Semiconductors
Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging
* Provides non-destructive 3D analysis of the location, morphology, and depth profile of internal defects in glass substrates * Introduces TAMI, a dedicated 3D analysis software platform that connects R&D analysis with production-line review * Accelerates root-cause analysis and yield learni...
2026-07-13 20:30
2859
SK hynix Lists ADRs on NASDAQ, Elevating Global Status at the Heart of Capital Markets
* SK hynix commences ADR trading with an "Opening Bell" ceremony attended by SK Group Chairman Chey Tae-won and key executive leadership * Company aims to expand investor base and solidify leadership as a "Core AI Partner" in the memory market * CEO Kwak Noh-Jung "I'd like to thank investors...
2026-07-10 22:14
7766
ChipMOS REPORTS RECORD HIGHEST MONTHLY AND QUARTERLY REVENUE SINCE 2014; REPORTS 37.2% YoY INCREASE IN JUNE 2026 REVENUE; 28.7% YoY INCREASE IN 2Q26 REVENUE
HSINCHU, July 10, 2026 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue f...
2026-07-10 18:00
11966
LG Innotek Targets USD 647 million in Package Solution Operating Profit by 2031
SEOUL, South Korea, June 30, 2026 /PRNewswire/ -- LG Innotek, renowned for its
optical solution business and leadership in high-performance camera modules, is
quickly establishing itself as a key player in package solutions, including
high-value-added semiconductor substrates.
2026-06-30 20:01
3181
DEEPX and Sixfab Launch 'DEEPX AI HAT' to Drive Edge Physical AI on Raspberry Pi
SEOUL, South Korea, June 26, 2026 /PRNewswire/ -- DEEPX, an on-device AI semiconductor pioneer, today announced that its ultra-low-power NPU technology is powering the Sixfab AI HAT+ for Raspberry Pi 5, a new edge AI acceleration board developed by Sixfab, an edge AI hardware solutions company an...
2026-06-26 20:00
4497
Innoscience's current products are not affected by both rulings of the Munich Regional Court
MUNICH, June 18, 2026 /PRNewswire/ -- Innoscience today announced that the Munich Regional Court has just issued a pair of rulings, from which it could be confirmed that Innoscience's currently marketed gallium nitride ("GaN") power device products fall outside the scope of Infineon's asserted Ge...
2026-06-19 11:24
7047
Nuvoton Technology Corporation Strengthens Tethered XR Glass SoC Business Through Collaboration With Qualcomm Technologies
HSINCHU, June 17, 2026 /PRNewswire/ -- Nuvoton Technology Corporation announced its collaboration with Qualcomm Technologies, Inc. to strengthen its system-on-chip (SoC) business for tethered XR glass applications. By combining Nuvoton's low-power, XR-optimized SoCs with Qualcomm's Snapdragon® XR...
2026-06-18 08:00
4142
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
- Delivers 12-high HBM4E samples to major customers - Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency - Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability - SK hynix strengthens its AI leadership with ...
2026-06-18 07:35
7628
Insta360 Announces Hello Kitty Limited Edition GO Ultra Camera Bundle
LOS ANGELES, June 11, 2026 /PRNewswire/ -- Insta360 has officially announced a global collaboration with Sanrio to launch the Insta360 GO Ultra × Hello Kitty Limited Edition. Released on June 11, the bundle marks the most in-depth collaboration in Insta360's history, featuring custom hardware des...
2026-06-11 20:00
6749
Inaugural Hongqiao Tech Week Set to Launch November 2026: Where Global Tech Ambition Meets Chinese Scale
SHANGHAI, June 11, 2026 /PRNewswire/ -- Informa Markets China has announced the inaugural Hongqiao Tech Week, scheduled for November 20–22, 2026, at the National Exhibition and Convention Center in Shanghai. Positioned in one of Asia's most dynamic innovation hubs, the event will unite global ent...
2026-06-11 17:00
9284
Smooth Motor Advances Across Robotics and Intelligent Automation Industries Through 30 Years of Rapid Engineering Response
NINGBO, China, June 8, 2026 /PRNewswire/ -- Robotics, semiconductor equipment, and intelligent automation systems are evolving at an accelerating pace, placing OEM manufacturers under growing engineering and supply chain pressure. Product development cycles continue to shorten while system comple...
2026-06-08 23:00
6234
Behind CISCE with Jason: Inside a hardcore automobile manufacturer and its supplier network
BEIJING, June 8, 2026 /PRNewswire/ -- This is a report from China.org.cn
 
Video Link: https://youtu.be/9NLo7nKtGo8
2026-06-08 18:06
5876
/C O R R E C T I O N -- Primax Electronics/
In the news release, Primax Advances AI Conference Solutions with Qualcomm-Powered Edge AI Platforms, issued 04-Jun-2026 by Primax Electronics over PR Newswire, we are advised by the company that in the subheadline and first paragraph, the term "MDEP-ready development" should be removed. The com...
2026-06-05 12:37
10424
ASPEED Technology and Subsidiary Cupola360 Team Up for COMPUTEX 2026, Showcasing Next-Gen Highly Integrated Server Solutions and 360 Reality Remote Management Solutions
TAIPEI, June 3, 2026 /PRNewswire/ -- ASPEED Technology Inc., the global leader in Baseboard Management Controllers (BMC), together with its subsidiary Cupola360 Inc., is co-exhibiting at COMPUTEX 2026. This year, focusing on next-generation highly integrated server solutions and data center contr...
2026-06-03 18:15
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SurplusGLOBAL Secures Korean Patents for AI-Powered Export Control Automation Technology, Strengthening Safety in Semiconductor Equipment and Parts Transactions
Export Control AI Agent Applied to SemiMarket Expands Use in Transactions with Global Major Fabs SEOUL, South Korea, June 1, 2026 /PRNewswire/ -- SurplusGLOBAL (CEO: Bruce Kim) announced that it has secured Korean patents covering two core technologies implemented within its global semiconductor...
2026-06-01 21:00
7382
Airoha Technology Partners with E Ink for Global Debut of 4.2-Inch Ripple™ ESL at Computex 2026
ZHUBEI CITY, June 1, 2026 /PRNewswire/ -- Airoha Technology today announced its inaugural exhibition at the ePaper Pavilion during Computex 2026. Leveraging 20 years of deep technological expertise in wireless transmission, Airoha's Bluetooth® audio chips have earned widespread adoption and valid...
2026-06-01 18:01
4324
MediaTek Collaborates with NVIDIA on the RTX Spark to Power the Next Wave of Windows PC Experiences
MediaTek brings its design expertise in CPU performance and power efficiency to the groundbreaking RTX Spark, bringing local personal agents, advanced content creation, and gaming together in small, ultra-efficient Windows PCs TAIPEI, June 1, 2026 /PRNewswire/ -- MediaTek today announced its role...
2026-06-01 13:30
3984
/C O R R E C T I O N -- SEMIFIVE/
In the news release, SEMIFIVE and ICY Tech Achieve Successful Tape-out of 8nm eMRAM-Based Edge AI SoC, Targeting First Commercialization in Asia, issued 07-May-2026 by SEMIFIVE over PR Newswire, we are advised by the company that changes have been made. The complete, corrected release follows: S...
2026-05-29 12:28
10769
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026 in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE...
2026-05-29 06:03
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ASPEED Technology and Lattice Semiconductor Announce Strategic Partnership to Advance Next-Generation Control for Datacenter Management
‒ Integration of Lattice FPGA Technology into ASPEED's AST1840 Platform Enables Flexible, Expandable Control for Modern Server Architectures ‒ HSINCHU and HILLSBORO, Ore., May 28, 2026 /PRNewswire/ -- ASPEED Technology, the global leader in Baseboard Management Controllers (BMC) and Lattice Semi...
2026-05-28 15:30
10245
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Hi3D V1.0 Goes Open Source: The First Production-Validated Open-Source AI 3D Model
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25456
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21685
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19626
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19189