NEW YORK and CHANGSHA, China, Oct. 2 /Xinhua-PRNewswire/ -- Tongxin International, Ltd. (“Tongxin”) (“Company”) (Nasdaq: TXIC) a manufacturer of engineered commercial vehicle body structures (“EVBS”), SUV passenger vehicle bodies and stamped body parts for the Chinese commercial vehicle market, today announced that the Company will present at the Maxim Group Growth Conference at the Grand Hyatt Hotel in New York City on Tuesday, October 7, 2008. William Zielke, interim CFO and a director of the Company, is scheduled to present at 2:00 p.m. Eastern Time (ET), with a breakout session immediately following.
For more information about the Maxim Group Growth Conference, please visit http://www.maximgrp.com or contact your Maxim Group representative.
About Tongxin International Ltd.
Tongxin International Ltd., is the largest independent supplier of EVBS in China, is capable of providing EVBS for both the commercial truck and light vehicle market segments, in addition to designing, fabricating and testing dies used in the manufacturing process. EVBS consists of exterior body panels including doors, floor pans, hoods, side panels and fenders.
Forward-Looking Statements
Statements contained in this press release, which are not historical fact, constitute ``Forward-Looking Statements.’’ Actual results may differ materially due to numerous important factors that are described in Tongxin International’s most recent report to the SEC on Form 6-K, which may be revised or supplemented in subsequent reports to the SEC. Such factors include, among others, the cost and timing of implementing restructuring actions, the Company’s ability to generate cost savings or manufacturing efficiencies to offset or exceed contractually or competitively required price reductions or price reductions to obtain new business, conditions in the automotive industry, and certain global and regional economic conditions. Tongxin International does not intend or assume any obligation to update any forward-looking statement to reflect events or circumstances after the date of this press release.
