AI Semiconductor Innovator DEEPX Recognized by NYSE and WEF
The Leading Player in On-Device AI Is Realizing the Physical AI Era While Drawing Wall Street's Attention NEW YORK, Oct. 31, 2025 /PRNewswire/ -- As AI begins to sustainably generate tangible value, global AI semiconductor innovator DEEPX (CEO Lokwon Kim) today announced it was recently selected...
SEMIFIVE Submits Securities Registration for KOSDAQ Listing
* Secures Only 'One-Stop AI ASIC Solution' in Korea and Big-Die Design Capability * 2025 Q3 Cumulative Revenue Expected to Surpass KRW 90 Billion; Large AI Chip Mass Production Begins, Growth to Accelerate from Q4 * Wins Successive AI Chip Design Projects for Global Customers, Expanding int...
SEMIFIVE Secures Preliminary Approval for KOSDAQ Listing
* Provides AI ASIC solutions for fabless companies and device manufacturers * New order volume surges: KRW 5.7 billion (2020), KRW 28.6 billion (2022), KRW 100 billion (2024) SEOUL, South Korea, Oct. 1, 2025 /PRNewswire/ -- SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design, an...
SEMIFIVE Files for Pre-IPO Review on KRX
SEOUL, South Korea, July 17, 2025 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced that it has submitted its preliminary IPO application to the Korea Exchange (KRX), marking the official start of its listing proce...
SEMIFIVE Achieves Over KRW 100 Billion in Revenue in 5 Years - Remarkable Year-over-Year Growth Rate of 57%
* Built a differentiated portfolio and accelerated revenue growth with its independently developed reusable and automated design platform * Secured key semiconductor IP and laid the foundation for long-term growth through next-generation technological innovations SEOUL, South Korea, March 25, ...
SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for High-Performance Multi-Die Designs
The Platform Helps Meet PPA Goals and Accelerate Time-to-Market SEOUL, South Korea, Nov. 11, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced their collaboration with Synopsys to develop a cutting-edge high-...
SEMIFIVE Joins World Economic Forum's Global Innovators Community
SEOUL, South Korea, Oct. 28, 2024 /PRNewswire/ -- Expected to engage in sharing insights and connecting with public and private sector leaders to solve key issues for people and planet SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announce...
SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms
Strengthening SoC platforms for high-performance custom silicon with Arm Neoverse CSS technology SEOUL, South Korea, Oct. 13, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer in platform-based custom silicon, today announced the expansion of its collaboration with Ar...
SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel
Collaboration on design and development using 4nm process technology, with mass production targeted for Q1 2026 SEOUL, South Korea, Oct. 10, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the conclusion of a...
On-Device AI Chip Company DEEPX Officially Invited to World Economic Forum
DALIAN, China and SEOUL, South Korea, July 1, 2024 /PRNewswire/ -- DEEPX, a pioneering AI semiconductor technology company led by CEO Lokwon Kim, has made history as the first AI semiconductor company in the world to be invited to the World Economic Forum. This esteemed gathering of global econom...
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
Developing HPC Chiplet Platform to Feature LPDDR6 Memory Interface SEOUL, South Korea, June 12, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Te...
SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform
The HPC platform to be built on Samsung SF4X with LPDDR6 Memory Interface
SEOUL, South Korea, June 11, 2024 /PRNewswire/ -- SEMIFIVE, a leading SoC
design platform, announced today it has joinedArm Total Design
SEMIFIVE Signs MOU with Atron Technologies to Collaborate on Semiconductor Design
Expected to expand global business in the Chinese market SEOUL, South Korea, May 23, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced its agreement of MOU withChina-based Atron Technologies, on May 23, 2024. T...
Korean Semiconductor Industry Titans Back DEEPX in Series C Funding Round
SEOUL, South Korea, May 10, 2024 /PRNewswire/ -- DEEPX
SEMIFIVE Collaborates with MetisX in Developing CXL-based Memory Accelerator Chip
- Collaboration on prototype design and mass product development with Samsung Foundry's 4nm process technology SEOUL, South Korea, April 24, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced a collaboration wit...
DEEPX Expands First-Generation AI Chips into Intelligent Security and Video Analytics Markets
Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024. TAIPEI and SEOUL, South Korea, April 23, 2024 /PRNewswire/ -...
DEEPX Expands First-Generation AI Chips into Intelligent Security and Video Analytics Markets
Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024. LAS VEGAS and SEOUL, South Korea, April 19, 2024 /PRNewswire...
DEEPX Unveils 'All-in-4 AI Total Solution' at CES 2024: Four AI Chips Transforming On-Device AI Market
- All-in-4 AI Total Solution comprises four chips spanning various performance levels, each with different features and interfaces optimized for diverse edge applications. - After demonstrating the originality of its technology with engineering products last year, DEEPX conducted pre-produc...
DEEPX CEO Lokwon Kim to Speak at CES 2024 Panel on the Future of AI Hardware and Chips
Lokwon Kim represents global AI chip companies at a panel on innovations enabling the on-device AI era * DEEPX CEO Lokwon Kim will discuss timing and plans for on-device AI at CES 2024 panel * DEEPX to exhibit ultra-low power AI chip solutions in North Hall, Booth #8953 LAS VEGAS and SEOUL, ...
DEEPX's DX-M1 Chip Recognized at CES 2024 as Leading AI of Things Solution
World's only AI accelerator that combines low power, high performance, high efficiency, and cost-effectiveness hits new milestone of deployment to over 40 global companies - DX-M1 AI chip has surpassed 40 global customers who are trialing it as part of DEEPX's Early Engagement Customer Prog...
