Semiconductors
ROHM Adds New Lineup of 17 High-performance Op Amps Enhancing Design Flexibility
KYOTO, Japan, March 31, 2026 /PRNewswire/ -- ROHM Co., Ltd. has added the new CMOS Operational Amplifier (op amp) series "TLRx728" and "BD728x" to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems. A broad lineup also makes prod...
DEEPX Secures 27 Commercial Orders Across 8 Countries Within 7 Months of Mass Production
Global adoption of Physical AI chips accelerates as industry demand expands across robotics, smart factories, and edge AI — backed by a growing partner ecosystem and an early global supply chain spanning Asia, North America, and Europe. SEOUL, South Korea, March 27, 2026 /PRNewswire/ -- DEEPX, a...
Nota AI and SiMa.ai Sign Strategic Partnership for Physical AI Technology Collaboration
"Combining AI Optimization with High Performance and Efficiency MLSoCs to Lead the Physical AI Market" * Nota AI's AI Optimization Technology Meets SiMa.ai's MLSoC™ Product Family, Maximizing On-Device AI Performance for Physical AI * Joint Development and Commercialization of AI Solutions fo...
Linktel, Founding Member of XPO MSA, to Debut 12.8T Liquid-Cooled Module at OFC 2026
LOS ANGELES, March 17, 2026 /PRNewswire/ -- Linktel Technologies, a globally recognized company in optical transceiver development and manufacturing, today announced its 12.8T XPO liquid-cooled optical module will be featured in live demonstrations at OFC 2026. Designed for the escalating density...
TIER IV and Isuzu advance autonomous transit with deployment of Level 4 buses powered by NVIDIA DRIVE Hyperion
TOKYO, March 16, 2026 /PRNewswire/ -- TIER IV, Inc.
SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026
* SK hynix to participate in 'GTC 2026' in San Jose, March 16-19 * Exhibition themed 'Spotlight on AI Memory' to unveil full lineup of AI memory solutions * Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, to attend and expand global AI collaborations SEOUL,...
SEMIFIVE Pulls Ahead in AI ASIC Market, Expanding Lead with Successive NPU Project Wins
* Secures KRW 18 Billion Project for Next-Generation AI NPU, Solidifying Leadership in High-PerformanceASIC Market * Underscores AI Semiconductor Design Competitiveness with Consecutive 4nm AI Chip Contracts SEOUL, South Korea, March 13, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provi...
LG Innotek Secures "Leadership A" in CDP Climate Change Assessment for Third Consecutive Year
* Achieved "Leadership A" grade, awarded to top 3% of 22,100 global companies evaluated. * Selected for "Carbon Management Sector Honors" for seventh consecutive year. * Achieved 60% company-wide renewable electricity transition rate across domestic and overseas sites, making excellent pro...
ROHM's New SiC Power Modules Now Available for Online Purchase
KYOTO, Japan, March 12, 2026 /PRNewswire/ -- ROHM Co., Ltd. has begun online sales of new SiC molded modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and need for energy conservation, these products promote the adoption of high-efficiency...
RiseLink Redefines Edge AI with the BK7259 "Powerhouse" and R2 Unified AI Developer Platform at Embedded World 2026
NUREMBERG, Germany, March 11, 2026 /PRNewswire/ -- RiseLink Technologies, a global leader in low-power connectivity with a 20-year legacy in semiconductor innovation, today announced the launch of its BK7259 Edge AI powerhouse at Embedded World 2026. As the centerpiece of the new R2 Unified AI De...
SK keyfoundry Successfully Develops 450V-2300V SiC Planar MOSFET Process Platform, Secures New 1200 V Order, Marking the Beginning of Its Full-Scale SiC Business
* Successfully develops SiC Planar MOSFET process platform for 450V–2300V, securing high reliability and yield competitiveness * Accelerates SiC-based compound semiconductor foundry business by initiating 1200V SiC MOSFET development for a new customer SEOUL, South Korea, March 11, 2026 /PRNe...
Nota AI to Showcase End-to-End On-Device AI-from Edge Optimization to Real-World Industrial Deployment-at Embedded World 2026
* Over 40 AI models lightweighted and optimized across more than 100 devices; technologies adopted by global leaders including Samsung and NVIDIA * Live demonstrations of LLM and computer vision models running in real time on Qualcomm and Arm hardware, alongside a Device Farm exhibit showcasin...
Rayence Expands High-Speed CMOS X-ray Detector "Flash Series" for Semiconductor AXI and 3D X-ray CT Inspection in AI and HBM Manufacturing
– Proven supply record with global top-tier inspection system manufacturers – Optimized for high-speed inline semiconductor AXI and 3D X-ray CT platforms HWASEONG, South Korea, March 5, 2026 /PRNewswire/ -- With accelerating global investment in AI infrastructure and surging demand for High Bandwi...
Barcelona Awaits | Join OSCAL at MWC 2026 to Discover the Future of Technology
BARCELONA, Spain, March 4, 2026 /PRNewswire/ -- From March 2–5, 2026, OSCAL will showcase its latest innovations at Mobile World Congress 2026 inBarcelona, the world's leading connectivity event. Centered on AI and next-generation communication, the show brings together global tech pioneers to sh...
BBTech and ARKITEKT Partner to Scale Semiconductor Infrastructure Across Global Markets
SUNNYVALE, Calif. and TAYLOR, Texas, March 4, 2026 /PRNewswire/ -- BBTech Co., Ltd. ("BBTech"), a Korean provider of semiconductor hook-up and high-purity flow system engineering solutions, and ARKITEKT EQUITY ("ARKITEKT"), a technology-focused private equity firm, today announced a strategic par...
YY-IC Achieves ISO 9001 Certification, Launching Data-Driven Intelligence Platform to Mitigate Risks in Rare and EOL Electronic Component Supply Chains
By integrating 15 years of industry expertise with a 10-million SKU database, YY-IC tracks "Supply Chain Stress Points" to provide global OEM partners with a verified, high-velocity alternative to traditional authorized channels. NEW YORK, March 2, 2026 /PRNewswire/ -- As the global electronics ...
SK hynix and Sandisk Begin Global Standardization of Next-Generation Memory 'HBF'
- SK hynix and Sandisk form a joint workstream under OCP to start standardization - New memory layer between HBM and SSD to secure scalability and power efficiency in AI inference infrastructure SEOUL, South Korea, Feb. 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix...
SurplusGLOBAL Builds on SEMICON KOREA 2026 Success, Upgrades SemiMarket for Harvest Parts Discovery and Bulk Sourcing
SEOUL, South Korea, Feb. 25, 2026 /PRNewswire/ -- SurplusGLOBAL has rolled out
a set of upgrades to SemiMarket (www.SemiMarket.com
SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
* Reinforces leadership as a trusted partner in specialized SoC design * Diversifies the ASIC portfolio with highly complex private computing solutions SEOUL, South Korea, Feb. 19, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced t...
Genicom to Showcase High-Temperature UV Sensor Solutions at AFPE 2026 in Shanghai
* Delivering stable UV measurement in extreme environments up to 250°C with GaN-based technology * Strengthening its industrial UV measurement portfolio for global smart factory markets SEOUL, South Korea, Feb. 18, 2026 /PRNewswire/ -- Genicom Co., Ltd. (CEO Jung-hwan Son), a specialist in ul...
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