Semiconductors
MetaOptics Ltd announces S$1.1 million placement to advance full automation of its metalens colour camera module production line
SINGAPORE, Sept. 11, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group"), a leading-edge semiconductor optics company, today announced that it has entered into several placement agreements for a placement of 2,685,82...
2026-09-11 22:47
17559
Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
Arasan Chip Systems, announces its participation at the MIPI I3C® Interop Session in Taipei with its I3C® Host IP, I3C® Dual IP and I3C® Device IP on Oct 19-20, 2026 SAN JOSE, Calif., Sept. 10, 2026 /PRNewswire/ -- Arasan Chip Systems announces its participation in the I3C® Interoperability Sess...
2026-09-10 23:10
2408
MICROIP Secures Major US$20 Million Smart Residential Community Contract in Taiwan, Accelerating Edge AI Commercialization
Deploying Next-Generation Edge AI Architecture; New Project Secures Long-Term Revenue Visibility Starting October 2026 TAIPEI, Sept. 10, 2026 /PRNewswire/ -- MICROIP (TPEx: 7796), a leading provider of custom ASIC design services and Edge AI software-hardware integrated solutions, today announce...
2026-09-10 22:07
4451
IBM, Lockheed Martin Announce Swiss Quantum Innovation Hub at ETH Zurich, Anchored by Switzerland's First IBM Quantum Computer
In an extension of ongoing collaboration, IBM and Lockheed Martin plan to initiate research projects with select Swiss academic institutions. The Swiss National Supercomputing Centre at ETH Zurich will host an IBM Quantum System Two, expanding access across Swiss institutions to fuel the country...
2026-09-10 15:00
1980
Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers
- Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials - TOKYO, Sept. 10, 2026 /PRNewswire/ -- Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a pa...
2026-09-10 15:00
2173
Tulip Unveils Global Imaging Patent Licensing Program
Tulip Imaging provides access to more than 125,000 patents from Canon, Sony, Huawei, and OPPO covering foundational image and information processing technologies LONDON, Sept. 10, 2026 /PRNewswire/ -- Tulip Licensing Ltd today announced the launch of Tulip Imaging, a new patent licensing program...
2026-09-10 08:00
3246
LattePanda Launches the LattePanda Mu Ultra: A Micro x86 Compute Module for On-Device AI
SHANGHAI, Sept. 9, 2026 /PRNewswire/ -- LattePanda Team
2026-09-09 20:00
2118
DB HiTek Completes Reliability Qualification for 8-Inch 1,200 V SiC MOSFET Process
* Establishes World's First Complete 8-Inch SiC Foundry Process Flow * Provides First- and Second-Generation PDKs to Customers, with Third-Generation PDK Scheduled for November; Expected to Shorten Product Development Time by More Than One Year SEOUL, South Korea, Sept. 9, 2026 /PRNewswire/ -...
2026-09-09 09:00
2224
Axcelis to Build New Manufacturing Facility in Pyeongtaek, Korea
BEVERLY, Mass., Sept. 8, 2026 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today announced plans to invest $35 million in its global manufacturing infrastructure through the construction of a n...
2026-09-08 20:00
4479
Quantinuum Finalizes $100 Million CHIPS R&D Award with U.S. Department of Commerce to Advance Trapped-Ion Quantum Computer Manufacturing in the US
* The federal funding supports critical R&D and U.S. quantum semiconductor manufacturing capabilities needed to scale fault-tolerant trapped-ion quantum computing. * Company partnering with GlobalFoundries to fabricate next-gen ion traps and control electronics, and Monarch Quantum to develop...
2026-09-08 19:30
4624
Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection
HSINCHU, Sept. 8, 2026 /PRNewswire/ -- Spirox (TWSE: 3055), today hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications. Spirox also ...
2026-09-08 18:00
2467
Karrie International's First Batch Vera Rubin Deliveries and Rising ASIC Server Volume Drive Expected Q4 Revenue Record
HONG KONG, Sept. 8, 2026 /PRNewswire/ -- Global leading server mechanical engineering solutions provider – Karrie International Holdings Limited ("Karrie International" or the "Company", together with its subsidiaries, the "Group"; stock code: 1050.HK) announced that the first batch of NVIDIA Ver...
2026-09-08 16:14
2100
Fujitsu develops diamond-spin quantum computer prototype
New diamond-spin quantum computer prototype incorporating tin-vacancy (SnV) centers into photonic integrated circuits marks significant step toward quantum computing scalability KAWASAKI, Japan, Sept. 8, 2026 /PRNewswire/ -- Fujitsu today announced that it has developed the world's first working...
2026-09-08 15:15
1852
USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing
NANTOU, Sept. 8, 2026 /PRNewswire/ -- USI today announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, an...
2026-09-08 07:00
2035
GEEKOM Launches A5 2027 Edition Mini PC, Built for Productivity That Lasts
TAIPEI, Sept. 7, 2026 /PRNewswire/ -- GEEKOM
2026-09-07 20:30
2222
Beyond the Screen: INFiLED Expands LED Across Rail Transport
SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ -- In June 2026, INFiLED completed a new digital wayfinding installation at Shenzhen North Railway Station, where GeminiLED Series was deployed at key passenger circulation points. Together with earlier INFiLED rail projects across China, the installati...
2026-09-07 15:26
1518
BUUU Group Limited Signs Definitive Agreement to Acquire Majority Stake in Brightray Science Inc. and Over US$60 Million of Private Placements, Making Industrialized AI Data Center Delivery Its Core Growth Business
Six-to-nine-month delivery — half the conventional timeline; 70MW in operation in Johor, Malaysia; pipeline expected to reach approximately 2GW. BUUU is concurrently relocating its headquarters to Singapore and signing over US$60 million of private placements SINGAPORE, Sept. 3, 2026 /PRNewswire...
2026-09-03 21:19
15422
Silicon Line®, an EverProX® brand, Launches new Ultra-Low-Power SerDes Chipset MSDL™ (MIPI Serial Data Link), Extending 20 Gbps MIPI D-PHY Connectivity to Tens of Meters
New optical/electrical solution aggregates two simultaneous MIPI-DPHY camera streams, at up to 10 Gbps each, over two serialized links while consuming less than 100 mW per link, eliminating bulky cable bundles with optical fiber or differential copper connectivity. Discover more: https://silicon-...
2026-09-03 18:00
2377
DIGITIMES Intelligence: AI's Next Battleground Is Moving Beyond Chips to the Connections Between Them
TAIPEI, Sept. 2, 2026 /PRNewswire/ -- The global race to build artificial intelligence infrastructure is entering a new phase. For the past several years, much of the competition has centered on securing the most powerful AI accelerators. But as hyperscalers pour billions of dollars into data cen...
2026-09-02 14:06
2665
Artery Launches AT32F406/F408 Mainstream MCU Series for Smart Control and High-Speed Data
TAIPEI, Sept. 2, 2026 /PRNewswire/ -- Artery Technology
2026-09-02 10:30
2111
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