Electronic Components
Molex Opens Expanded Vietnam Manufacturing Plant
* Over 250,000-square-meter facility in Hung Yen supports manufacturing and engineering capabilities for high-speed data center customers * Second site investment in Vietnam extends operations, adding more than 10,000 new jobs in high-tech manufacturing * Spacious, modern amenities and energ...
Unlocking APAC Semiconductor Bottleneck Opportunities: CSOP Solactive Asia AI Bottleneck Index ETF to List on HKEX tomorrow
HONG KONG, Sept. 16, 2026 /PRNewswire/ -- CSOP Solactive Asia AI Bottleneck Index ETF (3499.HK) will list on HKEX tomorrow (17th September 2026). 3499.HK seeks to provide investment results that, before deduction of fees and expenses, closely correspond to the performance of Solactive Asia AI Bot...
Axera and Aptiv Bring M57-Powered Driver Assistance to Europe-Bound Vehicles
Aptiv's next-generation integrated front-view ADAS solution, powered by Axera's M57 SoC, enters mass production for a leading Chinese NEV automaker. SHANGHAI, Sept. 16, 2026 /PRNewswire/ -- Axera (Stock Code: 0600.HK) announced that its automotive-grade ADAS SoC M57 now powers Aptiv's new-genera...
Grand Finale in Vietnam: Sungrow Master 2026 Raising Benchmarks for Solar Technical Expertise
DA NANG, Vietnam, Sept. 16, 2026 /PRNewswire/ -- Sungrow, a globally leading PV inverter and energy storage system provider, officially announced that the Sungrow Master — Installation Skill Competition 2026 has successfully concluded in Vietnam. This event traveled across cities in northern, cen...
FIT Tech Day 2026 Focuses on Optical Connectivity in the AI Era, Bringing Global Industry Leaders Together to Explore "Light at Scale"
HONG KONG, Sept. 16, 2026 /PRNewswire/ -- Foxconn Interconnect Technology (FIT Hon Teng, HKEX: 6088) today hosted FIT Tech Day 2026, themed "Light at Scale: The Next Frontier in Data Center Interconnects." The event brought together global leaders from the optical communications, AI, and semicond...
SQC Appoints Semiconductor Veteran John Hollister as Chief Financial Officer
Hollister brings 25+ years of financial leadership across the global
semiconductor industry, including previous CFO roles at GlobalFoundries and
Silicon Labs
SYDNEY, Sept. 16, 2026 /PRNewswire/ -- Silicon Quantum Computing
Momax Wins 2026 IFA Innovation Award in Berlin
1-Power S.Pass² Air Sets a New Benchmark for Semi-Solid-State Battery Portable Power and Premium Craftsmanship HONG KONG, Sept. 15, 2026 /PRNewswire/ -- Momax, the global leader in cutting-edge Semi-Solid-State Battery (SSB) technology for mobile power banks and a design-led pioneer in smart cha...
Analog Devices to Acquire Alif Semiconductor, Adding an AI-Native Processing Platform to Advance Physical Intelligence for the Next Generation of Real-World Systems
* Accelerates ADI's delivery of "Physical Intelligence", enabling systems to sense, reason, and act locally in real time within the constraints of the physical world * Adds Alif's AI-native fusion processors, giving customers a scalable platform to quickly build full system solutions by combi...
SAJ Electric unveils HS5 EK series and celebrates partner momentum with Alex de Minaur in Brisbane
BRISBANE, Australia, Sept. 15, 2026 /PRNewswire/ -- On 14 September, SAJ hosted over 100 of Australia's leading solar and energy storage decision-makers at Pat Rafter Arena, Brisbane, for an evening with brand ambassador Alex de Minaur, a first look at the company's new HS5 EK70 and EK90 series o...
QBit Semiconductor Targets Physical AI and Drone Markets with QB88XX Series Integrating Robot "Cerebellum" Control
TAIPEI, Sept. 15, 2026 /PRNewswire/ -- QBit Semiconductor (TWO: 7913), a
Taiwan-based fabless IC design leader in high-end image processing and motion
control, unveiled its robotics and drone chipset roadmap at SEMICON Taiwan
2026, targeting Physical AI control opportunities.
Share buybacks in Ericsson during the period September 7 - September 11, 2026
STOCKHOLM, Sept. 14, 2026 /PRNewswire/ -- During the period September 7 - September 11, 2026, Telefonaktiebolaget LM Ericsson(publ) ("Ericsson") (LEI code 549300W9JLPW15XIFM52) repurchased own Class B shares (ISIN: SE0000108656) as follows: Date Aggregated daily volume (number of shares) Wei...
Sungrow PhD Talk Outlines 5 Key Trends in Offshore Renewables
YANTAI, China, Sept. 14, 2026 /PRNewswire/ -- Sungrow, a global leading renewable energy company, recently hosted the latest edition of its PhD Talk series in China's Bohai Bay, bringing together experts and industry representatives in offshore PV, island microgrids, deep-water offshore wind and ...
Auria Announces Partnership and Contract with Mitsubishi Electric to Advance Next-Generation SATCOM Mission and Resource Management
COLORADO SPRINGS, Colo., Sept. 14, 2026 /PRNewswire/ -- Auria
CPO Design Evolution Drives Gen Precision's Expansion of Custom FAU Inspection for Production Lines
Gen Precision expands the GTK-OSI1 for production-line inspection of FAUs with up to 80 channels and custom structures, delivering 3σ ≤ 0.1 μm repeatability. TAOYUAN, Sept. 14, 2026 /PRNewswire/ -- Gen Precision is expanding its inspection capabilities for co-packaged optics (CPO) applications as...
MetaOptics Ltd announces S$1.1 million placement to advance full automation of its metalens colour camera module production line
SINGAPORE, Sept. 11, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group"), a leading-edge semiconductor optics company, today announced that it has entered into several placement agreements for a placement of 2,685,82...
Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
Arasan Chip Systems, announces its participation at the MIPI I3C® Interop Session in Taipei with its I3C® Host IP, I3C® Dual IP and I3C® Device IP on Oct 19-20, 2026 SAN JOSE, Calif., Sept. 10, 2026 /PRNewswire/ -- Arasan Chip Systems announces its participation in the I3C® Interoperability Sess...
Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers
- Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials - TOKYO, Sept. 10, 2026 /PRNewswire/ -- Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a pa...
Risen Energy Expands into Green Computing and Power Integration
NINGHAI, China, Sept. 10, 2026 /PRNewswire/ -- As artificial intelligence and large-scale computing infrastructure continue to expand, computing capacity is becoming increasingly dependent on reliable, low-carbon and cost-effective electricity. In response to this trend, Risen Energy is extending...
Play Without Limits, Create Without Compromise: Philips Evnia 34M2C8600PC Redefines the Gaming & Creator Workspace with Ultrawide QD-OLED Penta Tandem
SINGAPORE, Sept. 10, 2026 /PRNewswire/ -- Philips Evnia announced the launch of the 34M2C8600PC, a flagship 34-inch curved display engineered to eliminate the compromise between tournament-level gaming speed and color critical creative precision. Built on cutting-edge QD-OLED Penta Tandem technol...
New ABB and BCG report highlights growing role of direct current technologies in future power systems
* Rapid expansion of AI computing, increasing electrification and rise of renewable energy are driving renewed interest in DC technology as part of future electrical systems * Both AC and DC systems have strategically important roles in meeting future electricity demand * Establishing commo...
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