Semiconductors
Longsys Achieves One Million Monthly mSSD Production Capacity, Accelerating Edge AI Storage Deployment
SUZHOU, China, July 2, 2026 /PRNewswire/ -- Longsys (301308.SZ) announced the establishment of a stable monthly production and delivery capacity of one million mSSD (Micro SSD) units, marking a major milestone for its high speed mSSD storage solutions. The new production capacity is designed to m...
2026-07-02 19:58
4710
Stathera Announces US$55 Million Series B to Scale Silicon Timing and Accelerate Next-Generation AI Data Center Solutions
* Oversubscribed Round led by Maverick Silicon, with participation from Celesta Capital, BDC Capital, MediaTek Innovation Fund, TXC Corporation, and Ultratech Capital Partners * Stathera silicon timing technology delivers performance demanded by modern mobile, IoT, and AI data center systems...
2026-06-30 21:00
2963
Visitor Guide for electronica Shanghai 2026 Released: Complete Directory of 2,000+ Exhibitors and Online/Offline Events Unveiled
SHANGHAI, June 30, 2026 /PRNewswire/ -- As the countdown to electronica Shanghai 2026 begins, the annual Visitor Guide has been formally released. This comprehensive guide unveils the complete floor plans, a full directory of over 2,000 exhibitors, concurrent technical forum agendas, the online l...
2026-06-30 18:03
2667
MDT Showcases Full Portfolio of TMR and AMR Magnetic Sensors at Electronica Shanghai 2026
— Vertically Integrated Manufacturing Ensures Stable, Scalable Supply of
High-Performance Magnetic Sensors
SHANGHAI, June 30, 2026 /PRNewswire/ -- MultiDimension Technology
2026-06-30 13:15
2881
SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026
AI-driven Demand for HBM, DDR5 and Data Storage Lifts Memory Investment Outlook, With Spending Projected to Approach $80 Billion by 2029 MILPITAS, Calif., June 29, 2026 /PRNewswire/ -- Worldwide 300mm fab equipment investment in the memory sector is projected to surpass $50 billion for the first...
2026-06-29 22:00
2774
MetaOptics Begins Shipment of Metalens Smartphone and AI Smart Glasses to European and Japanese Customers for Evaluation
SINGAPORE, June 26, 2026 /PRNewswire/ -- MetaOptics Ltd. (Catalist: 9MT) ("MetaOptics" or the "Company"), a leading-edge semiconductor optics company pioneering metalens technology, today announced that it has begun shipping evaluation units of its metalens-integrated 5G smartphone and AI smart g...
2026-06-26 18:11
6986
DEEPX and Sixfab Launch 'DEEPX AI HAT' to Drive Edge Physical AI on Raspberry Pi
* Partnership delivers high-performance, low-power AI acceleration directly to the global Raspberry Pi ecosystem * Eliminates cloud dependency for real-time inference in robotics and smart automation * Rolls out production-ready Starter Kit and SDKs to lower entry barriers for global develo...
2026-06-26 15:30
11539
IBM Debuts World's First Sub-1 Nanometer Chip Technology
Built with revolutionary "nanostack" 3D chip architecture, IBM's sub-1 nm chip
to propel semiconductor industry forward for the next decade
YORKTOWN HEIGHTS, N.Y., June 25, 2026 /PRNewswire/ -- IBM (NYSE: IBM
2026-06-25 18:00
7912
SK keyfoundry Develops 'Bi-SCR-Based On-Chip EMC Protection Technology' to Enhance Automotive Semiconductor Reliability
SEOUL, South Korea, June 25, 2026 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has recently developed a 'Bi-SCR (Bi-directional Silicon Controlled Rectifier)-based On-Chip EMC protection technology' capable of dramatically enhancing the EMC (ElectroMagnet...
2026-06-25 08:00
6871
SPHERE AX Partners with U.S. AI Semiconductor Company Blaize at the National Assembly
Korea-U.S. Physical AI Cooperation Gets Underway -- Joint Development of AI Semiconductor-Based Products EL DORADO HILLS, Calif. and SEOUL, South Korea, June 24, 2026 /PRNewswire/ -- SPHERE AX (CEO: Yunha Park), a company specializing in Vision AI and Edge AI Computing, announced that it si...
2026-06-24 18:00
17381
ATLANT 3D, A*STAR IMRE and NAMIC Sign MoU to Advance AI-Driven Materials Discovery in Singapore
COPENHAGEN, Denmark and SINGAPORE, June 24, 2026 /PRNewswire/ -- ATLANT 3D, the A*STAR Institute of Materials Research and Engineering (A*STAR IMRE), and the National Additive Manufacturing Innovation Cluster (NAMIC), a national platform hosted by A*STAR, have signed a Memorandum of Understanding...
2026-06-24 15:30
7174
electronica Shanghai 2026: High-quality Industrial Enterprises Gather at this Can't-miss Electronics Event !
SHANGHAI, June 23, 2026 /PRNewswire/ -- electronica Shanghai 2026 will take place fromJuly 1 to 3, 2026 at the Shanghai New International Expo Centre (SNIEC),in halls W1-W5 and N1-N5. It is expected to attract a total of over 2,000 high-quality exhibitors from domestic and international markets s...
2026-06-23 17:30
8555
Infineon wins patent infringement case against Innoscience
MUNICH, June 19, 2026 /PRNewswire/ -- The District Court Munich, Germany (Landgericht München I) today ruled in favor of Infineon Technologies in two further of the patent infringement cases – specifically one based on a patent one based on a utility model – concerning gallium nitride (GaN) techn...
2026-06-19 02:05
10057
ARTERY MCU Adds BGA100 Package to Boost Dexterous Hand and Robot Joint Control Applications
HSINCHU, June 18, 2026 /PRNewswire/ -- In response to the rapid development of the humanoid robot, dexterous hand, and smart robot markets, Artery Technology announces the addition of a BGA100 package option to its high-performance AT32F435/437 MCU series, further expanding its product portfolio....
2026-06-18 19:18
4804
Floadia Releases Automotive Embedded Flash IP on TSMC 180BCD Gen3 Platform
TOKYO, June 18, 2026 /PRNewswire/ -- Floadia Corporation (hereinafter "Floadia"), a Tokyo, Japan-based developer of embedded flash IP (eFlash IP), has announced the release of its latest automotive eFlash IP, G1, implemented on TSMC's 180BCD Gen3 process platform. The newly released IP is designe...
2026-06-18 14:00
8024
Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System
* World's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer line * Omni x-series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing applications. * Supports FOPLP, CoPoS, and T...
2026-06-15 16:25
4060
Mouser Brings Innovation to NEPCON Thailand 2026
BANGKOK, June 15, 2026 /PRNewswire/ -- Mouser Electronics
2026-06-15 16:06
7346
Innoscience Secures Final Victory in Patent Lawsuit as China's Supreme Court Upholds Injunction Against Infineon GaN Products
SUZHOU, China, June 13, 2026 /PRNewswire/ -- In a landmark decision for the global semiconductor industry, the Supreme People's Court of China has officially issued a final review decision sustaining a sales injunction against Infineon Technologies. The ruling means that effective immediately, In...
2026-06-13 16:46
7292
Luxel Corporation Appoints KOS, Inc. as Exclusive Distributor in South Korea
FRIDAY HARBOR, Wash., June 13, 2026 /PRNewswire/ -- Luxel Corporation, a global leader in the design and manufacture of ultrathin freestanding polymer and metallized optical bandpass filters, today announced the appointment of KOS, Inc. as its exclusive distribution partner for South Korea, effec...
2026-06-13 06:36
8538
CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering
SEBERANG PERAI, Malaysia, June 12, 2026 /PRNewswire/ -- The semiconductor
industry is under growing pressure to deliver more capable technologies while
reducing development time, cost, and risk.
2026-06-12 09:30
5221
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