Semiconductors

Discover More on One Trip: C-TOUCH & DISPLAY, FILM & TAPE EXPO and ITWA 2026 Open October 27

Global buyers can explore advanced displays, functional materials, robotics, electronics manufacturing and intelligent technologies through a connected exhibition program in Shenzhen, China. SHENZHEN, China, Oct. 15, 2026 /PRNewswire/ -- As artificial intelligence, advanced electronics and intel...

2026-10-16 14:44 1939

LITEON Showcases at NVIDIA MGX Ecosystem at OCP, Highlighting 800 VDC Power Technologies to Advance Next-Generation AI Infrastructure

SAN JOSE, Calif., Oct. 15, 2026 /PRNewswire/ -- LITEON Technology (2301.tw) is invited to participate in the NVIDIA MGX Ecosystem Ceremony held during the 2026 OCP Global Summit. Representing LITEON were John Chang, General Manager of LITEON Cloud Infrastructure Platform and Solution SBG, Bob Wen...

2026-10-16 10:16 2916

ModelBest and OpenBMB Launch MiniCPM-V 4.7, Bringing a 35B Multimodal MoE Model to Phones and Tablets With About 3 GB of Memory

BEIJING, Oct. 15, 2026 /PRNewswire/ -- ModelBest and the OpenBMB community announced the release of MiniCPM-V 4.7, the latest addition to their open-source on-device multimodal model series. Available in 35B-A3B and 1B versions, the release brings advanced image, document and video understanding ...

2026-10-15 17:34 2093

PEGATRON Brings AI Infrastructure from Design to Deployment at OCP Global Summit 2026

SAN JOSE, Calif., Oct. 14, 2026 /PRNewswire/ -- PEGATRON, a globally recognized provider of comprehensive AI infrastructure and server solutions, will showcase its capabilities in developing and manufacturing next-generation AI infrastructure at OCP Global Summit 2026. Under the theme "Scaling In...

2026-10-14 19:09 1252

CyberTAN Unveils Pallas Series Liquid-Cooled 102.4 Tbps Ethernet Switch Platform Blueprint at OCP Global Summit 2026

Collaborates with Marvell on Full Liquid-Cooled 102.4 Tbps T100 Ethernet Switch Platform Blueprint SAN JOSE, Calif., Oct. 13, 2026 /PRNewswire/ -- CyberTAN Technology, Inc.

2026-10-14 03:00 3675

SmartSens Showcases Automotive Vision Sensing Portfolio at AutoSens Europe 2026

SmartSens presents automotive-grade image sensors and integrated imaging-and-computing solutions for a range of vehicle applications BARCELONA, Spain, Oct. 13, 2026 /PRNewswire/ -- At AutoSens Europe 2026, held from September 22 to 24 at La Farga de L'Hospitalet in Barcelona, SmartSens, a techno...

2026-10-13 22:41 2332

Cellid Joins Qualcomm's the Snapdragon START program to accelerate the development of AR glasses

Cellid to Showcase Its "Crux" AR Glasses at Augmented Enterprise Summit 2026 TOKYO, Oct. 12, 2026 /PRNewswire/ -- Cellid Inc., a developer of displays and spatial recognition engines for next-generation AR glasses, today announced that it has joined Snapdragon® START (Snapdragon Scalable Turnkey ...

2026-10-12 21:00 1880

GMIF2026 Annual Awards Unveiled: Samsung, Sandisk, Lenovo, Silicon Motion, BIWIN, and More Recognized

SHENZHEN, China, Oct. 12, 2026 /PRNewswire/ -- The 5th GMIF Innovation Summit  (Global Memory Innovation Forum 2026, GMIF2026) recently concluded at the Renaissance Shenzhen Bay Hotel, co-hosted by the Shenzhen Memory Industry Association (SMIA)and the School of Integrat...

2026-10-12 15:13 2619

Trusted AI Agents Must Be Anchored in Silicon

As AI agents begin acting on users' behalf, eMemory's subsidiary, PUFsecurity, believes that device identity, attestation and protected on-chip state will decide how far they can be trusted SAN JOSE, Calif., Oct. 9, 2026 /PRNewswire/ -- The first wave of generative AI answered questions and prod...

2026-10-09 22:00 2870

ZEISS acquires Ceres Holographics to accelerate holography industrialization

Combining decades-long holography expertise with complementary holographic innovations JENA, Germany, Oct. 8, 2026 /PRNewswire/ -- ZEISS has announced the acquisition of Ceres Holographics, a pioneering holographic technology company headquartered in Livingston, Scotland. Ceres Holographics beco...

2026-10-08 17:12 1861

E&R Engineering Spotlights High-Precision CPO and Advanced Packaging Solutions at SEMI West 2026

KAOHSIUNG, Oct. 6, 2026 /PRNewswire/ -- E&R Engineering Corp. (TPEX: 8027), a specialist in semiconductor laser and plasma processing equipment, will highlight its latest semiconductor laser processing breakthroughs at SEMI West 2026, focusing on high-precision laser drilling for Fiber Array Unit...

2026-10-06 22:00 2791

Aligning with Global Regulations: iMQ Technology's SQ713x Secure Element Achieves SESIP and PSA Certified Level 3

Passes Keysight's physical attack testing and TrustCB audit, establishing a top-tier hardware root of trust to accelerate global IoT compliance across Matter, EU CRA, RED, and US Cyber Trust Mark. HSINCHU, Oct. 5, 2026 /PRNewswire/ -- To help global IoT manufacturers navigate rising internationa...

2026-10-05 21:00 4364

XtalPi and Fangda Carbon Deploy Predictive AI to Optimize Cost and Material Efficiency in Graphite Electrode Manufacturing

* The jointly developed AI model has passed comprehensive acceptance testing and is now operating within Fangda Carbon's production workflow. * By forecasting performance and screening formulations before physical trials, the system meets cost optimization targets while enabling rapid evaluat...

2026-10-02 22:01 12767

Cervoz Launches MIL-STD-810H M.2 NVMe SSDs for Mission-Critical Embedded Systems

T449 and T459 Series deliver PCIe Gen4 performance, hardware-based data security, and rugged reliability for defense, aerospace, and industrial applications TAIPEI, Oct. 1, 2026 /PRNewswire/ -- Cervoz Technology, a leading provider of industrial storage, memory, and expansion module solutions, a...

2026-10-01 21:05 2220

SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program

* Accelerates commercialization of robotics AI chip through end-to-end "Spec Hand-off" development * Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-S * Expands applications beyond data center, HPC and edge AI into Physical AI, diversifying...

2026-10-01 13:00 4008

WiMi Researches Quantum Computing Simulation Model Based on Hybrid Parallel Architecture

BEIJING, Sept. 30, 2026 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WIMI) ("WIMI" or the "Company"), a leading global technology provider focused on core issues in quantum computing simulation and specializing in high-performance quantum simulation technology, is developing a quantum comput...

2026-09-30 23:25 2129

LG Innotek Accelerates Corporate Transformation Driven by Semiconductor Substrates and Physical AI

* Building stable earnings resilience with semiconductor substrates * Expanding physical AI businesses to secure future growth engines SEOUL, South Korea, Sept. 30, 2026 /PRNewswire/ -- LG Innotek is demonstrating tangible results from the transformation of its business portfolio, delivering...

2026-09-30 20:00 3519

BOE holds Innovation Partner Conference 2026, navigating new industrial landscape through optronics integration

BEIJING, Sept. 29, 2026 /PRNewswire/ -- The BOE Innovation Partner Conference 2026 (BOE IPC 2026) opened in China National Convention Center Phase II on September 22, with the theme of "Display for Interaction, Optronics for Tomorrow." As the ninth edition of BOE's flagship global event for displ...

2026-09-29 18:59 2429

oToBrite Teams Up with SINTRONES at APTA EXPO 2026 to Deliver a Comprehensive Bus Safety Solution

HSINCHU, Sept. 29, 2026 /PRNewswire/ -- oToBrite Electronics, a leading automotive Vision AI company, will showcase its latest safety technologies at APTA TRANSform & EXPO 2026 in Chicago, focusing on intelligent buses and heavy commercial vehicles. Featured solutions include oToGuard 2.0 Level 2...

2026-09-29 17:30 1422

SEMIFIVE Secures USD 52 Million AI Accelerator Contract with U.S. Fabless Company, Validating End-to-End ASIC Model in North America

* First Spec Hand-off project in North America marks SEMIFIVE's largest single contract to date * Next-generation data center AI chip to integrate LPDDR6, PCIe Gen5, and Big Die technologies * Tape-out targeted for the first half of 2027, followed by global mass production beginning in 2...

2026-09-29 13:00 3196
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