Semiconductors

SEMIFIVE Strengthens AI ASIC Market Position Through IPO "Targeting Global Markets with Advanced-nodes, Large-Die Designs, and 3D-IC Technologies"

* As demand shifts from general-purpose semiconductors toward AI ASICs, SEMIFIVE provides customized chip development solutions to fabless companies and device manufacturers. * New orders have increased from KRW 57.2 billion in 2022 to KRW 123.9 billion in 2024, driven by Big-Tech-Ready high-...

2025-12-17 14:32 5369

Advantech Expands Global Edge AI Partner Ecosystem with DEEPX and Launches First Joint Solution

TAIPEI, Dec. 16, 2025 /PRNewswire/ -- Advantech, a global leader in IoT intelligent systems and embedded platforms, today announced its partnership with DEEPX, a leading Korean AI semiconductor innovator specializing in NPU (Neural Processing Unit) technology. This collaboration expands Advantech...

2025-12-17 11:10 3314

China's Tech Rising Star Zhongwei Sail Breaks Micro LED Barriers; First Solutions Set for Global Debut at AES in UAE

DUBAI, Dec. 16, 2025 /PRNewswire/ -- Beijing Zhongwei Sail Technology Co., Ltd. ("ZW-Sail"), a pioneer in Micro LED semiconductor micro-display systems, today announced the successful tape-out of its first process verification chip. Achieving critical performance breakthroughs, the company's inau...

2025-12-17 04:00 2553

S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development

SAN JOSE, Calif., Dec. 16, 2025 /PRNewswire/ -- S2C, MachineWare, and Andes Technology today announced a collaborative co-emulation solution designed to address the increasing complexity of RISC-V-based chip design. The solution integrates MachineWare's SIM-V virtual platform, S2C's Genesis Archi...

2025-12-17 02:00 2262

Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports

Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 TOKYO, Dec. 16, 2025 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of$133 billion...

2025-12-16 15:00 4733

LG Innotek Showcases 'Future Car Innovation Solutions' Ushering in the AIDV Era at CES 2026

* Autonomous driving concept car and two EV mockups equipped with 35 core components * Showcasing of AI software‑based smart and safe mobility functions through 'integrated convergence solutions' SEOUL, South Korea, Dec. 16, 2025 /PRNewswire/ -- OnDecember 16, LG Innotek (CEO Moon Hyuksoo) an...

2025-12-16 08:33 6277

GIBO Announces Strategic Collaboration with E Total Technology Sdn Bhd to Accelerate Deployment of AI Compute Centers Featuring NVIDIA's Most Advanced Chips

KUALA LUMPUR, Malaysia, Dec. 15, 2025 /PRNewswire/ -- GIBO Holdings Ltd. (NASDAQ: GIBO) today announced a strategic collaboration withMalaysia-based technology and infrastructure solutions providerE Total Technology Sdn Bhd, under which the parties will work together on the planning, site sourcin...

2025-12-15 21:00 4762

SEMIFIVE Secures AI Semiconductor Design Projects in Japan, Accelerating Global Expansion with New Local Subsidiary

- Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC - Establishes a subsidiary in Japan to strengthen global reach SEOUL, South Korea, Dec. 11, 2025 /PRNewswire/ -- SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ li...

2025-12-12 08:39 6303

Meishilong Electronics Clinches 2025 Global Electronic Component Distributor "Annual Growth Star Award" - Dual Consecutive Wins Reinforce Industry Leadership

Global Recognition Validates Company's Commitment to Quality, Innovation and Customer-Centric Solutions SHENZHEN, China, Dec. 11, 2025 /PRNewswire/ -- Shenzhen Meishilong Electronic Technology Co., Ltd. (MSL MEISHILONG), a leading global distributor of electronic components, has been formally ho...

2025-12-11 22:14 2913

VisIC Technologies Announces $26M Round B Investment Led by Global Semiconductor Leader; Hyundai Motor Company and Kia (Together as "HKMC") Joins as Strategic Investor

NESS ZIONA, Israel, Dec. 10, 2025 /PRNewswire/ -- VisIC Technologies Ltd., a pioneer in Gallium Nitride (GaN) power semiconductors for electric mobility, today announced the successful second closing of its Round B funding, securing $26 million. The round was led by a global semiconductor leader, ...

2025-12-10 15:00 2366

VisIC Technologies Announces $26M Round B Investment Led by Global Semiconductor Leader; Hyundai Motor Company and Kia (Together as "HKMC") Joins as Strategic Investor

NESS ZIONA, Israel, Dec. 10, 2025 /PRNewswire/ -- VisIC Technologies Ltd., a pioneer in Gallium Nitride (GaN) power semiconductors for electric mobility, today announced the successful second closing of its Round B funding, securing $26 million. The round was led by a global semiconductor leader, ...

2025-12-10 15:00 19094

Axcelis to Showcase Advanced Ion Implant Solutions at SEMICON Japan 2025

BEVERLY, Mass., Dec. 10, 2025 /PRNewswire/ -- Axcelis Technologies , Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor...

2025-12-10 07:00 2763

DEEPX Launches DX-H1 V-NPU: The 30W Single-Card Solution That Challenges GPU Dominance

Recently recognized with a CES 2026 Innovation Award, the solution combines video decoding, AI inference, and encoding on a single chip, offering 80% hardware cost savings compared to GPU architectures. LAS VEGAS and SEOUL, South Korea, Dec. 9, 2025 /PRNewswire/ -- Ahead of CES 2026, DEEPX, a pi...

2025-12-09 21:00 4452

Jiangyin Concludes Golden Autumn Investment Month with 208 Projects Totaling RMB68 Billion

JIANGYIN, China, Dec. 9, 2025 /PRNewswire/ -- The 2025 Jiangyin Symposium on Economic and Trade Cooperation was held onDecember 6, hosted by the Jiangyin Municipal Committee and Government. Marking the culmination of this year's Golden Autumn Investment Month, which featured more than 50 promotio...

2025-12-09 17:37 2939

Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography

Breakthrough enables scalable, high-precision biosensing applications in life sciences and healthcare LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ -- * Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV lithography on 300mm wafers. This innovation ...

2025-12-09 16:00 2637

ASPEED Technology Wins GSA Best Financially Managed Semiconductor Company Award

HSINCHU, Dec. 9, 2025 /PRNewswire/ -- ASPEED Technology, the world's leading provider of Baseboard Management Controller (BMC) SoCs, today announced that it has been awarded the 2025"Best Financially Managed Semiconductor Company Award" (Achieving Up toUS$1 Billion in Annual Sales) at the Global ...

2025-12-09 15:30 2138

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

TAIPEI, Dec. 9, 2025 /PRNewswire/ --  Data Center AI Chip Shipments Continue to Grow According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip catego...

2025-12-09 14:44 2448

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ -- * Imec presents the first comprehensive thermal study ...

2025-12-09 01:01 2960

Navitas, Cyient Semiconductors enter into a strategic partnership to accelerate GaN adoption in India's AI, Mobility, Industrial, and Energy Markets

TORRANCE, Calif. and HYDERABAD, India, Dec. 8, 2025 /PRNewswire/ -- Navitas Semiconductor Corporation (Nasdaq: NVTS), the industry leader in next-generation GaNFa...

2025-12-08 22:00 3677

PCBAIR Unveils 8-Layer Glass Core PCB Manufacturing for Next-Gen AI & HPC

SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL). The new glass substrates achieve superior signal inte...

2025-12-08 22:00 2256
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