Semiconductors
KLEVV LAUNCHES ENHANCED SSD LINEUP: CRAS C925G, CRAS C910G NVME SSDS, AND NEO N410+ SATA SSD
NEXT-GEN PERFORMANCE, SUPERIOR THERMAL MANAGEMENT, AND VERSATILE STORAGE FOR DEMANDING APPLICATIONS HONG KONG, July 24, 2025 /PRNewswire/ -- KLEVV, the leading consumer memory and storage brand introduced by Essencore, is excited to unveil the latest refresh of its SSD (solid-state drive) lineup...
2025-07-24 10:00
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SK hynix Announces 2Q25 Financial Results
* Reports revenues of 22.232 trillion won, operating profit of 9.2129 trillion won, net profit of 6.9962 trillion won * Both revenues, operating profit at all-time highs following brisk sales of AI memory * Company to provide best-in-class AI products timely for customer satisfaction, marke...
2025-07-24 06:47
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Baya Systems Receives Frost & Sullivan's 2025 Global Semiconductor IP Interconnect Solutions Technology Innovation Leadership Recognition for Advancing Flexible, Scalable High-Performance Architectures
Recognized for technology leadership in unified interconnect architecture, customer success, and its ability to meet emerging needs across AI and HPC markets SAN ANTONIO, July 22, 2025 /PRNewswire/ -- Frost & Sullivan is pleased to announce thatBaya Systems has been recognized with the 2025 Glob...
2025-07-22 21:00
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SEMI Foundation Launches NSF-Powered National Call for Applicants of Regional Nodes to Meet Industry Needs for the U.S. Microelectronics Workforce
Informational Webinar Scheduled for July 23 at 3 p.m. EDT to Support Interested Applicants MILPITAS, Calif., July 21, 2025 /PRNewswire/ -- The SEMI Foundation is thrilled to announce the launch of the application process for organizations seeking to become Regional Nodes in the National Network ...
2025-07-21 22:00
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DIVIDEND ALERT: US$0.836 CASH DIVIDEND TO BE DISTRIBUTED ON JULY 25 TO ChipMOS ADS HOLDERS PRE-WITHHOLDING TAX AND FEES
HSINCHU, July 21, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2025-07-21 18:00
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UNISOC Launches Flagship 4G SoC T7300, Delivering Comprehensive Upgrades in Entertainment and Gaming
Highlights: * 6nm, octa-core, Dual-A78 up to 2.2GHz，AnTuTu scores 510,000+ * Powered by the 7th-gen Vivimagic Engine, excellent noise reduction with hardware multi-frame and temporal noise reduction * Powered by UNISOC Miracle Gaming Engine，delivers stable, smooth 90Hz frame rates for mains...
2025-07-21 17:04
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DA NANG GLOBAL BUSINESS SUMMIT 2025: DA NANG NEW AREA: TECHNOLOGY-DRIVEN GROWTH ACROSS INDUSTRIES
DA NANG, Vietnam, July 21, 2025 /PRNewswire/ -- On August 12, 2025, the Da Nang Global Business Summit 2025 will officially take place at Wink Icon Danang Riverside,Da Nang city. The event will bring together over 50 experts, leaders, and senior executives from various sectors, including technolo...
2025-07-21 15:08
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SEMIFIVE Files for Pre-IPO Review on KRX
SEOUL, South Korea, July 17, 2025 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced that it has submitted its preliminary IPO application to the Korea Exchange (KRX), marking the official start of its listing proce...
2025-07-18 11:52
5059
Synopsys Completes Acquisition of Ansys
Creating the Leader in Engineering Solutions from Silicon to Systems News Highlights: * Combines leaders in silicon design, IP and simulation and analysis to enable customers to rapidly innovate AI-powered products * Now positioned to win in an expanded $31 billion total addressable market...
2025-07-17 21:01
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Mouser Brings Innovation and Insights to EMAX Asia 2025
SHANGHAI, July 17, 2025 /PRNewswire/ -- Mouser Electronics
2025-07-17 10:52
2795
ZEISS Group Appoints Martin Fischer as President and CEO of ZEISS Greater China
SHANGHAI, July 17, 2025 /PRNewswire/ -- ZEISS Group recently announced that Martin Fischer will officially take on the role of President and CEO of ZEISS Greater China, effective from October 1, 2025, reporting directly to Andreas Pecher, President and CEO of the ZEISS Group. Martin Fischer succe...
2025-07-17 10:00
3514
InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universa...
2025-07-15 22:54
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ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
All Geographic Regions Reported Growth, with Americas, EMEA, and Japan Recording Double Digit Increases MILPITAS, Calif., July 15, 2025 /PRNewswire/ -- Electronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million regi...
2025-07-15 22:00
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FIC Global Leads the Switch from Electrons to Photons for AI Factories
With 16 years of expertise in optical communications, FIC Global is powering the next wave of advancement for AI with leading-edge optical transceivers up to 1.6T and beyond. TAIPEI, July 15, 2025 /PRNewswire/ -- As artificial intelligence continues to reshape the global economy, fiber optic con...
2025-07-15 20:09
2037
NX Group Receives Intel's 2025 EPIC Supplier Award
- Only Logistics Provider Selected from All of Intel's Global Supply Chains - TOKYO, July 15, 2025 /PRNewswire/ -- The NX Group has received the 2025 EPIC Supplier Award from Intel Corporation ("Intel"), the world's leading semiconductor manufacturer. The award recognizes outstanding companies in...
2025-07-15 15:00
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SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging and Strengthen Competitiveness in Automotive High-Performance Semiconductors
SEOUL, South Korea, July 15, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on ...
2025-07-15 08:00
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SolidVue and Lumotive Collaborate to Advance Next-Generation LiDAR Systems
SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- SolidVue, a leader in SPAD sensor IC technology, announced a strategic collaboration with Lumotive, a US-based pioneer in programmable optical semiconductors, to develop next-generation LiDAR systems. The partnership brings together industry-leadi...
2025-07-14 22:00
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JNTC Unveils Next-Generation Glass Substrate for Semiconductors
Carving Semiconductors into Glass, the Dream Material SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- JNTC Co., Ltd. (KOSDAQ: 204270), a leading advanced materials company, hosted a product launch onJune 30 at the Korea Exchange Conference Hall, unveiling its new Through-Glass-Via (TGV) glass ...
2025-07-14 20:00
2700
SurplusGLOBAL Receives Minister of Trade Award at '2025 Trade Security Day'
SEOUL, South Korea, July 11, 2025 /PRNewswire/ --
2025-07-11 20:00
4425
Mouser Electronics New Product Insider: Over 15,000 New Parts Added in Second Quarter of 2025
SHANGHAI, July 11, 2025 /PRNewswire/ -- Mouser Electronics
2025-07-11 18:41
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