Semiconductors
PCBAIR Specializes in High-Precision PCB Manufacturing for Optoelectronics and Telecom Applications
SHENZHEN, China, Sept. 8, 2025 /PRNewswire/ -- PCBAIR
Acer Unveils the Veriton GN100 AI Mini Workstation Built on the NVIDIA GB10 Superchip
Editor's Summary * Ultra-compact personal AI workstation featuring the NVIDIA® GB10 Grace Blackwell Superchip, equipped with 128 GB of unified memory, 4 TB of storage, and delivering up to 1 PFLOPS of FP4 AI performance. * Designed to work locally with large AI models, and scale to larger wo...
OptAI to Showcase the Future of On-Device AI at IFA 2025
OptAI to unveil its latest AI optimization solutions powered by Opt-Hancer Participation in Pitch Battle and DreamStage to highlight global expansion strategy and vision "Any Model, Any Device" SEOUL, South Korea and BERLIN, Sept. 2, 2025 /PRNewswire/ -- OptAI, an artificial intelligence startup...
SK hynix Introduces Industry's First Commercial High NA EUV
- Brings ASML's EXE:5200B, critical system for next-generation chips, to M16 fab - Improved precision, density by 1.7x and 2.9x to help competitive production - Company to lead AI memory with cutting-edge tech required by key industries SEOUL, South Korea, Sept. 2, 2025 /PRNewswire/ -- ...
ChipMOS ANNOUNCES NT$480 MILLION SHARE REPURCHASE PROGRAM
HSINCHU, Sept. 2, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
* Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47% * Customers expect achievement to help address heat issue generated from on-device AI * SK hynix to lead next-generation DRAM for mobile device through technolog...
Hyundai Mobis Unveils Future Growth Strategy at CEO Investor Day
* Held 2025 CEO Investor Day on 27th presenting its future growth strategy based on its "New Vision" of leading the mobility paradigm. * Emphasized its strategy to lead the market with leading technologies such as windshield displays, SDV solutions, and BSA, which completely blocks heat trans...
SK hynix Begins Mass Production of 321-Layer QLC NAND Flash
* Development of the industry's highest-density QLC product completed, commercial launch scheduled for the first half of next year following completion of customer validation * Expansion of independent operation units ("planes") enables simultaneous large capacity and high performance, optimi...
Hyundai Mobis acquires semiconductor development process certification for ISO 26262 ASIL-D
* Received the highest grade for the entire R&D process, from design to quality verification * Plans to mass-produce 20 million units of 16 major semiconductors developed in-house this year, and has established an R&D environment at the global top level * Takes the lead in expanding the dom...
ROHM Develops Ultra-compact MOSFET Featuring Industry-leading Low ON-resistance, Ideal for Fast Charging Applications
KYOTO, Japan, Aug. 21, 2025 /PRNewswire/ -- ROHM Co., Ltd. has launched the AW2K21, a 30V N-channel MOSFET in a common-source configuration that delivers an industry-best* ON-resistance of 2.0 milliohms (typ.) in a compact 2.0mm x 2.0mm WLCSP package. This innovation addresses the growing demand ...
ChipMOS REPORTS SECOND QUARTER 2025 RESULTS
* 2Q25 Revenue Grew 3.7% Compared to 1Q25 * 6.6% 2Q25 Gross Margin Compared to 9.4% in 1Q25 * Overall Utilization Rate Increased to 65% from 62% in 1Q25 * NT$1,667.2 Million or US$57.1 Million Net Free Cash Flow for the First Half of 2025 * Revenue Growth and Prudent CapEx Further Strengt...
ChipMOS REPORTS JULY 2025 REVENUE
HSINCHU, Aug. 8, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
XCENA to Launch MX1 Computational Memory in October; Recognized for Innovation at FMS 2025
SANTA CLARA, Calif., Aug. 6, 2025 /PRNewswire/ -- XCENA™, a South Korea–based startup, unveiled its first product, MX1 computational memory, this week at the Future of Memory and Storage (FMS) event. XCENA is displaying MX1 at FMS (booth #734) and will be offering working samples to select partne...
LG Innotek Teams Up with U.S. LiDAR Company Aeva in Preparation to Preempt the Market
* Selected as Aeva's supplier for an ultra-slim, ultra-long-range 4D LiDAR * Joint development of LiDAR for autonomous driving car∙robots∙industrial automation, along with the anticipated acquisition of 6.0% equity stake in Aeva * Announcement of cooperation roadmap at 'Aeva Day' event SEOUL,...
ChipMOS SCHEDULES SECOND QUARTER 2025 FINANCIAL RESULTS CONFERENCE CALL
HSINCHU, July 29, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
Delta Inaugurates Smart Manufacturing Innovation Center
One-Stop Platform in Taiwan for Equipment Validation and Talent Training to Accelerate AI-based Manufacturing Worldwide TAIPEI, July 25, 2025 /PRNewswire/ -- Delta, a global leader in power management and smart green solutions, today inaugurated inTaiwan its Smart Manufacturing Innovation Center...
SK hynix Announces 2Q25 Financial Results
* Reports revenues of 22.232 trillion won, operating profit of 9.2129 trillion won, net profit of 6.9962 trillion won * Both revenues, operating profit at all-time highs following brisk sales of AI memory * Company to provide best-in-class AI products timely for customer satisfaction, marke...
DIVIDEND ALERT: US$0.836 CASH DIVIDEND TO BE DISTRIBUTED ON JULY 25 TO ChipMOS ADS HOLDERS PRE-WITHHOLDING TAX AND FEES
HSINCHU, July 21, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
SEMIFIVE Files for Pre-IPO Review on KRX
SEOUL, South Korea, July 17, 2025 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced that it has submitted its preliminary IPO application to the Korea Exchange (KRX), marking the official start of its listing proce...
InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universa...
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