SHANGHAI, July 12, 2017 /PRNewswire/ -- ACM Research, Inc. today announced that it has achieved damage-free cleaning on patterned wafers in the mass production line of Shanghai Huali Microelectronics Corporation (HLMC) by using ACM's proprietary Timely Energized Bubble Oscillation (TEBO) megasonic cleaning technology.
"Reducing defect density in the IC mass production process in advanced nodes is much more difficult than ever," Mr. Haibo Lei, President of HLMC, mentioned. "We have used TEBO cleaning technology to effectively remove fine particles in patterned wafers without damage in our production line." ACM's recently developed TEBO technology solves the problem of pattern damages caused by transit cavitation in the conventional megasonic clean process. By using TEBO, the cavitation becomes stable without bubble implosion or collapse during megasonic cleaning processing. "We have shipped multiple single wafer cleaners equipped with our proprietary TEBO technology to multiple customers in Asia," Dr. David Wang, CEO of ACM Research, Inc., noted. "With device structures converting from 2D to 3D, we believe our revolutionary TEBO cleaning technology can play an important role in improving yields for customers."
About HLMC
HLMC is a leading 300mm pure-play foundry in mainland China. Founded in 2010, HLMC operates a 300mm wafer fab which is the first IC manufacturing facility adopting the Fully Automated Material Handling System (AMHS) in mainland China, with the capacity of 35,000 wafers per month. HLMC broke ground on the second 300mm wafer fab in 2016. The design capacity of the new fab is 40,000 wafers per month.
HLMC offers a broad selection of processes across 55nm to 28nm technology node for a wide range of applications including smart phones, consumer electronics, and smart cards. HLMC is devoted to providing domestic and overseas customers with comprehensive foundry solutions and value-added services. Headquartered in Shanghai, China, HLMC extends its sales and technical supports to customers in Taiwan, Japan and North America.
About ACM
ACM Research, Inc. was founded in 1998 in Silicon Valley. In September 2006, ACM moved its main operations to Asia, forming its subsidiary ACM Research (Shanghai), Inc. ACM aims to become the global leader in wet process equipment for semiconductor manufacturers worldwide by providing a full range of solutions, including single wafer cleaners, copper polishers, and copper plating tools employing innovative, proprietary technology. ACM has a strong IP portfolio with over 100 patents granted among 400 patent applications internationally.
