Semiconductors
ECARX-Backed Chip Maker SiEngine Secures US$200M Equity Financing to Accelerate Vertical Silicon-to-Software SDV Innovation
LONDON, July 31, 2026 /PRNewswire/ -- ECARX Holdings Inc. (Nasdaq: ECX) recognises today's key update from SiEngine Technology Co., Ltd., its incubated automotive semiconductor investment. SiEngine has secured US$200 million in new equity capital from institutional investors over the course of H...
2026-07-31 18:03
6162
Diverging Memory Market Outlook in 2027 as DRAM Supply Remains Tight While NAND Flash Supply Conditions Ease, Says TrendForce
TAIPEI, July 30, 2026 /PRNewswire/ -- TrendForce
2026-07-30 20:00
3046
SK hynix Announces 2Q26 Financial Results
* Reports revenues of 79.3187 trillion won, operating profit of 60.5426 trillion won, net profit of 93.9226 trillion won * Record-Breaking Quarterly Performance Driven by High-Value Product Sales Amid Strong AI Demand; Cumulative First-Half Revenue Surpasses 100 Trillion won for the First Tim...
2026-07-29 06:56
3070
Titans Join Forces: LG Innotek Partners with TDK to Develop Solutions for Physical AI
"Creating the Robot's 'Skin' as Well as Its 'Eyes'" * LG Innotek and TDK align on a strategic partnership in the physical AI sector * Developing next‑generation vision sensing modules integrated with TDK sensors to maximize recognition performance * Developing a tactile sensing module that ...
2026-07-28 20:00
2038
LG ELECTRONICS' ULTRAVIEW WINDSHIELD DISPLAY NAMED FINALIST FOR 2026 PACE PILOT AWARD
LG's Innovative Windshield Display Architecture Is Designed to Support Eyes-on-the-Road Interaction While Simplifying Cockpit Design for OEMs News Summary * LG Electronics has been named a finalist for the 2026 Automotive News PACE Pilot Award for its UltraView Windshield Display. * LG's Ult...
2026-07-28 14:00
6183
Longsys to Unveil "Edge AI Storage Fusion" at FMS 2026, Showcasing In-Depth Innovation in Edge AI Storage
SAN JOSE, Calif., July 27, 2026 /PRNewswire/ -- FMS 2026 kicks off in
California, USA, August 4–6, 2026. Longsys(301308.SZ) will attend under the
theme "Edge AI Storage Fusion," showcasing its deep innovation in edge AI
storage.
2026-07-27 23:00
4358
Advantech Unveils Next-Gen AI Infrastructure Solutions Powered by AMD EPYC™ 9006 Series Processors
TAIPEI, July 23, 2026 /PRNewswire/ -- Advantech, a global leader in industrial edge computing and edge AI solutions,today announced its next-generation server and network platforms powered by the latest AMD EPYC™ 9006 Series processors. Designed to accelerate AI infrastructure from the data cente...
2026-07-24 03:00
2382
BOSGAME Introduces E6 ECO, One of the First Mini PCs Powered by Intel's New Intel Core 3 Processor 304
* Compact and energy-efficient Mini PC combines next-generation Intel
performance with modern connectivity for everyday work and entertainment
SHENZHEN, China, July 23, 2026 /PRNewswire/ -- BOSGAME
2026-07-23 22:00
4243
STARTRADER Launches SKHY as SK Hynix Makes Its US Market Debut, Giving Clients Timely Access to a Key AI Memory Name
SKHY gives clients direct exposure to a key supplier of high-bandwidth memory at the heart of the AI acceleration market. DUBAI, UAE, July 23, 2026 /PRNewswire/ -- STARTRADER today announced the launch of SK Hynix Inc. (SKHY) as a US Stock CFD on its trading platform, available from July 22, 202...
2026-07-23 16:40
2147
ROHM Develops New Buck-boost DC-DC Eval Board for Ultra-compact Mounting
KYOTO, Japan, July 22, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed a new evaluation board, the BD83070GWL-EVK-002, with a view to fully demonstrating the features of the BD83070GWL DC-DC converter IC, which combines high efficiency with ultra-low current consumption. This new board is now a...
2026-07-22 14:00
3043
WiMi Releases Resource-Efficient Quantum Convolutional Neural Network Based on QRAM, Accelerating the Practical Implementation of Large-Scale Image Classification Applications
BEIJING, July 20, 2026 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WiMi) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, announced the release of its latest independently developed achievement—a quantum convolutional neural network for effi...
2026-07-20 21:00
5174
BOE attends UNESCO Global Conference of the International Decade of Sciences for Sustainable Development in Paris
PARIS, July 17, 2026 /PRNewswire/ -- The 2026 Global Conference of the International Decade of Sciences for Sustainable Development (IDSSD) is taking place from July 15 to 17 at UNESCO Headquarters in Paris. As the first Chinese technology company to be a strategic partner of the IDSSD, BOE not o...
2026-07-17 18:43
6781
Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging
* Provides non-destructive 3D analysis of the location, morphology, and depth profile of internal defects in glass substrates * Introduces TAMI, a dedicated 3D analysis software platform that connects R&D analysis with production-line review * Accelerates root-cause analysis and yield learni...
2026-07-13 20:30
2714
SK hynix Lists ADRs on NASDAQ, Elevating Global Status at the Heart of Capital Markets
* SK hynix commences ADR trading with an "Opening Bell" ceremony attended by SK Group Chairman Chey Tae-won and key executive leadership * Company aims to expand investor base and solidify leadership as a "Core AI Partner" in the memory market * CEO Kwak Noh-Jung "I'd like to thank investors...
2026-07-10 22:14
7458
ChipMOS REPORTS RECORD HIGHEST MONTHLY AND QUARTERLY REVENUE SINCE 2014; REPORTS 37.2% YoY INCREASE IN JUNE 2026 REVENUE; 28.7% YoY INCREASE IN 2Q26 REVENUE
HSINCHU, July 10, 2026 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue f...
2026-07-10 18:00
11801
LG Innotek Targets USD 647 million in Package Solution Operating Profit by 2031
SEOUL, South Korea, June 30, 2026 /PRNewswire/ -- LG Innotek, renowned for its
optical solution business and leadership in high-performance camera modules, is
quickly establishing itself as a key player in package solutions, including
high-value-added semiconductor substrates.
2026-06-30 20:01
2869
DEEPX and Sixfab Launch 'DEEPX AI HAT' to Drive Edge Physical AI on Raspberry Pi
SEOUL, South Korea, June 26, 2026 /PRNewswire/ -- DEEPX, an on-device AI semiconductor pioneer, today announced that its ultra-low-power NPU technology is powering the Sixfab AI HAT+ for Raspberry Pi 5, a new edge AI acceleration board developed by Sixfab, an edge AI hardware solutions company an...
2026-06-26 20:00
4309
Innoscience's current products are not affected by both rulings of the Munich Regional Court
MUNICH, June 18, 2026 /PRNewswire/ -- Innoscience today announced that the Munich Regional Court has just issued a pair of rulings, from which it could be confirmed that Innoscience's currently marketed gallium nitride ("GaN") power device products fall outside the scope of Infineon's asserted Ge...
2026-06-19 11:24
6905
Nuvoton Technology Corporation Strengthens Tethered XR Glass SoC Business Through Collaboration With Qualcomm Technologies
HSINCHU, June 17, 2026 /PRNewswire/ -- Nuvoton Technology Corporation announced its collaboration with Qualcomm Technologies, Inc. to strengthen its system-on-chip (SoC) business for tethered XR glass applications. By combining Nuvoton's low-power, XR-optimized SoCs with Qualcomm's Snapdragon® XR...
2026-06-18 08:00
4013
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
- Delivers 12-high HBM4E samples to major customers - Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency - Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability - SK hynix strengthens its AI leadership with ...
2026-06-18 07:35
7367
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