Semiconductors

LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC

* LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies * To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology * To highlight RF‑SiP substrates that adopt a groundbreaking appli...

2026-05-27 20:00 5414

HUAWEI Presents the Tau Scaling Law, Enabling Breakthroughs in Transistor Density and System Performance

BEIJING, May 27, 2026 /PRNewswire/ -- A news report from China Daily: He Tingbo, President of HUAWEI’s Semiconductor Business Department, delivers a ...

2026-05-27 14:27 4845

SK hynix unveils 'iHBM' thermal solution to boost AI performance

* Enhances heat dissipation by integrating ICEs into the HBM package * Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments * Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high de...

2026-05-26 07:39 6245

LG CNS Expands North American AX Business, Supporting Smart Factory Transformation for SMEs

* Showcases technologies at IoT Tech Expo 2026 in San Jose on May 18-19 together with global industry leaders including IBM, SAP, and Deloitte * Introduces Factova, an AI-powered smart factory solution designed to boost production optimization and factory intelligence at SMEs * Unveils AI so...

2026-05-20 06:00 7372

Embodied Intelligence Era Arrives: ROBOTECH ASIA Debuts at NEPCON ASIA 2026 with Mass Smart Production Solutions

SHENZHEN, China, May 19, 2026 /PRNewswire/ -- Booth bookings are now officially open for NEPCON ASIA 2026, Asia's premier electronics manufacturing exhibition. Expanding to an impressive 90,000 square meters, the event will serve as a one-stop hub for connecting upstream and downstream sectors—en...

2026-05-19 21:09 5918

SEMIFIVE Reports 137% YoY Revenue Growth in Q1 2026, Accelerating Its Rise as a Key Global Player in AI ASIC

* Revenue reached KRW 47.9 billion and new orders totaled KRW 55.4 billion, marking a record-breaking performance and signaling the beginning of full-scale growth. * Overseas ASIC development revenue, including North America and Japan, exceeded 60% of totalASIC development revenue, strengthen...

2026-05-17 15:45 5399

DEEPX and Ultralytics Forge Strategic Alliance to Define the Global Standard for Physical AI in the YOLO Community

Empowering the world's largest computer vision ecosystem with a unified, one-click NPU hardware standard for building the next generation of real-world AI applications. SEOUL, South Korea, May 14, 2026 /PRNewswire/ -- DEEPX, a leading fabless AI semiconductor company specializing in ultra-low-po...

2026-05-14 20:00 3587

WiMi Releases Next-Generation Quantum Neural Network Feature Mapping Technology: Repeated Amplitude Encoding Significantly Enhances Expressive Power of Quantum Models

BEIJING, May 11, 2026 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WiMi) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, released a key foundational technology oriented toward quantum neural networks—the Repeated Amplitude Encoding method (R...

2026-05-11 23:00 5523

Empowering Central Asia's AI Ecosystem: TuringEra Debuts Full-Stack AI Appliances at GITEX AI Kazakhstan

ALMATY, Kazakhstan, May 6, 2026 /PRNewswire/ -- TuringEra, a global leader in edge AI computing chips and full-stack solutions, successfully concluded a series of high-level commercial activities in Almaty this week. In addition to unveiling its "Cloud-Edge-End" AI appliance portfolio atGITEX AI ...

2026-05-06 20:00 3153

ROHM Launches Ultra-compact Wireless Power Chipset for Wearables

KYOTO, Japan, April 28, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed a wireless power supply IC chipset consisting of the receiver (ML7670) and transmitter (ML7671) compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands. ML767x ch...

2026-04-28 15:00 3632

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

* SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM  * Contributed to the global AI computing ecosystem via stable mass production across all HBM generations * Company committed to becoming a premier leader in AI innovation through collaboration with glo...

2026-04-26 08:15 5801

SK hynix Announces 1Q26 Financial Results

* Reports revenues of 52.5763 trillion won, operating profit of 37.6103 trillion won, net profit of 40.3459 trillion won * Record-high quarterly performance driven by increased sales of high value-added products from strong AI demand * By launching advanced products, the company will try to ...

2026-04-23 07:36 8692

Mitate Zepto Technica Joins JST's Next-generation Edge AI Semiconductor R&D Program as Social Implementation Partner

- MZT to Lead Product Commercialization through Its Genome-analysis Accelerator "RASEN" - TOKYO, April 20, 2026 /PRNewswire/ -- Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Gene...

2026-04-20 14:00 3797

SK hynix Begins Mass Production of 192GB SOCAMM2 'Setting a New Standard for AI Server Memory Performance'

-     Mass production of 192GB high capacity products designed for the NVIDIA Vera Rubin platform -     Maximizes power efficiency by featuring high density DRAM based on the latest 1cnm process -     Company to closely collaborate with NVIDIA to solve bottlenecks in AI infrastructure and provide...

2026-04-20 07:48 5044

Artilux Announces Inception™: A Hybrid Optoelectronic Architecture for the Next-Generation AI Computing

HSINCHU, April 15, 2026 /PRNewswire/ -- Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS proces...

2026-04-15 22:30 6555

Nuvoton Releases Industry-leading-class High-power Violet Laser Diode (402 nm, 4.5 W) -- 1.5 times Higher Output Than Its Conventional Product

KYOTO, Japan, April 15, 2026 /PRNewswire/ -- Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced on April 15 that it will start mass production of a "high-power violet laser diode (402 nm, 4.5 W)" that achieves industry-leading-class (*1) optical output in a 9.0 mm diameter CAN pa...

2026-04-15 16:00 3077

ROHM Adds New Lineup of 17 High-performance Op Amps Enhancing Design Flexibility

KYOTO, Japan, March 31, 2026 /PRNewswire/ -- ROHM Co., Ltd. has added the new CMOS Operational Amplifier (op amp) series "TLRx728" and "BD728x" to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems. A broad lineup also makes prod...

2026-03-31 14:00 3704

DEEPX Secures 27 Commercial Orders Across 8 Countries Within 7 Months of Mass Production

Global adoption of Physical AI chips accelerates as industry demand expands across robotics, smart factories, and edge AI — backed by a growing partner ecosystem and an early global supply chain spanning Asia, North America, and Europe. SEOUL, South Korea, March 27, 2026 /PRNewswire/ -- DEEPX, a...

2026-03-27 21:00 7867

Nota AI and SiMa.ai Sign Strategic Partnership for Physical AI Technology Collaboration

"Combining AI Optimization with High Performance and Efficiency MLSoCs to Lead the Physical AI Market" * Nota AI's AI Optimization Technology Meets SiMa.ai's MLSoC™ Product Family, Maximizing On-Device AI Performance for Physical AI * Joint Development and Commercialization of AI Solutions fo...

2026-03-25 20:00 5708

Linktel, Founding Member of XPO MSA, to Debut 12.8T Liquid-Cooled Module at OFC 2026

LOS ANGELES, March 17, 2026 /PRNewswire/ -- Linktel Technologies, a globally recognized company in optical transceiver development and manufacturing, today announced its 12.8T XPO liquid-cooled optical module will be featured in live demonstrations at OFC 2026. Designed for the escalating density...

2026-03-17 14:48 4825
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