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World's most powerful 1500 V(DC) string inverter: Infineon module and chip technology powers 250 kW PV solution from Sungrow

2020-03-31 11:24 4692

MUNICH, March 31, 2020 /PRNewswire/ -- First introduced at Intersolar Europe 2019, Sungrow offers the SG250HX PV string inverter that features a high capacity of 250 kW. On board: customized EasyPACK™ 3B power modules from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), equipped with the latest TRENCHSTOP™ and CoolSiC™ chip technologies. Supporting a high voltage of 1500 VDC and 800 VAC, the Sungrow SG250HX string inverter offers a maximum of 99 percent efficiency.

Weighing only 95 kg with a dimension of 1051 x 660 x 363 mm3 the Sungrow SG250HX boasts a power density of approximately 1000 W/liter. This not only makes it the most powerful inverter but also one with leading power density. The inverter features Infineon’s customized EasyPACK(TM) 3B power modules with the latest TRENCHSTOP(TM) and CoolSiC(TM) chip technologies.
Weighing only 95 kg with a dimension of 1051 x 660 x 363 mm3 the Sungrow SG250HX boasts a power density of approximately 1000 W/liter. This not only makes it the most powerful inverter but also one with leading power density. The inverter features Infineon’s customized EasyPACK(TM) 3B power modules with the latest TRENCHSTOP(TM) and CoolSiC(TM) chip technologies.

 

Weighing only 95 kg with a dimension of 1051 x 660 x 363 mm3, the Sungrow SG250HX boasts a power density of approximately 1000 W/liter. This not only makes it the most powerful inverter but also one with leading power density. Thanks to Infineon's new technologies, the heat sink can be reduced in both size and weight significantly. Additionally, the Infineon products also enable weight savings by reducing the passive components through increasing switching frequency.

The system features twelve MPPTs (Maximum Power Point Tracking) and a flexible block design allowing for up to 6.3 MW blocks. This makes it an ideal solution for utility scale photovoltaic applications. With smart forced air-cooling technology, the SG250HX can operate at extremely high temperatures without de-rating.

Infineon supported Sungrow's goals with the new EasyPACK 3B power module. Combining Si and SiC chip technologies, proprietary know-how and production capacity in frontend and backend, Infineon was able to realize customer specific solutions within months.

Photo - https://photos.prnasia.com/prnh/20200330/2763712-1?lang=0
Logo - https://photos.prnasia.com/prnh/20190619/2502113-1-LOGO?lang=0

Source: Infineon
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