Computer Hardware
USI Integrates Vacuum Printing Encapsulation and Copper Pillar Transfer Technology to Advance System-Level Packaging Applications
SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer technology, the company said. After three years of development, the process is now being used in capsule ...
2025-12-10 07:30
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Axcelis to Showcase Advanced Ion Implant Solutions at SEMICON Japan 2025
BEVERLY, Mass., Dec. 10, 2025 /PRNewswire/ -- Axcelis Technologies
2025-12-10 07:00
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DEEPX Launches DX-H1 V-NPU: The 30W Single-Card Solution That Challenges GPU Dominance
Recently recognized with a CES 2026 Innovation Award, the solution combines video decoding, AI inference, and encoding on a single chip, offering 80% hardware cost savings compared to GPU architectures. LAS VEGAS and SEOUL, South Korea, Dec. 9, 2025 /PRNewswire/ -- Ahead of CES 2026, DEEPX, a pi...
2025-12-09 21:00
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Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
TAIPEI, Dec. 9, 2025 /PRNewswire/ -- Data Center AI Chip Shipments Continue to Grow According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip catego...
2025-12-09 14:44
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DEEPX- Announces Ultra-Efficient AI Video Analytics Solution Based on AmpereOne® Platform
A New Architecture That Outperforms Traditional CPU + GPU Systems by a Wide Margin SANTA CLARA, Calif. and SEOUL, South Korea, Dec. 8, 2025 /PRNewswire/ -- DEEPX, a leader in ultra-low-power on-device AI semiconductors, announced on the 8th the launch of a next-generation AI video analytics plat...
2025-12-08 21:26
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Goodix Powers Samsung's Galaxy Z TriFold with Advanced Foldable Touch and Fingerprint Solutions
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- Goodix Technology today announced that its industry‑leading main & sub touchscreen controller and ultra‑narrow side‑key capacitive fingerprint solution are featured in Samsung's first multi-folding phone, Galaxy Z TriFold. Leveraging Goodix's advanced...
2025-12-08 18:20
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ASUS IoT and CTHINGS.CO Forge Partnership to Accelerate Scalable Edge AI and IoT Solutions
Smart connectivity made simple with scalable edge AI and 5G-ready IoT solutions KEY POINTS * Unified edge intelligence: ASUS IoT gateways and CTHINGS.CO Orchestra enable faster, more secure, and easily managed IoT deployment * Smarter operations: Real-time analytics and automation deliver pre...
2025-12-08 14:01
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Orbbec and Advantech Showcase NVIDIA Accelerated Physical AI Platform for Next-Generation Robotics at iREX 2025
TOKYO, Dec. 3, 2025 /PRNewswire/ -- Orbbec
2025-12-04 10:17
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Chinese Robotics Company PaXini Shines at iREX 2025, Demonstrating Top-Tier Global Embodied Intelligence Strength
TOKYO, Dec. 4, 2025 /PRNewswire/ -- The International Robot Exhibition (iREX
2025), a leading global robotics event running fromDecember 3rd to 6th in
Tokyo, Japan. PaXini Tech
2025-12-04 09:00
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NEXCOM Simplifies Time-Sensitive Networking for Industrial Edge
TAIPEI, Dec. 2, 2025 /PRNewswire/ -- NEXCOM, a leading supplier of network
appliances, has unveiled the verified performance results of its Time-Sensitive
Networking (TSN) switch,ISA 142
2025-12-02 10:00
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Huawei Cloud Showcases Breakthrough AI-Native Innovations in Singapore to Power Local Industry Partners
Huawei also announces the Huawei Cloud Singapore AI Pioneer Partner Ecosystem Alliance to Drive AI innovation Across Key Industries SINGAPORE, Nov. 28, 2025 /PRNewswire/ -- The Huawei Cloud & AI Partner Summit Singapore 2025, held under the theme "AI Pioneer In Industries", concluded successfull...
2025-11-29 01:05
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Lenovo Neptune Powers the World's Greenest and Most Efficient HPC & AI Systems, Delivering up to 40% Lower Energy Use
* Lenovo ranks #1 on the Top500 Supercomputers and Green500 lists * Neptune systems deliver up to 100% heat removal achieving 1.1 PUE * Warm-water cooling operates up to ~45 °C, eliminating chilled-water requirements JAKARTA, Indonesia, Nov. 27, 2025 /PRNewswire/ -- Lenovo today announced ex...
2025-11-27 20:29
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Lenovo Neptune Powers the World's Greenest and Most Efficient HPC & AI Systems, Delivering up to 40% Lower Energy Use
* Lenovo ranks #1 on the Top500 Supercomputers and Green500 lists * Neptune systems deliver up to 100% heat removal achieving 1.1 PUE * Warm-water cooling operates up to ~45 °C, eliminating chilled-water requirements MANILA, Philippines, Nov. 27, 2025 /PRNewswire/ -- Lenovo today announced e...
2025-11-27 20:22
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Lenovo Neptune Powers the World's Greenest and Most Efficient HPC & AI Systems, Delivering up to 40% Lower Energy Use
* Lenovo ranks #1 on the Top500 Supercomputers and Green500 lists * Neptune systems deliver up to 100% heat removal achieving 1.1 PUE * Warm-water cooling operates up to ~45 °C, eliminating chilled-water requirements PETALING JAYA, Malaysia, Nov. 27, 2025 /PRNewswire/ -- Lenovo today announc...
2025-11-27 18:36
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Lenovo Neptune Powers the World's Greenest and Most Efficient HPC & AI Systems, Delivering up to 40% Lower Energy Use
* Lenovo ranks #1 on the Top500 Supercomputers and Green500 lists * Neptune systems deliver up to 100% heat removal achieving 1.1 PUE * Warm-water cooling operates up to ~45 °C, eliminating chilled-water requirements SINGAPORE, Nov. 27, 2025 /PRNewswire/ -- Lenovo today announced expansion o...
2025-11-27 17:34
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Lenovo Neptune Powers the World's Greenest and Most Efficient HPC & AI Systems, Delivering up to 40% Lower Energy Use
* Lenovo ranks #1 on the Top500 Supercomputers and Green500 lists * Neptune systems deliver up to 100% heat removal achieving 1.1 PUE * Warm-water cooling operates up to ~45 °C, eliminating chilled-water requirements SYDNEY, Nov. 27, 2025 /PRNewswire/ -- Lenovo today announced expansion of i...
2025-11-27 17:09
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Lexar Unveils Industry's First AI Storage Core for Next‑Generation Edge AI Devices
SAN JOSE, Calif., Nov. 26, 2025 /PRNewswire/ -- As AI computing moves rapidly from the cloud to the edge, devices such as AI PCs, intelligent vehicles, and robotics face mounting storage challenges: real-time multimodal data throughput, extreme random I/O workloads, environmental reliability req...
2025-11-26 23:54
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Kontron Launches New Industrial Computer KBox E-430-RPL/RPH
To Help Integrators & Developers Bring Intelligence to Their Applications TAIPEI, Nov. 26, 2025 /PRNewswire/ -- Kontron, a leading global provider of IoT / Embedded Computing Technology, launches a new industrial computer, named KBox E-430-RPL/RPH, providing integrators and developers with a robu...
2025-11-26 09:00
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USI Collaborates with Customer to introduce Intel® Evo™ Certified Thunderbolt™ 5 Smart Dock
- Pioneering high-speed connectivity and intelligent management for next-generation workspaces- SHANGHAI, Nov. 24, 2025 /PRNewswire/ -- Universal Scientific Industrial ( Shanghai) Co., Ltd. (USI) today announced the successful collaboration with a world-renowned brand customer to develop and mass...
2025-11-24 07:30
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ASUS Unveils Comprehensive Storage Solutions at SC25
Delivering high-performance, scalable infrastructure for AI, HPC, and enterprise workloads KEY POINTS * Fully scalable storage: Unified, block, file, object, and software-defined systems for AI, HPC, and enterprise workloads * Next-gen AI power: XA AM3A-E13 with AMD Instinct MI355X GPUs deli...
2025-11-21 14:29
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ALLSWIFIT Introduces ActiveRise+, a Stable Carbon-Plate Running Shoe Built to Help Everyday Runners Train Smarter and Run Stronger
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