Computer Hardware
ASUS Unveils Comprehensive Storage Solutions at SC25
Delivering high-performance, scalable infrastructure for AI, HPC, and enterprise workloads KEY POINTS * Fully scalable storage: Unified, block, file, object, and software-defined systems for AI, HPC, and enterprise workloads * Next-gen AI power: XA AM3A-E13 with AMD Instinct MI355X GPUs deli...
Hon Hai Tech Day 2025 Opens To Showcase Foxconn's Powerful Partnerships And Vertical Integration Strengths
NVIDIA, OpenAI, Alphabet, IBM, ABB Robotics, Uber, FUSO Participate Onstage TAIPEI, Nov. 21, 2025 /PRNewswire/ -- Accelerating its transformation into an AI-powered technology platform service company, Hon Hai Technology Group ("Foxconn") (TWSE: 2317) on Friday welcomed powerful partnerships, in...
Hikvision debuts WonderOS 4, empowering smart education through AI and cloud technology
HANGZHOU, China, Nov. 20, 2025 /PRNewswire/ -- Hikvision officially launched
WonderOS 4
SuperX AI Achieves NVIDIA Solution Provider Preferred Level
SINGAPORE, Nov. 20, 2025 /PRNewswire/ -- SuperX AI Technology Limited (NASDAQ: SUPX) ("the Company" or "SuperX") today announced that on November 19, 2025, MicroInference Pte. Ltd. ("MicroInference"), a subsidiary majority owned by SuperX AI Technology Limited, and aSingapore-based solution provi...
IBM and Cisco Announce Plans to Build a Network of Large-Scale, Fault-Tolerant Quantum Computers
- New collaboration plans to unite strengths of both leaders to design a connected network of large-scale, fault-tolerant quantum computers, targeted by early 2030s - Companies plan to deliver an initial demonstration of multiple networked quantum computers within five years - Distributed quan...
PioCreat Showcases Full-Spectrum 3D Printing Solutions at Formnext 2025
SHENZHEN, China, Nov. 20, 2025 /PRNewswire/ -- PioCreat
Leading Industry Transformation | Anyuan Mold Cooperates with UnionTech to Deepen Metal 3D Printing Footwear Mold Field
SHANGHAI, Nov. 20, 2025 /PRNewswire/ -- Anyuan Mold, a well-known mold manufacturer inChina, empowers footwear mold industry with metal additive manufacturing technology by introducing UnionTech's Fuees430 four-laser metal 3D printer, breaking through the pain points of traditional footwear mold ...
Supermicro Expands Its Portfolio of Performance and Efficiency Driven Air-Cooled AI Solutions Featuring AMD Instinct™ MI355X GPUs
* Supermicro introduces the latest addition of AI-accelerated solutions with a new 10U air-cooled server, which incorporates the AMD Instinct MI355X GPUs delivering breakthrough performance for AI and Inference workloads * Part of Supermicro's Data Center Building Block® (DCBBS) architecture, ...
Anycubic Introduces Three Breakthrough Products at Formnext 2025, marking a New Step in Desktop Manufacturing
FRANKFURT, Germany, Nov. 20, 2025 /PRNewswire/ -- Anycubic
LITEON Showcasing NVIDIA Next-Gen AI Factory and HPC Integrated Solutions at Super Computing 2025
Ushering in a Megawatt-Scale AI Power Era ST. LOUIS, Nov. 19, 2025 /PRNewswire/ -- LITEON Technology (2301.tw) participates in the global high-performance computing (HPC) event—Super Computing (SC25), taking place fromNovember 16 to 21 in St. Louis, USA. LITEON showcases a series of solutions co...
Creality Showcased New Products and AI Features at Formnext 2025, Shaping the Future of "Instant Creation"
FRANKFURT, Germany, Nov. 19, 2025 /PRNewswire/ -- On the opening day of Formnext 2025, Creality, a global leader in the 3D printing industry, made an impressive debut at Hall 12.1-C02, unveiling new products and experiences that bridge intelligent design and accessible creation. The showcase feat...
Compal Showcases High-Density Liquid-Cooled AI Servers at SC25, Powered by AMD EPYC™ Processors and AMD Instinct ™ GPUs for Next-Generation Sustainable Computing
ST. LOUIS, Nov. 19, 2025 /PRNewswire/ -- Compal Electronics (Compal; Ticker:
2324.TW) make a strong appearance at Supercomputing 2025 (SC25), held from
November 17–20, 2025, unveiling its latest lineup of AI and high-performance
computing (HPC) servers. Highlight products include theSG720-2A
LG Innotek Reaffirms World-Leading Automotive Lighting Innovation at CES 2026 for the Second Consecutive Year
* New 'Ultra Thin Pixel Lighting Module' wins CES 2026 Innovation Award. * Silicon optical components reduce thickness by 71%, offering customers greater design freedom. * Delivers diverse text and animated effects, advancing V2X communication capabilities. SEOUL, South Korea, Nov. 19, 2025 ...
AIC to Showcase AI Optimized Server and Storage Solutions at SC25
TAIPEI, Nov. 19, 2025 /PRNewswire/ -- AIC will showcase its latest server and AI storage platforms this week at Supercomputing 2025 (SC25) inSt. Louis, highlighting solutions for fast growing AI, HPC, and enterprise workloads. Stop by AIC's booth (#305) to see new Gen5 systems, partner integrated...
Zilliz Collaborates with Pliops to Enable Billion-Scale Vector Search at Storage-Level Costs
Hardware-Accelerated Architecture Brings Enterprise RAG to New Scale and
Efficiency
REDWOOD CITY, Calif., Nov. 18, 2025 /PRNewswire/ -- Zilliz
WEKA Unveils Next-Gen WEKApod Appliances to Redefine AI Storage Economics
Powered by AlloyFlash, WEKApod Prime Delivers Breakthrough Cost Efficiency with
65% Better Price-Performance; WEKApod Nitro Offers Unprecedented Performance
Density with 2x Faster Speeds for Demanding AI Workloads
ST. LOUIS and CAMPBELL, Calif., Nov. 19, 2025 /PRNewswire/ -- From SC25: WEKA
MSI Accelerates AI and Data Center Innovation with Next-Gen Server Solutions at SC25
ST. LOUIS, Nov. 18, 2025 /PRNewswire/ -- MSI, a leading global provider of high-performance server solutions, showcases its next-generation computing and AI innovations at SuperComputing 2025 (SC25), Booth #205. MSI introduces its ORv3 rack solution and a comprehensive portfolio of power-efficien...
Supermicro Announces New AI Factory Cluster Solutions Based on NVIDIA Enterprise Reference Architectures and NVIDIA Blackwell AI Infrastructure to Simplify the Deployment of AI at Scale
* Supermicro offers complete, turnkey solutions based on NVIDIA-Certified Systems™ with the latest-generation NVIDIA accelerated computing platforms, leveraging Supermicro Data Center Building Block Solutions® (DCBBS) to accelerate time-to-online * Full-stack solutions comprising Supermicro's...
ASUS Showcases NVIDIA GB300 NVL72 at SC25
Showcasing the complete portfolio built on NVIDIA Blackwell architecture for
scalable supercomputing and AI enablement
ST. LOUIS, Nov. 18, 2025 /PRNewswire/ -- ASUS announced a showcase of its
comprehensiveAI infrastructure portfolio
INTAMSYS Launches the FUNMAT PRO 310 APOLLO: Redefining Continuous Production with High-Speed, High-Strength PAEK 3D Printing
From "Printing PEEK Well" to "Scaling PAEK Production"
FRANKFURT, Germany, Nov. 18, 2025 /PRNewswire/ -- INTAMSYS, a global leader
in industrial FFF 3D printing, officially launched today its next-generation
high-performance materials 3D printer, theFUNMAT PRO 310 APOLLO
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