Computer Hardware
GomSpace receives order for fast-deployment satellite solution valued at 2.4 MUSD
STOCKHOLM, Sept. 11, 2026 /PRNewswire/ -- GomSpace North America, LLC has received an order from an undisclosed defense customer in the United States with a value of 2.4 MUSD (22.6 MSEK) The agreement covers GomSpace's unique satellite platform kits that will form part of an end-to-end solution ...
2026-09-11 15:46
926
NeuroWatt Launches NeuroTeam, an Enterprise-Grade Agentic AI Workforce to Accelerate AI Agent Adoption
Integrating AI Agent governance, multi-model routing, and on-premises AI infrastructure, NeuroWatt also opens complimentary Agent application consultations TAIPEI, Sept. 9, 2026 /PRNewswire/ -- NeuroWatt announced the launch of NeuroTeam, an enterprise-grade Agentic AI Workforce designed to help...
2026-09-11 15:00
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Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
Arasan Chip Systems, announces its participation at the MIPI I3C® Interop Session in Taipei with its I3C® Host IP, I3C® Dual IP and I3C® Device IP on Oct 19-20, 2026 SAN JOSE, Calif., Sept. 10, 2026 /PRNewswire/ -- Arasan Chip Systems announces its participation in the I3C® Interoperability Sess...
2026-09-10 23:10
1546
MICROIP Secures Major US$20 Million Smart Residential Community Contract in Taiwan, Accelerating Edge AI Commercialization
Deploying Next-Generation Edge AI Architecture; New Project Secures Long-Term Revenue Visibility Starting October 2026 TAIPEI, Sept. 10, 2026 /PRNewswire/ -- MICROIP (TPEx: 7796), a leading provider of custom ASIC design services and Edge AI software-hardware integrated solutions, today announce...
2026-09-10 22:07
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IBM, Lockheed Martin Announce Swiss Quantum Innovation Hub at ETH Zurich, Anchored by Switzerland's First IBM Quantum Computer
In an extension of ongoing collaboration, IBM and Lockheed Martin plan to initiate research projects with select Swiss academic institutions. The Swiss National Supercomputing Centre at ETH Zurich will host an IBM Quantum System Two, expanding access across Swiss institutions to fuel the country...
2026-09-10 15:00
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Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers
- Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials - TOKYO, Sept. 10, 2026 /PRNewswire/ -- Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a pa...
2026-09-10 15:00
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How to effectively leverage AI-powered intelligent displays and cloud collaboration to transform the full teaching lifecycle
HANGZHOU, China, Sept. 10, 2026 /PRNewswire/ -- The education sector is entering a period of rapid digital transformation, with AI technologies reshaping expectations and amplifying good educational practices across primary, secondary, and higher education establishments. As generative AI and in...
2026-09-10 14:32
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TCL Showcases AI Inspired Life at IFA 2026 Through Its Screen Universe
From next-generation displays and AI-powered smart home experiences to sports-inspired moments, TCL presents an immersive vision of everyday life in the AI era. BERLIN, Sept. 10, 2026 /PRNewswire/ -- TCL today unveiled its vision for an AI Inspired Life at IFA 2026 through the "Inspiration Habit...
2026-09-10 14:07
1305
Play Without Limits, Create Without Compromise: Philips Evnia 34M2C8600PC Redefines the Gaming & Creator Workspace with Ultrawide QD-OLED Penta Tandem
SINGAPORE, Sept. 10, 2026 /PRNewswire/ -- Philips Evnia announced the launch of the 34M2C8600PC, a flagship 34-inch curved display engineered to eliminate the compromise between tournament-level gaming speed and color critical creative precision. Built on cutting-edge QD-OLED Penta Tandem technol...
2026-09-10 09:30
2227
DIMAAG and Toshiba Collaborate on SCiB™ - Based Energy Storage for the ZettaWatt™ Power Platform for AI Data Centers
FREMONT, Calif. and HOUSTON, Sept. 10, 2026 /PRNewswire/ -- DIMAAG-AI, Inc. (DIMAAG) and Toshiba International Corporation (TIC), a Toshiba America Inc. (TAI) Group Company and a wholly owned subsidiary of Toshiba Corporation (Toshiba), today announced a collaboration to develop next-generation e...
2026-09-10 00:00
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SuperX Announces an Update on the Progress of Share Repurchases Program, to Demonstrate Confidence in Long-Term Growth Value
SINGAPORE, Sept. 9, 2026 /PRNewswire/ -- SuperX AI Technology Limited (NASDAQ: SUPX) ("SuperX" or the "Company"), a Nasdaq-listed full-stack AI infrastructure solutions provider, today announced an update on the progress of its share repurchase program, demonstrating the Board's and management's ...
2026-09-09 20:20
3223
LattePanda Launches the LattePanda Mu Ultra: A Micro x86 Compute Module for On-Device AI
SHANGHAI, Sept. 9, 2026 /PRNewswire/ -- LattePanda Team
2026-09-09 20:00
1415
DFI Introduces One Board, Two CPU Generations Mini-ITX Platform to Advance Physical AI for Robotics and Automation
TAIPEI, Sept. 9, 2026 /PRNewswire/ -- DFI, a Qisda Group company and a global
leader in embedded motherboards and industrial computers, introduces the
ARH171/ARH173
2026-09-09 18:00
1347
Democratizing Aerospace-Grade Manufacturing: FibreSeek Opens Global Pre-Sale for FibreSeeker 3
Following a $4.7M Kickstarter Campaign, the 3D printing company FibreSeek Releases Limited 500-Unit Pre-Sale with Exclusive Early Bird Offers for Australia and the US market SYDNEY, Sept. 9, 2026 /PRNewswire/ -- Following a record-shattering Kickstarter campaign that raised nearly $4.7 million f...
2026-09-09 12:30
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DB HiTek Completes Reliability Qualification for 8-Inch 1,200 V SiC MOSFET Process
* Establishes World's First Complete 8-Inch SiC Foundry Process Flow * Provides First- and Second-Generation PDKs to Customers, with Third-Generation PDK Scheduled for November; Expected to Shorten Product Development Time by More Than One Year SEOUL, South Korea, Sept. 9, 2026 /PRNewswire/ -...
2026-09-09 09:00
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Quantinuum Finalizes $100 Million CHIPS R&D Award with U.S. Department of Commerce to Advance Trapped-Ion Quantum Computer Manufacturing in the US
* The federal funding supports critical R&D and U.S. quantum semiconductor manufacturing capabilities needed to scale fault-tolerant trapped-ion quantum computing. * Company partnering with GlobalFoundries to fabricate next-gen ion traps and control electronics, and Monarch Quantum to develop...
2026-09-08 19:30
2905
Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection
HSINCHU, Sept. 8, 2026 /PRNewswire/ -- Spirox (TWSE: 3055), today hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications. Spirox also ...
2026-09-08 18:00
1731
Karrie International's First Batch Vera Rubin Deliveries and Rising ASIC Server Volume Drive Expected Q4 Revenue Record
HONG KONG, Sept. 8, 2026 /PRNewswire/ -- Global leading server mechanical engineering solutions provider – Karrie International Holdings Limited ("Karrie International" or the "Company", together with its subsidiaries, the "Group"; stock code: 1050.HK) announced that the first batch of NVIDIA Ver...
2026-09-08 16:14
1522
SKF advances Insight bearing technology through collaboration with Sentea
SKF Core, a new integrated hardware platform, simplifies deployment of SKF Insight bearings, powered by fiber-optic sensing technology, and expands bearing intelligence applications. This, and other SKF solutions, will be showcased at AMB 2026 in Stuttgart. GOTHENBURG, Sweden, Sept. 8, 2026 /PRN...
2026-09-08 16:04
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Fujitsu develops diamond-spin quantum computer prototype
New diamond-spin quantum computer prototype incorporating tin-vacancy (SnV) centers into photonic integrated circuits marks significant step toward quantum computing scalability KAWASAKI, Japan, Sept. 8, 2026 /PRNewswire/ -- Fujitsu today announced that it has developed the world's first working...
2026-09-08 15:15
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