Baseband Product Addresses Future Needs of OFDMA/LTE Air

Interfaces

HONG KONG, Dec. 4 /Xinhua-PRNewswire/ -- Texas Instruments Incorporated

(TI) (NYSE: TXN) today announced its newest 3GHz-performing wireless

infrastructure baseband product that boosts applications for GSM-based base

stations while addressing new markets and requirements for WiMAX and TD-

SCDMA. With three cores running at 1GHz each, the TMS320TCI6487 processor

enables base station manufacturers to extend their existing designs while

entering into new markets, requiring small form factor applications with an

exceptional scaleable, flexible solution. For more information, please visit

http://www.ti.com/tci6487 .

(Logo: http://www.prnasia.com/sa/20061107170439-20.jpg )

“Wireless infrastructure requirements are constantly changing and

evolving, with regional and form factor opportunities growing quickly,” said

Flint Pulskamp, wireless semiconductor analyst at IDC. “Offering a single,

flexible solution to manufacturers and service providers to solve their needs

for quick regional deployments for GSM, TD-SCDMA and WiMAX further

strengthens TI’s strong position in this market space.”

Single Solution for Multiple Standards

Currently, there are more than two billion GSM subscribers in 210

countries around the world. With TI’s TCI6487, manufacturers will be able to

deliver a high-performance, low-cost infrastructure solution for this market

that supports up to 10 EDGE-enabled carriers with a single chip. In addition

to supporting more users, the multi-core DSP provides enhanced capabilities

for GSM, including interference cancellation and better reception for high

data-rate applications. This flexible, software upgradeable solution reduces

overall infrastructure costs, enabling service providers to deploy baseband

technology in new emerging markets such as those in India, Russia, Africa and

South America.

Texas Instruments’ TCI6487 is also optimized for infrastructure designs

of TD-SCDMA, China’s unique air interface. With pre-commercial trials

currently underway for TD-SCDMA, it is anticipated that the standard will be

widely deployed in advance of the 2008 Olympic Games in Beijing, requiring a

solution that can immediately meet the needs of this huge cellular market.

The 3GHz “baseband on a chip” can support three carriers and 69 users per

device.

Building on TI’s current WiMAX leadership, the TCI6487 is an excellent

solution that meets the unique needs of today’s emerging OFDMA requirements

and tomorrow’s LTE demands. The single-chip DSP solution, works in

conjunction with TI’s optimized software library, complete analog front end

and key products from third parties. Now, TI’s WiMAX customers can quickly

get to market with advanced products for current requirements and the ability

to shrink as future smaller form factor requirements demand. A complete 10-

MHz, 2-antenna, 3-sector solution can easily be implemented, improving

overall cost and power per channel.

“Flexibility is key in infrastructure design, as the market constantly

evolves and infrastructure requirements change to support newer features and

services,” said Jerold Givens, TI Communications Infrastructure DSP

director. “While we have insight into what the next paradigm shift is

likely to be in the wireless space in the coming years, it is important for

us to offer our customers a solution that is flexible enough to meet a

variety of today’s industry requirements and powerful enough to take them to

tomorrow’s next phase in wireless infrastructure design.”

Higher-Performance DSP Baseband Solution

TI’s TCI6487 offers three-times the performance of previous

infrastructure solutions, providing greater channel enhancement and more

flexibility while reducing design complexity for OEMs. Manufactured in 65nm

process node, this new DSP is the highest performing processor in TI’s

TMS320C64x+ DSP family. As a result, carriers will be able to deploy advanced

networks quickly while future proofing their investments. The ability to

upgrade performance with software enhancements also enables service providers

to support emerging standards such as LTE, 3GPP and 3GPP+, while easily

adding new features and services to their networks. This, in turn, will

provide subscribers access to the latest and greatest services and

capabilities that the wireless world can deliver.

TI offers the industry’s broadest wireless infrastructure product

portfolio, spanning the complete signal chain. Supporting analog products

include digital up/down converters, high speed data converters, RF products,

timing, backplane interface and standard logic components. Highlighting the

company’s leadership in power management, TI has developed a non-isolated

DC/DC power module with extremely fast response and high performance. It is

the first power management device to meet core voltage tolerance requirements

of the TCI6487.

Availability

The TCI6487 is currently sampling with targeted customers. It will be on

display at the ITU Telecom show, Dec. 4-8 in Hong Kong in Hall 2, Booth 2010.

For more information, please visit http://www.ti.com/tci6487 .

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog

technologies to meet our customers’ real world signal processing

requirements. In addition to Semiconductor, the company includes the

Educational & Productivity Solutions business. TI is headquartered in Dallas,

Texas, and has manufacturing, design or sales operations in more than 25

countries.

Texas Instruments is traded on the New York Stock Exchange under the

symbol TXN. More information is located on the World Wide Web at

http://www.ti.com .

Safe Harbor Statement

Statements contained in this news release regarding TI product

availability and other statements of management’s beliefs, goals and

expectations may be considered forward-looking statements as that term is

defined in the Private Securities Litigation Reform Act of 1995, and are

subject to risks and uncertainties that could cause actual results to differ

materially from those expressed or implied by these statements. The following

factors and the factors discussed in TI’s most recent Form 10-K could cause

actual results to differ materially from the statements contained in this

news release: actual market demand for amplifier products and TI products

specifically, and actual test results relating to TI products. TI disclaims

any intention or obligation to update any forward-looking statements as a

result of developments occurring after the date of this news release.

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owners.

Source: Texas Instruments Incorporated
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