Semiconductors
Macronix's sNOVA Technology Recognized with IEEE Milestone Award
Marking a Historic Achievement as the First Taiwanese Semiconductor Company to Receive This Prestigious Honor HSINCHU, Nov. 5, 2026 /PRNewswire/ -- Macronix International Co., Ltd. (TSE: 2337), a leading integrated device manufacturer in the non-volatile memory (NVM) market, today announced its ...
Getac ZX10 Rugged Tablets Bring Real-Time Visibility to Ward Transport & Logistics Dock Operations
LTL carrier replaces legacy Windows devices across 24 service centers to
streamline dock operations and improve freight visibility
IRVINE, Calif., Nov. 5, 2026 /PRNewswire/ -- Getac North America
SOLUM and Infineon Expand Collaboration on HVDC Power Solutions for AI Data Centers
* MoU covers intermediate bus converters, battery backup units and power supply units * SOLUM showcases rack-level power solutions incorporating Infineon technologies, including a 26 kW-class 800 Vdc BBU DC/DC converter SEOUL, South Korea, Nov. 5, 2026 /PRNewswire/ -- SOLUM Co., Ltd. (KRX: 24...
Skymizer and MiTAC Computing to Showcase a 2.8-Trillion-Parameter AI Model Running on a Single Air-Cooled Server at SC26
2 TB card-memory configuration is designed to fit Kimi K3 within one server for enterprise on-premises deployment TAIPEI, Nov. 5, 2026 /PRNewswire/ -- Skymizer and MiTAC Computing today announced a joint showcase at SC26 featuring Moonshot AI's Kimi K3—a 2.8-trillion-parameter mixture-of-experts...
NIDS Co., Ltd. Confirms CES 2027 Participation, Pursues Expansion of Global Supply Chain for Environmental Sensors
Company introduced optical and gas sensors at SEDEX and is strengthening its composite sensor business for robotics, home appliances, automotive, and smart building applications SEOUL, South Korea, Oct. 31, 2026 /PRNewswire/ -- Environmental sensor manufacturer NIDS Co., Ltd. has confirmed its p...
KLC Highlights TTV Thermal Testing for AI/HPC and Liquid Cooling, Chip-Wafer Layout Design, Alongside High-Voltage EV Heating Solutions
The Taiwan-based manufacturer supports thermal validation for chip-wafer layout design, planning, design verification, high-performance computing, cold plates, liquid cooling, and electric vehicle thermal management. TAICHUNG, Oct. 29, 2026 /PRNewswire/ -- Taiwan King Lung Chin PTC Co., Ltd. (K...
TOYO Confirms U.S. Customs and Border Protection Release of Ethiopia-Produced Solar Cells
TOKYO, Oct. 29, 2026 /PRNewswire/ -- TOYO Co., Ltd. (Nasdaq: TOYO) (OTC: TOYWF) ("TOYO" or the "Company"), a solar manufacturing company, today announced that U.S. Customs and Border Protection ("CBP") has released shipments of solar cells produced at the Company's facility in Ethiopia, following...
GMIF2026 Exhibition Recap: Innovation Across the AI Memory & Storage Chain on Show
SHENZHEN, China, Oct. 23, 2026 /PRNewswire/ -- The 5th GMIF Innovation Summit (
Global Memory Innovation Forum 2026
LG Innotek is Collaborating with NVIDIA, Taking One Step Closer to Securing a Leading Position in the Physical AI Market
* Showcases NVIDIA-focused solutions, including camera modules and a Multi-modal Vision System, at GTC Berlin on October 20 * Collaboration to expand into robotic vision sensing and robotic hands; next-generation solutions to be unveiled next year * Accelerating leadership in the Physical AI...
Hyundai Mobis Accelerates Full-Cycle Collaboration as a "K-Automotive Semiconductor Korea One Team"
- Holds the second Auto Semicon Korea… sharply expands participation, from 27 companies and institutions last year to 53 this year - Identifies 19 system semiconductor collaboration projects over the past year and begins developing 13 chips… firms up prospects for vehicle application and commerc...
Samsung Electro-Mechanics and NVIDIA Announce Strategic Partnership to Supply ABF Substrates
* Joint investment to expand dedicated production facilities in Sejong and Busan, with a multi-year supply agreement beginning in 2026 * Stable supply of advanced substrates for next-generation AI processors and high-speed networking solutions to help alleviate AI infrastructure supply chai...
eMemory/PUFsecurity Showcases OCP S.A.F.E.-Approved PUFrt at OCP Global Summit, Strengthening AI Data Center Security with Caliptra
PUFrt receives OCP S.A.F.E. Scope 3 approval following an independent security assessment of its resistance to physical attacks that could compromise sensitive information stored in silicon. SAN JOSE, Calif., Oct. 19, 2026 /PRNewswire/ -- PUFsecurity, a subsidiary of eMemory Technology,was spotl...
Discover More on One Trip: C-TOUCH & DISPLAY, FILM & TAPE EXPO and ITWA 2026 Open October 27
Global buyers can explore advanced displays, functional materials, robotics, electronics manufacturing and intelligent technologies through a connected exhibition program in Shenzhen, China. SHENZHEN, China, Oct. 15, 2026 /PRNewswire/ -- As artificial intelligence, advanced electronics and intel...
LITEON Showcases at NVIDIA MGX Ecosystem at OCP, Highlighting 800 VDC Power Technologies to Advance Next-Generation AI Infrastructure
SAN JOSE, Calif., Oct. 15, 2026 /PRNewswire/ -- LITEON Technology (2301.tw) is invited to participate in the NVIDIA MGX Ecosystem Ceremony held during the 2026 OCP Global Summit. Representing LITEON were John Chang, General Manager of LITEON Cloud Infrastructure Platform and Solution SBG, Bob Wen...
ModelBest and OpenBMB Launch MiniCPM-V 4.7, Bringing a 35B Multimodal MoE Model to Phones and Tablets With About 3 GB of Memory
BEIJING, Oct. 15, 2026 /PRNewswire/ -- ModelBest and the OpenBMB community announced the release of MiniCPM-V 4.7, the latest addition to their open-source on-device multimodal model series. Available in 35B-A3B and 1B versions, the release brings advanced image, document and video understanding ...
PEGATRON Brings AI Infrastructure from Design to Deployment at OCP Global Summit 2026
SAN JOSE, Calif., Oct. 14, 2026 /PRNewswire/ -- PEGATRON, a globally recognized provider of comprehensive AI infrastructure and server solutions, will showcase its capabilities in developing and manufacturing next-generation AI infrastructure at OCP Global Summit 2026. Under the theme "Scaling In...
CyberTAN Unveils Pallas Series Liquid-Cooled 102.4 Tbps Ethernet Switch Platform Blueprint at OCP Global Summit 2026
Collaborates with Marvell on Full Liquid-Cooled 102.4 Tbps T100 Ethernet Switch
Platform Blueprint
SAN JOSE, Calif., Oct. 13, 2026 /PRNewswire/ -- CyberTAN Technology, Inc.
SmartSens Showcases Automotive Vision Sensing Portfolio at AutoSens Europe 2026
SmartSens presents automotive-grade image sensors and integrated imaging-and-computing solutions for a range of vehicle applications BARCELONA, Spain, Oct. 13, 2026 /PRNewswire/ -- At AutoSens Europe 2026, held from September 22 to 24 at La Farga de L'Hospitalet in Barcelona, SmartSens, a techno...
Cellid Joins Qualcomm's the Snapdragon START program to accelerate the development of AR glasses
Cellid to Showcase Its "Crux" AR Glasses at Augmented Enterprise Summit 2026 TOKYO, Oct. 12, 2026 /PRNewswire/ -- Cellid Inc., a developer of displays and spatial recognition engines for next-generation AR glasses, today announced that it has joined Snapdragon® START (Snapdragon Scalable Turnkey ...
GMIF2026 Annual Awards Unveiled: Samsung, Sandisk, Lenovo, Silicon Motion, BIWIN, and More Recognized
SHENZHEN, China, Oct. 12, 2026 /PRNewswire/ -- The 5th GMIF Innovation Summit
(Global Memory Innovation Forum 2026, GMIF2026)
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