Semiconductors
Upbeat Technology to Showcase World's Smallest AI-Powered MEMS Vibration Sensors at Sensors Converge 2026
Tiny AI Engine Enables Crystal-Clear Voice in OWS Headsets, Smart Glasses, and
Intelligent Voice Recorders, and Powers Predictive Maintenance for Industrial
Automation
SANTA CLARA, Calif., April 28, 2026 /PRNewswire/ -- Upbeat Technology
JCET Reports 42.7% YoY Surge in Q1 2026 Net Profit Attributable to Shareholders
SHANGHAI, April 28, 2026 /PRNewswire/ -- JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2026. For the quarter, the company reported revenue of RMB 9.17 b...
JCET Reports 42.7% YoY Surge in Q1 2026 Net Profit Attributable to Shareholders
SHANGHAI, April 28, 2026 /PRNewswire/ -- JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2026. For the quarter, the company reported revenue of RMB 9.17 b...
Mouser Electronics New Product Insider: Over 9,000 New Parts Added in First Quarter of 2026
SHANGHAI, April 27, 2026 /PRNewswire/ -- As an authorized distributor, Mouser
Electronics
NYSE Content Update: AI Company Vast Data Announces $30 Billion Valuation
NYSE issues a pre-market daily advisory direct from the trading floor. NEW YORK, April 24, 2026 /PRNewswire/ -- The New York Stock Exchange (NYSE) provides a daily pre-market update directly from the NYSE Trading Floor. Access today's NYSE Pre-market update for market insights before trading begi...
Zhejiang unicorn ranks grow to 58 as Hangzhou tightens lead, top ranking shows
Province adds three unicorns, expands high-growth pipeline Hangzhou accounts for 83% as new entrants and startups scale up HANGZHOU, China, April 24, 2026 /PRNewswire/ -- Zhejiang's roster of unicorn companies has expanded to 58 as of April 2026, highlighting the province's growing role as a hub ...
Arasan Announces immediate availability of its UFS 5.0 Host controller IP
Arasan announces the immediate availability of its UFS 5.0 Host Controller IP. The UFS 5.0 Host IP is already in use by Tester Companies for compliance and production testing. SAN JOSE, Calif., April 23, 2026 /PRNewswire/ -- Arasan extends its long history of support for JEDEC and MIPI standards...
MetaOptics achieves a progressive milestone in securing design/evaluation orders for its metalenses and modules from world-class customers
SINGAPORE, April 23, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") is pleased to announced that it has achieved a progressive milestone in securing design/evaluation orders of its metalenses and modules from w...
GIGABYTE Collaborates with NVIDIA® on GeForce RTX™ 50 Series and PRAGMATA™ Bundle
TAIPEI, April 22, 2026 /PRNewswire/ -- GIGABYTE, the world's leading computer brand, announces the collaboration with NVIDIA for the PRAGMATA™ GeForce RTX 50 Series game bundle across eligible graphics cards, desktops, and laptops powered by NVIDIA GeForce RTX™ 5070 or above GPUs and Laptop GPUs....
Arasan acheives the Industrys First ASIL-D Certification for its CAN XL IP Core
Arasan announces the industry's first ASIL-D Certification for its CAN XL IP. The certification also covers Arasan's CAN FD IP and CAN 2.0 IP. SAN JOSE, Calif., Apr. 21, 2026 /PRNewswire/ -- Arasan Chip Systems, the industry's leading provider of IP for Mobile and Automobile SoC's, announced tod...
RoboSense Unveiled EOCENE SPAD-SoC Architecture and Chipsets Phoenix and Peacock: Ushering the LiDAR Industry into the Image-grade Era of High-Definition 3D Perception
* RoboSense debuted the EOCENE SPAD-SoC architecture, enabling rapid incubation of a diverse chipset portfolio while streamlining R&D workflows to deliver significant structural cost advantages. * RoboSense launched the Phoenix chipset, the industry's first automotive-grade monolithic SPAD-So...
DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Next-Generation Physical AI Compute Platform for Robotics
Collaboration targets DX-M2-based robotic AI infrastructure, expanding into VLA and VLM technologies for next-generation intelligent robots SEOUL, South Korea, April 21, 2026 /PRNewswire/ -- DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group...
LG Innotek to Supply Cutting-Edge Automotive Wi-Fi 7 Communication Module to a leading European automotive parts company
* Order value of approximately USD 68M with mass production to begin in 2027 * Offering data transmission speed three times faster, with no speed degradation even with multiple devices connected simultaneously * Changing perception of car considered as 'a second living space'…Trend enhancing...
Efficiently Managing Hundreds of Billions of Quality Inspection Data: Dataram IDM Empowers PCB Enterprises to Build World-Class Quality Systems
TAIPEI, April 16, 2026 /PRNewswire/ -- As Smart Manufacturing becomes the core driver of industrial transformation, the electronic assembly industry—led by PCB (Printed Circuit Boards)—is undergoing a profound digital revolution. In high-precision production environments, the widespread adoption ...
Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
Through the collaboration, Silicon Box will work with industry leaders to advance automotive-grade chiplet devices with advanced packaging. SINGAPORE, April 15, 2026 /PRNewswire/ -- Silicon Box, an industry leader in advanced semiconductor packaging solutions, today announced that it has formall...
Tageos Launches World's First FlexIC-based RFID Product Lines Powered by Pragmatic Semiconductor Technology
Partnership delivers industry-leading sustainable innovation to unlock market opportunity for low-carbon NFC connectivity at scale. * The new Tageos 'EOS Lite' and 'EOS Zero® Lite' product lines are purpose-built solutions, minimizing carbon footprint through innovative antenna designs, ultra-...
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
Americas and APAC Region Reported Double-Digit Year-over-Year Revenue Increase MILPITAS, Calif., April 13, 2026 /PRNewswire/ -- Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quar...
Supermicro Introduces Compact, Energy-Efficient Systems to Accelerate Adoption of Intelligent Edge AI
* Purpose-built edge AI systems support real-time inferencing and business-critical workloads across retail, manufacturing, healthcare, and enterprise environments * Flexible configurations deliver data center-class performance in space- and power-constrained edge deployments * Advanced sec...
HKEX Advances Index Ecosystem with Two Tech-Focused Benchmarks
* HKEX launches the HKEX KRX Semiconductor Index and the HKEX Tech & US Tech 100 Index * These mark the latest development in HKEX's index strategy, expanding its proprietary and co‑branded benchmark offerings * HKEX enters licensing agreements with 5 issuers to develop ETFs in Hong Kong tr...
Breaking the Bottleneck in Medical Imaging Core Components: VITAL MedTech Unveils Its Vertical Integration Solution from Materials to Medical Systems at CMEF 2026
SHANGHAI, April 13, 2026 /PRNewswire/ -- At CMEF 2026, VITAL MedTech, the
healthcare unit of VITAL MATERIALS, unveiled a full range of innovations based
on its semiconductor core technologies. It demonstrated its full vertical
integration across core materials, chips, and medical systems.
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