Semiconductors
Hesai and SAIC Volkswagen Sign New Partnership on Automotive Lidar Program
SHANGHAI, Oct. 1, 2024 /PRNewswire/ -- Hesai Technology (Nasdaq: HSAI), the global leader in lidar technology, announced today the signing of a cooperation framework with SAIC Volkswagen. The cooperation will establish a strong foundation for Hesai and SAIC Volkswagen to build a new ecosystem fo...
2024-10-01 20:30
1568
ITECH Showcases Innovative High Power Density Power Supplies at The Battery Show North America
DETROIT, Sept. 30, 2024 /PRNewswire/ -- ITECH Electronics, a trusted global symbol of innovation in power electronics testing instruments and solutions, ready to present its latest power testing instruments atThe Battery Show North America, Oct.7-10, inDetroit. The company will show cutting-edge...
2024-09-30 22:00
1026
Embracing the AI Era for a Win-Win Future of Memory Industry: The GMIF2024 Innovation Summit Successfully Held in Shenzhen
SHENZHEN, China, Sept. 30, 2024 /PRNewswire/ -- In the golden glow of autumn, Shenzhen brings all together to convene a grand celebration. On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) has been successfully concluded in Shenzhen. The event was hosted by the...
2024-09-30 21:28
1659
M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
Redefining High-Speed Data Storage HSINCHU, Sept. 26, 2024 /PRNewswire/ -- M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), today announced that its cutting-edge ONFi5.1 I/O IP achieved silicon validation on the TSMC 5nm (N5) process. The two annou...
2024-09-26 15:30
1301
New Short Film Takes Behind-the-scenes Look at Next-generation GaN Power Semiconductor Device Development
KYOTO, Japan, Sept. 26, 2024 /PRNewswire/ -- - Making GaN Easy to Use: Engineering Challenges from R&D to Practical Application - ROHM Co., Ltd. has released the sixth German-language installment in the "Stories of Manufacturing" series of short films, this time taking viewers behind the scene...
2024-09-26 15:00
1302
SK hynix Begins Volume Production of the World's First 12-Layer HBM3E
* The company plans to supply the highest-performing, highest-capacity 12-layer HBM3E to customers by the end of the year * DRAM chips made 40% thinner to increase capacity by 50% at the same thickness as the previous 8-layer product * The company to continue HBM's success with outstanding p...
2024-09-26 08:00
1234
SK hynix Applies CXL Optimization Solution to Linux
* HMSDK, a proprietary memory control solution lauded for its performance, is now available on Linux, the world's largest open source operating system * HMSDK optimizes performance between heterogeneous memories, increasing bandwidth by 30% and performance by over 12% * The company will fost...
2024-09-23 08:00
1333
Discover the Star-Studded Lineup for GMIF2024 Innovation Summit in Shenzhen on September 27
SHENZHEN, China, Sept. 19, 2024 /PRNewswire/ -- On September 27, 2024, the " Third GMIF2024 Innovation Summit (Global Memory Innovation Forum)" will be held at the Renaissance Shenzhen Bay Hotel. The event is hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Associat...
2024-09-19 15:51
1362
MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit
SAN JOSE, Calif., Sept. 14, 2024 /PRNewswire/ -- From September 10-12, 2024, MSquare Technology made a standout appearance at the highly anticipated AI Hardware & Edge AI Summit in San Jose. With 1,500+ attendees and 75+ stellar speakers from the industry leaders, the summit provided MSquare, a l...
2024-09-14 12:46
1851
SK hynix Develops PEB110 E1.S for Data Centers
* New SSD delivers 2x performance, over 30% greater power efficiency than previous generation by applying 5th-generation PCIe * Mass production to begin in Q2 next year following customer qualification * SK hynix to enhance data center SSD portfolio to meet diverse customer needs * Company t...
2024-09-11 08:00
1167
ChipMOS REPORTS 15.4% YoY GROWTH IN AUGUST 2024 REVENUE, UP 2.5% MoM
HSINCHU, Sept. 10, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-09-10 18:00
995
3,500 Automotive Patents in 5 Years: LG Innotek Eyes Market Leadership with Advanced Mobility Technology
* Automotive component patents account for nearly 40 percent of LG Innotek's patent applications, including LiDAR, Automotive camera modules, Lighting systems, and Communication modules. * Registration of 5 EVCC standard essential patents, securing technological advantage in EV communication ...
2024-09-05 20:00
2072
ROHM's 4th-Generation SiC MOSFET Bare Chips Adopted in 3 EV Models of ZEEKR from Geely
- Integration in Traction Inverters Extends Cruising Range, Improving Performance - KYOTO, Japan, Sept. 5, 2024 /PRNewswire/ -- ROHM Co., Ltd. has announced the adoption of power modules equipped with 4th-generation SiC MOSFET bare chips for traction inverters in three models of the ZEEKR EV bra...
2024-09-05 14:00
1272
SurplusGLOBAL at SEMICON TAIWAN 2024 with Strengthened Team and New Opportunities
SEOUL, South Korea, Sept. 3, 2024 /PRNewswire/ -- SurplusGLOBAL, a global leader in the legacy semiconductor equipment market, is pleased to announce its participation in SEMICONTAIWAN 2024, which will be held from September 4-6, 2024 , at TaiNEX 1 & 2 inTaipei. SurplusGLOBAL will be located at Bo...
2024-09-04 02:00
1899
Samsung Electro-Mechanics Awarded "2024 Supplier of the Year - Components" at Qualcomm Supplier Summit
SEOUL, South Korea, Sept. 2, 2024 /PRNewswire/ -- Samsung Electro-Mechanics
2024-09-03 06:36
2537
New Smart #5 Makes Global Debut with Built-in Automotive-grade Laser Projection Light, Core Components Provided by Appotronics
SHENZHEN, China, Sept. 2, 2024 /PRNewswire/ -- The new Smart #5 made its global debut inAustralia on August 28th. Positioned as a luxury adventure large five-seater SUV, it is also the largest model in the Smart lineup, designed by the Mercedes-Benz team with a Boxy square box design, offering a ...
2024-09-02 23:00
1784
DIGITIMES Asia: Kaynes SemiCon secures India's first paying OSAT customer for advanced semiconductor packaging
TAIPEI, Aug. 30, 2024 /PRNewswire/ -- Kaynes SemiCon, a wholly owned subsidiary of Kaynes Technology, has signed a landmark memorandum of understanding (MoU) with Lightspeed Photonics, securingIndia's first paying customer for outsourced semiconductor assembly and test (OSAT) services, according ...
2024-08-30 14:48
1540
SK hynix Develops Industry's First 1c DDR5
* 1c node, 6th generation of 10nm process, developed in most efficient way by applying platform of industry-leading1b technology * Cost competitiveness improved with adoption of new material, optimization of EUV process, while power efficiency enhanced to help reduce electricity cost of data ...
2024-08-29 08:00
1241
Sylvox to Showcase Cutting-Edge Full-Scenario TV Innovations at IFA Berlin 2024
BERLIN, Aug. 28, 2024 /PRNewswire/ -- Sylvox
2024-08-28 19:00
1398
THINKCAR Tech Triumphs with the 2024 Red Dot Design Award: A Showcase of Innovation and Design Prowess
ONTARIO, Calif., Aug. 27, 2024 /PRNewswire/ -- The Red Dot Design Award, a beacon of design excellence since 1955. In 2024, the glory of Red Dot Design Award shone upon THINKCAR Tech Co., Ltd. With its THINKDIAG car owner intelligent diagnostic device, THINKCAR Tech won this internationally reco...
2024-08-28 00:00
1221
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