Semiconductors
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
Developing HPC Chiplet Platform to Feature LPDDR6 Memory Interface SEOUL, South Korea, June 12, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Te...
2024-06-13 06:00
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ChipMOS SHAREHOLDERS APPROVE CASH DIVIDEND DISTRIBUTION OF NT$1.80 PER COMMON SHARE OR APPROXIMATELY US$1.11 PER ADS
HSINCHU, June 12, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-06-12 21:10
3751
DIGITIMES Asia: Nvidia CEO Jensen Huang talks about partners, growing competition
TAIPEI, June 12, 2024 /PRNewswire/ -- According to the news report from the
technology-focused media DIGITIMES Asia
2024-06-12 19:57
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DECO's mmWave Wireless Connection Solution Unveiled at InfoComm, accelerating the Wireless Era of LED Display
LAS VEGAS, June 12, 2024 /PRNewswire/ -- From June 12 to 14, 2024, the InfoComm 2024 audiovisual display and systems integration exhibition was held at theLas Vegas Convention Center, USA. DECO INTEGRATION TECHNOLOGY CO., LTD. (hereinafter referred to as "DECO"), a leading innovator in millimeter...
2024-06-12 14:00
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SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform
The HPC platform to be built on Samsung SF4X with LPDDR6 Memory Interface
SEOUL, South Korea, June 11, 2024 /PRNewswire/ -- SEMIFIVE, a leading SoC
design platform, announced today it has joinedArm Total Design
2024-06-12 06:00
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ROHM's New "TRCDRIVE pack (TM)" with 2-in-1 SiC Molded Module: Significantly Reduces xEV Inverter Size
- Industry-leading* Power Density Achieved by Integrating 4th Generation SiC MOSFETs in Compact Package - KYOTO, Japan, June 11, 2024 /PRNewswire/ -- ROHM Co., Ltd. has developed four models as part of the TRCDRIVE pack (TM) series with 2-in-1 SiC molded modules (two of 750V-rated: BSTxxxD08P4A1...
2024-06-11 16:00
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LG Innotek solidifying its position as a leader in camera modules through innovative AI processes
* The initial yield, which determines profitability and customer confidence, is solved with the 'AI process recipe'. * AI that has been trained on tens of millions of data points has reduced the defect rate of key inspection items by up to 90%. * Effective in enhancing cost competitiveness.....
2024-06-10 20:00
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Samsung reportedly achieves technical breakthrough, stacking 3D DRAM to 16 layers
TAIPEI, June 5, 2024 /PRNewswire/ -- According to the news report from the
technology-focused media DIGITIMES Asia
2024-06-05 16:32
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ASPEED Technology Unveils Next-Generation BMC AST2700 Series at COMPUTEX 2024 and Showcases Cupola360 Panoramic Smart Remote Management Solution
TAIPEI, June 5, 2024 /PRNewswire/ -- ASPEED Technology unveiled its eighth-generation Baseboard Management Controller (BMC), the AST2700 series at Computex 2024. This series leads the industry as the first BMC SoC utilizing 12nm advanced process technology, featuring a quad-core ARM Cortex-A35 64...
2024-06-05 16:00
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LG Energy Solution Teams up with Analog Devices, Inc. to Gain Competitive Edge in Battery Management Total Solution
* LG Energy Solution signs MoU with Analog Devices, Inc. (ADI), a global semiconductor leader with Innovative Intelligence at the Edge technologies in the field of battery management. * The companies are working towards co-development of a technology that will enable precise measurement of ba...
2024-06-05 07:00
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Datasea Agreement already provided $2.8 million Information Service for its Highly Specialized 5G-AI Communications Platform
Agreement to Have Powerful Revenue Impact and is Expected to Lead to More Lucrative Contracts BEIJING, June 3, 2024 /PRNewswire/ -- Datasea Inc. (NASDAQ: DTSS) ("Datasea" or the "Company"), aNevada company engaged in innovative business segments in high-tech intelligent acoustics and 5G-Artifici...
2024-06-03 22:00
3089
Primax's 40th Anniversary Virtual Expo: Unveiling AI Innovations for a Smarter Future
Aligned with COMPUTEX 2024, Primax Showcases 3 Senses in one Integration Solutions TAIPEI, June 3, 2024 /PRNewswire/ -- Primax Electronics Ltd., a leader in 3 senses in 1 (interface, visual, and audio) integrated solutions, announces its 40th Anniversary Virtual Expo startingJune 4th. Coinciding...
2024-06-03 15:00
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Skymizer Launches Groundbreaking LLM Accelerator IP for on-device LLM Inferencing, EdgeThought, the game-changer in on-device GenAI era.
TAIPEI, May 31, 2024 /PRNewswire/ -- Skymizer, a pioneer in compiler technology and optimized solutions, today announced the release of its revolutionary software-hardware co-design AIASIC IP, EdgeThought, specifically engineered for accelerating Large Language Models (LLMs) at the edge. This cut...
2024-06-01 10:00
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MediaTek to Unveil Products for Chromebooks, Smart TVs and Displays at COMPUTEX 2024, Highlighting Demonstrations in AI Processing
Vice Chairman and CEO Dr. Rick Tsai to share the company's vision for ubiquitous AI at COMPUTEX 2024 HSINCHU, May 30, 2024 /PRNewswire/ -- At COMPUTEX 2024, MediaTek will showcase new products and technology demonstrations, featuring highlights in AI, Smart TVs, Chromebooks, IoT and more, in add...
2024-05-31 10:48
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LG Innotek recognized as one of South Korea's top brands
* LG Innotek has been named as one of the Best Korea Brands 2024 announced by Interbrand, proving its unrivaled status * "We will continue to make multifaceted efforts to raise the brand value of the global technology innovator." SEOUL, South Korea, May 30, 2024 /PRNewswire/ -- LG Innotek (CE...
2024-05-30 20:00
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ChipMOS to PRESENT at CITI'S 2024 TAIWAN TECH CONFERENCE
HSINCHU, May 30, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-05-30 18:20
1396
MediaTek's Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
HSINCHU, May 29, 2024 /PRNewswire/ -- MediaTek
2024-05-30 09:00
3061
ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability
MUNICH, May 29, 2024 /PRNewswire/ -- ERS electronic
2024-05-29 16:22
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DIGITIMES Asia: Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers
Jessica Tsai, Taipei; Jack Wu, DIGITIMES Asia Wednesday 29 May 2024
TAIPEI, May 29, 2024 /PRNewswire/ -- According to the news report from the
technology-focused media DIGITIMES Asia
2024-05-29 12:01
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Computex '24: Join Us to Unlock Infinite Possibilities in AI
Etron Tech Showcases MemorAiLink Platform: Revolutionizing Heterogeneous Integration in Semiconductor Development Now with Customer Products Entering Mass Production LAS VEGAS and TAIPEI, May 28, 2024 /PRNewswire/ -- As Artificial Intelligence (AI) continues to thrive, the global tech industry i...
2024-05-28 22:00
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