Semiconductors
LG Innotek Acquires Large-scale Funding from IFC "Proof of World-leading ESG Management"
* Successful funding of USD 200 million, to be utilized for expansion of production facility inVietnam * Spotlighting of outstanding ESG management metrics' recognition by global institution with stringent standards SEOUL, South Korea, Sept. 24, 2025 /PRNewswire/ -- LG Innotek (CEOMoon Hyuks...
2025-09-24 20:00
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BOE launches sustainable development strategy and joint initiative, mapping out a new blueprint for high-quality and sustainable development
BEIJING, Sept. 23, 2025 /PRNewswire/ -- At the just-concluded BOE Global Innovation Partner Conference 2025 (BOE IPC 2025), BOE unveiled its sustainable development strategy, and joined forces with key partners to release the Joint Initiative for Sustainable Development, making it an important co...
2025-09-23 18:04
2006
MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices
New flagship chipset further strengthens industry leadership in gaming, compute, imaging, and AI HSINCHU, Sept. 22, 2025 /PRNewswire/ -- MediaTek, the world's leading innovator of smartphone SoCs, today announced the launch of its most advanced mobile platform yet: The MediaTek Dimensity 9500. S...
2025-09-22 15:00
5328
ROHM Releases New Compact PFC + Flyback Control Reference Design for Power
KYOTO, Japan, Sept. 18, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed a new reference design (REF67004) that uses a single MCU to control two commonly used power-converter types for consumer and industrial power supplies: critical-conduction-mode PFC (power factor correction) and quasi-resona...
2025-09-18 15:00
2305
LattePanda IOTA Debuts: Palm-sized x86 Single-Board Computer with Intel N150 Delivers Significant Performance Leap
SHANGHAI, Sept. 17, 2025 /PRNewswire/ -- On September 17, the LattePanda
2025-09-18 00:00
4327
SK hynix Completes World's First HBM4 Development and Readies Mass Production
- The company is ready to supply the best-in-class HBM4 to customers according to their plans and to maintain competitive position - The product's bandwidth has doubled and power efficiency has improved 40% compared to the previous generation - Company to overcome the ...
2025-09-12 07:39
3586
SK hynix Begins Supplying Mobile NAND Solution ZUFS 4.1
* Company achieves world-first mass production of high-performance NAND solution products and starts supplying them to the mobile market * The solution significantly improves sustained performance compared to conventional UFS, reducing app launch time by 45%; optimized for on-device AI and la...
2025-09-11 07:30
2459
The Infrastructure Behind the Algorithms: FICG's Optical Transceivers Are Shaping the Future of AI
Optical communications will form the nervous systems of AI factories of the future, and makers of optical transceivers like FICG stand to play a lead role. TAIPEI, Sept. 10, 2025 /PRNewswire/ -- As artificial intelligence continues to reshape the global economy, the underlying infrastructure enab...
2025-09-10 20:00
2263
Semicon Taiwan: Saxony presents itself as a premium European location for the semiconductor industry
Minister of Economic Affairs promotes further settlements DRESDEN, Germany and TAIPEI, Taiwan, Sept. 10, 2025 /PRNewswire/ -- The German state of Saxony is presenting itself at Semicon Taiwan as "Silicon Saxony," the largest microelectronics cluster inEurope, and is promoting itself as a premium...
2025-09-10 12:30
1711
AP Memory Launches ApSRAM™ - A New Low-Power and High-Performance PSRAM
HSINCHU, Sept. 9, 2025 /PRNewswire/ -- AP Memory, a leading global design company providing customized memory solutions, today announced that its next-generation PSRAM—ApSRAMTM (Attached-pSRAM)—has successfully passed customer validation and is scheduled to begin mass production by the end of the...
2025-09-10 01:00
2297
ROHM Has Developed Ultra-compact CMOS Op Amp: Delivering Industry-leading Ultra-low Circuit Current
KYOTO, Japan, Sept. 9, 2025 /PRNewswire/ -- ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained a...
2025-09-09 15:00
1811
PCBAIR Specializes in High-Precision PCB Manufacturing for Optoelectronics and Telecom Applications
SHENZHEN, China, Sept. 8, 2025 /PRNewswire/ -- PCBAIR
2025-09-08 23:00
1919
Acer Unveils the Veriton GN100 AI Mini Workstation Built on the NVIDIA GB10 Superchip
Editor's Summary * Ultra-compact personal AI workstation featuring the NVIDIA® GB10 Grace Blackwell Superchip, equipped with 128 GB of unified memory, 4 TB of storage, and delivering up to 1 PFLOPS of FP4 AI performance. * Designed to work locally with large AI models, and scale to larger wo...
2025-09-03 17:25
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OptAI to Showcase the Future of On-Device AI at IFA 2025
OptAI to unveil its latest AI optimization solutions powered by Opt-Hancer Participation in Pitch Battle and DreamStage to highlight global expansion strategy and vision "Any Model, Any Device" SEOUL, South Korea and BERLIN, Sept. 2, 2025 /PRNewswire/ -- OptAI, an artificial intelligence startup...
2025-09-03 10:52
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SK hynix Introduces Industry's First Commercial High NA EUV
- Brings ASML's EXE:5200B, critical system for next-generation chips, to M16 fab - Improved precision, density by 1.7x and 2.9x to help competitive production - Company to lead AI memory with cutting-edge tech required by key industries SEOUL, South Korea, Sept. 2, 2025 /PRNewswire/ -- ...
2025-09-03 07:30
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ChipMOS ANNOUNCES NT$480 MILLION SHARE REPURCHASE PROGRAM
HSINCHU, Sept. 2, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2025-09-02 18:00
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SK hynix Starts Supplying Mobile DRAM with Highly Efficient Heat Dissipation
* Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47% * Customers expect achievement to help address heat issue generated from on-device AI * SK hynix to lead next-generation DRAM for mobile device through technolog...
2025-08-28 07:30
1919
Hyundai Mobis Unveils Future Growth Strategy at CEO Investor Day
* Held 2025 CEO Investor Day on 27th presenting its future growth strategy based on its "New Vision" of leading the mobility paradigm. * Emphasized its strategy to lead the market with leading technologies such as windshield displays, SDV solutions, and BSA, which completely blocks heat trans...
2025-08-27 20:00
1961
SK hynix Begins Mass Production of 321-Layer QLC NAND Flash
* Development of the industry's highest-density QLC product completed, commercial launch scheduled for the first half of next year following completion of customer validation * Expansion of independent operation units ("planes") enables simultaneous large capacity and high performance, optimi...
2025-08-25 07:30
2040
Hyundai Mobis acquires semiconductor development process certification for ISO 26262 ASIL-D
* Received the highest grade for the entire R&D process, from design to quality verification * Plans to mass-produce 20 million units of 16 major semiconductors developed in-house this year, and has established an R&D environment at the global top level * Takes the lead in expanding the dom...
2025-08-21 20:00
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