Electronic Components
Canadian Solar Inc. Announces Results of 2026 Annual Meeting of Shareholders
KITCHENER, ON, July 2, 2026 /PRNewswire/ -- Canadian Solar Inc
LG Innotek Targets USD 647 million in Package Solution Operating Profit by 2031
SEOUL, South Korea, June 30, 2026 /PRNewswire/ -- LG Innotek, renowned for its
optical solution business and leadership in high-performance camera modules, is
quickly establishing itself as a key player in package solutions, including
high-value-added semiconductor substrates.
DEEPX and Sixfab Launch 'DEEPX AI HAT' to Drive Edge Physical AI on Raspberry Pi
SEOUL, South Korea, June 26, 2026 /PRNewswire/ -- DEEPX, an on-device AI semiconductor pioneer, today announced that its ultra-low-power NPU technology is powering the Sixfab AI HAT+ for Raspberry Pi 5, a new edge AI acceleration board developed by Sixfab, an edge AI hardware solutions company an...
JinkoSolar's Tiger Neo 3.0 Modules Receive TÜV Rheinland Verification for Advanced Shading Resistance and Hail Resistance
MUNICH, June 25, 2026 /PRNewswire/ -- JinkoSolar Holding Co., Ltd. ("JinkoSolar" or the "Company") (NYSE: JKS), a global leader in clean energy technology, today announced that its Tiger Neo 3.0 modules achieved TÜV Rheinland's "A+ Shading Score" under the PfG 2926/05.25 test methodology, while ...
e‑STORAGE to Deliver 426 MWh of Energy Storage in Florida
KITCHENER, ON, June 25, 2026 /PRNewswire/ -- Canadian Solar Inc.
Canadian Solar Achieves Silver Certification Under SSI Supply Chain Traceability for Ingot and Cell Production
KITCHENER, ON, June 24, 2026 /PRNewswire/ -- Canadian Solar Inc.
e-STORAGE to Supply 381 MWh Battery Storage System for Apex Clean Energy in Michigan
KITCHENER, ON, June 24, 2026 /PRNewswire/ -- Canadian Solar Inc.
e-STORAGE and Axpo Partner on First Joint Battery Project in Italy
KITCHENER, ON, June 23, 2026 /PRNewswire/ -- Canadian Solar Inc.
Hanon Systems Supports Youth Education and Talent Development Initiatives Across Global Operations
* Supports STEM education through partnership with U.S. student robotics team competing in FIRST World Championship * Promotes career exploration, strengthens industry-academia collaboration, and encourages outreach initiatives at global sites that foster student interest in STEM subjects and...
Canadian Solar Launches TOPCon 3.0 High-Power-Density Module, Delivering up to 670 Wp, 24.8% Efficiency and Lower LCOE for Utility-Scale and C&I Solar Projects
KITCHENER, ON, June 22, 2026 /PRNewswire/ -- Canadian Solar Inc.
LG Display OLED becomes world's first to achieve "Perfect Color/Brightness" certification
SEOUL, South Korea, June 21, 2026 /PRNewswire/ -- LG Display, the world's leading innovator of display technologies, announced today that its entire lineup of large-sized OLED panels, including for monitors and TVs, has become the first in the world to receive "Perfect Color/Brightness Accuracy u...
JinkoSolar Earns RETC's "Overall Highest Achiever" Award for the Seventh Consecutive Year
SHANGRAO, China, June 15, 2026 /PRNewswire/ -- JinkoSolar Holding Co., Ltd. (the "Company," or "JinkoSolar") (NYSE: JKS), a global leader in clean energy technology, today announced it has been recognized as an Overall Highest Achiever in the 2026 PV Module Index (PVMI) Report, published by RETC,...
JinkoSolar Announces Cash Dividend
SHANGRAO, China, June 12, 2026 /PRNewswire/ -- JinkoSolar Holding Co., Ltd. ("JinkoSolar" or the "Company") (NYSE: JKS), a global leader in clean energy technology, today announced that its board of directors has declared a cash dividend of US$0.375 per ordinary share of US$0.00002 each of the Co...
ROHM Launches New Top-side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting ...
Turn World Cup Passion into Custom Creations with Monport Laser Engraver and Laser Cutter Technology
NEW YORK, June 4, 2026 /PRNewswire/ -- As anticipation grows for the 2026 World
Cup, Monport Laser
U Power Hydro Data Joint Venture Receives "Data Center Power & Energy Solution" Recognition at DIF Awards 2026 in Thailand
BANGKOK, June 1, 2026 /PRNewswire/ -- U Power Limited (Nasdaq: UCAR) ("U Power" or the "Company"), a provider of AI-integrated solutions for next-generation energy grids and intelligent transportation systems, building on its proprietary UOTTA™ electric vehicle ("EV") battery-swapping technology,...
/C O R R E C T I O N -- SEMIFIVE/
In the news release, SEMIFIVE and ICY Tech Achieve Successful Tape-out of 8nm eMRAM-Based Edge AI SoC, Targeting First Commercialization in Asia, issued 07-May-2026 by SEMIFIVE over PR Newswire, we are advised by the company that changes have been made. The complete, corrected release follows: S...
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026 in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE...
AuthenX to Unveil Detachable 2D FAU Technology at COMPUTEX 2026, Eliminating the Optical Packaging Bottleneck for Next-Gen AI and HPC Clusters
Integrating 12-inch CMOS Meta-Lenses into a multi-row 2D array, AuthenX delivers ultra-low loss and high alignment tolerance to seamlessly scale 3.2T to 12.8T CPO deployments. TAIPEI, May 28, 2026 /PRNewswire/ -- AuthenX Inc., a leading innovator in high-speed optical interconnect solutions, tod...
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
* LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies * To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology * To highlight RF‑SiP substrates that adopt a groundbreaking appli...
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