Semiconductors

WiMi Releases Next-Generation Quantum Neural Network Feature Mapping Technology: Repeated Amplitude Encoding Significantly Enhances Expressive Power of Quantum Models

BEIJING, May 11, 2026 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WiMi) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, released a key foundational technology oriented toward quantum neural networks—the Repeated Amplitude Encoding method (R...

2026-05-11 23:00 5735

Empowering Central Asia's AI Ecosystem: TuringEra Debuts Full-Stack AI Appliances at GITEX AI Kazakhstan

ALMATY, Kazakhstan, May 6, 2026 /PRNewswire/ -- TuringEra, a global leader in edge AI computing chips and full-stack solutions, successfully concluded a series of high-level commercial activities in Almaty this week. In addition to unveiling its "Cloud-Edge-End" AI appliance portfolio atGITEX AI ...

2026-05-06 20:00 3350

ROHM Launches Ultra-compact Wireless Power Chipset for Wearables

KYOTO, Japan, April 28, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed a wireless power supply IC chipset consisting of the receiver (ML7670) and transmitter (ML7671) compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands. ML767x ch...

2026-04-28 15:00 3798

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

* SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM  * Contributed to the global AI computing ecosystem via stable mass production across all HBM generations * Company committed to becoming a premier leader in AI innovation through collaboration with glo...

2026-04-26 08:15 6899

SK hynix Announces 1Q26 Financial Results

* Reports revenues of 52.5763 trillion won, operating profit of 37.6103 trillion won, net profit of 40.3459 trillion won * Record-high quarterly performance driven by increased sales of high value-added products from strong AI demand * By launching advanced products, the company will try to ...

2026-04-23 07:36 12209

Mitate Zepto Technica Joins JST's Next-generation Edge AI Semiconductor R&D Program as Social Implementation Partner

- MZT to Lead Product Commercialization through Its Genome-analysis Accelerator "RASEN" - TOKYO, April 20, 2026 /PRNewswire/ -- Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Gene...

2026-04-20 14:00 3924

SK hynix Begins Mass Production of 192GB SOCAMM2 'Setting a New Standard for AI Server Memory Performance'

-     Mass production of 192GB high capacity products designed for the NVIDIA Vera Rubin platform -     Maximizes power efficiency by featuring high density DRAM based on the latest 1cnm process -     Company to closely collaborate with NVIDIA to solve bottlenecks in AI infrastructure and provide...

2026-04-20 07:48 5798

Artilux Announces Inception™: A Hybrid Optoelectronic Architecture for the Next-Generation AI Computing

HSINCHU, April 15, 2026 /PRNewswire/ -- Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS proces...

2026-04-15 22:30 7024

Nuvoton Releases Industry-leading-class High-power Violet Laser Diode (402 nm, 4.5 W) -- 1.5 times Higher Output Than Its Conventional Product

KYOTO, Japan, April 15, 2026 /PRNewswire/ -- Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced on April 15 that it will start mass production of a "high-power violet laser diode (402 nm, 4.5 W)" that achieves industry-leading-class (*1) optical output in a 9.0 mm diameter CAN pa...

2026-04-15 16:00 3217

ROHM Adds New Lineup of 17 High-performance Op Amps Enhancing Design Flexibility

KYOTO, Japan, March 31, 2026 /PRNewswire/ -- ROHM Co., Ltd. has added the new CMOS Operational Amplifier (op amp) series "TLRx728" and "BD728x" to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems. A broad lineup also makes prod...

2026-03-31 14:00 3892

DEEPX Secures 27 Commercial Orders Across 8 Countries Within 7 Months of Mass Production

Global adoption of Physical AI chips accelerates as industry demand expands across robotics, smart factories, and edge AI — backed by a growing partner ecosystem and an early global supply chain spanning Asia, North America, and Europe. SEOUL, South Korea, March 27, 2026 /PRNewswire/ -- DEEPX, a...

2026-03-27 21:00 8520

Nota AI and SiMa.ai Sign Strategic Partnership for Physical AI Technology Collaboration

"Combining AI Optimization with High Performance and Efficiency MLSoCs to Lead the Physical AI Market" * Nota AI's AI Optimization Technology Meets SiMa.ai's MLSoC™ Product Family, Maximizing On-Device AI Performance for Physical AI * Joint Development and Commercialization of AI Solutions fo...

2026-03-25 20:00 6544

Linktel, Founding Member of XPO MSA, to Debut 12.8T Liquid-Cooled Module at OFC 2026

LOS ANGELES, March 17, 2026 /PRNewswire/ -- Linktel Technologies, a globally recognized company in optical transceiver development and manufacturing, today announced its 12.8T XPO liquid-cooled optical module will be featured in live demonstrations at OFC 2026. Designed for the escalating density...

2026-03-17 14:48 5115

TIER IV and Isuzu advance autonomous transit with deployment of Level 4 buses powered by NVIDIA DRIVE Hyperion

TOKYO, March 16, 2026 /PRNewswire/ -- TIER IV, Inc. (headquartered in Shinagawa,Tokyo, Japan; Founder and CEO: Shinpei Kato; hereinafter TIER IV) andIsuzu Motors Limited (headquartered inYokohama, Kanagawa, Japan; President and COO: Shinsuke...

2026-03-17 09:00 5532

SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026

* SK hynix to participate in 'GTC 2026' in San Jose, March 16-19 * Exhibition themed 'Spotlight on AI Memory' to unveil full lineup of AI memory solutions * Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, to attend and expand global AI collaborations SEOUL,...

2026-03-17 04:37 7525

SEMIFIVE Pulls Ahead in AI ASIC Market, Expanding Lead with Successive NPU Project Wins

* Secures KRW 18 Billion Project for Next-Generation AI NPU, Solidifying Leadership in High-PerformanceASIC Market * Underscores AI Semiconductor Design Competitiveness with Consecutive 4nm AI Chip Contracts SEOUL, South Korea, March 13, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provi...

2026-03-13 15:16 6078

LG Innotek Secures "Leadership A" in CDP Climate Change Assessment for Third Consecutive Year

* Achieved "Leadership A" grade, awarded to top 3% of 22,100 global companies evaluated. * Selected for "Carbon Management Sector Honors" for seventh consecutive year.  * Achieved 60% company-wide renewable electricity transition rate across domestic and overseas sites, making excellent pro...

2026-03-12 20:00 5108

ROHM's New SiC Power Modules Now Available for Online Purchase

KYOTO, Japan, March 12, 2026 /PRNewswire/ -- ROHM Co., Ltd. has begun online sales of new SiC molded modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and need for energy conservation, these products promote the adoption of high-efficiency...

2026-03-12 14:00 4063

RiseLink Redefines Edge AI with the BK7259 "Powerhouse" and R2 Unified AI Developer Platform at Embedded World 2026

NUREMBERG, Germany, March 11, 2026 /PRNewswire/ -- RiseLink Technologies, a global leader in low-power connectivity with a 20-year legacy in semiconductor innovation, today announced the launch of its BK7259 Edge AI powerhouse at Embedded World 2026. As the centerpiece of the new R2 Unified AI De...

2026-03-11 23:18 5654

SK keyfoundry Successfully Develops 450V-2300V SiC Planar MOSFET Process Platform, Secures New 1200 V Order, Marking the Beginning of Its Full-Scale SiC Business

* Successfully develops SiC Planar MOSFET process platform for 450V–2300V, securing high reliability and yield competitiveness * Accelerates SiC-based compound semiconductor foundry business by initiating 1200V SiC MOSFET development for a new customer SEOUL, South Korea, March 11, 2026 /PRNe...

2026-03-11 19:00 4951
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