Electronic Components
SEMI Reports Global Semiconductor Equipment Billings Increased 14% Year-Over-Year in Q1 2026
Record Quarterly Equipment Billings Reflect Continued AI-Driven Investment
MILPITAS, Calif., June 5, 2026 /PRNewswire/ -- SEMI
2026-06-05 06:00
3365
Delta Thailand Showcases Integrated Building Automation Solutions for Smarter, Healthier and More Sustainable Spaces at NOVA Expo 2026
BANGKOK, June 4, 2026 /PRNewswire/ -- Delta Electronics (Thailand) Public
Company Limited
2026-06-04 17:05
6694
ViewSonic Showcases AI-Enabled Learning and Integrated Visual Solutions Expansion
TAIPEI, June 3, 2026 /PRNewswire/ -- ViewSonic Corp.
2026-06-03 14:01
7388
Quobly secures €115 million Series A to bring silicon-based quantum computers to market
GRENOBLE, France, June 3, 2026 /PRNewswire/ -- Quobly, a French quantum computing company, today announced the closing of a €115 million Series A financing to accelerate the industrialization of its silicon-based quantum computers and bring its first commercial product to market by the end of 202...
2026-06-03 13:00
4229
Reshaping PV Value: Sungrow Renewables Launches Smart Module in a Landmark Industry Debut
SHANGHAI, June 2, 2026 /PRNewswire/ -- On June 1, Sungrow Renewables held its 2026 Intelligent Technology Conference in Shanghai. Sungrow Renewables unveiled its new iBuilding BIPV 2.0 power plant solution and officially introduced the world's first self-developed high-efficiency smart PV module....
2026-06-02 09:56
5209
ASUS Unveils Revolutionary ProArt PCs Powered by NVIDIA RTX Spark at COMPUTEX 2026
* New ProArt AI PCs Powered by NVIDIA RTX Spark
ASUS introduces ProArt laptops
2026-06-01 20:58
6482
Supermicro Introduces DCBBS Blueprints for NVIDIA Vera Rubin NVL72 and NVIDIA HGX™ Rubin NVL8, Built to Scale from 5MW to 1GW as an End-to-End Total Solution
* End-to-End Blueprint Scalable from a 5MW to 1GW Power Envelope with full facility-side infrastructure for either single-tenant or multi-tenant deployments * DLC-2 Direct Liquid Cooling: engineered for near total heat capture, power efficiency, and lower noise with full stack integration of ...
2026-06-01 17:12
4114
JA Solar Leads the Post‑Cycle PV Market with Dual‑Technology Breakthroughs and Integrated Solutions
BEIJING, June 1, 2026 /PRNewswire/ -- JA Solar recently outlined its strategic
roadmap for the post‑cycle photovoltaic (PV) market, reaffirming its leadership
across TOPCon and BC technologies while advancing toward a fully integrated
energy‑solutions model.
2026-06-01 13:40
6630
Supermicro Launches New Server Solutions with Intel Xeon 6+ Processors to Reduce TCO and Accelerate Time-to-Online for Large-Scale Cloud and Data Centers
* 12 new systems across Hyper, SuperBlade®, FlexTwin™, and GrandTwin® families offer industry-leading core density with up to 576 efficiency cores per server * Breakthrough performance-per-watt and energy efficiency designed to lower TCO and reduce power consumption in high-density cloud and ...
2026-06-01 11:00
6362
Infineon Joins NVIDIA's MGX™ AI Factory Ecosystem to Transform Power Delivery Architecture for Next-Generation AI Server Racks
MUNICH, May 29, 2026 /PRNewswire/ -- Infineon Technologies (FSE: IFX) (OTCQX: IFNNY), a leading provider of power systems and IoT, has joined NVIDIA's MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon's power management solutions will support...
2026-05-29 09:15
5615
ABB report shows how a 0.2 percent motor efficiency gain could unlock billions for industry
* Report examines a decade of data for over 1,000 large motors and generators delivered globally by ABB's Västerås facility in Sweden * The specification gap between standard and Top Industrial Efficiency (TIE) option could be costing global operators up to $12 billion over a 25-year asset li...
2026-05-28 23:34
3883
Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution
Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution including support for AP Memory's Xccela™ PSRAM and the latest LVpSRAM™ SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- Arasan Chip Systems, a leading provider of IP for mobile and automobile SoC's, is ...
2026-05-28 23:15
5783
Powermat Technologies and Anker Innovations Announce Patent License Agreement and Strategic Collaboration
TEL AVIV, Israel and SHENZHEN, China, May 28, 2026 /PRNewswire/ -- Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker Innovations Co., Ltd., a world leader in consumer electronics, today announced a patent license ...
2026-05-28 09:00
4240
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors
Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI
and HPC Accelerate Demand for Advanced Packaging Technologies
MILPITAS, Calif., May 27, 2026 /PRNewswire/ -- SEMI
2026-05-27 22:00
3896
Bulletin from the Extraordinary General Meeting of AB Electrolux
The Extraordinary General Meeting of AB Electrolux was held in Stockholm on May 27, 2026 STOCKHOLM, May 27, 2026 /PRNewswire/ -- Amendment of the Articles of Association The General Meeting resolved, in accordance with the Board's proposal, to adjust the limits for the minimum and maximum shar...
2026-05-27 17:53
3947
Apacer Showcases Edge AI Storage Power at COMPUTEX 2026
TAIPEI, May 27, 2026 /PRNewswire/ -- As Edge AI applications rapidly transition from proof-of-concept to real-world deployment, the growing demands for high bandwidth, thermal efficiency, and sustained computing performance are driving increasing demand for reliable industrial-grade storage solut...
2026-05-27 13:05
7177
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging i...
2026-05-27 07:00
7754
ISDN's IDI Dynamics debuts high-speed laser marker for semiconductor assembly and test (OSAT)
New High-speed Laser Marker delivers 2.5x higher chip throughput (units per
hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly &
Test (OSAT)manufacturers drive productivity of valuable production floor space
SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics
2026-05-26 08:40
13989
PROMISE Technology Brings Sustainability Focus to AI Storage at COMPUTEX 2026
TAIPEI, May 25, 2026 /PRNewswire/ -- PROMISE Technology, a global innovator in enterprise storage solutions, announced it will showcase its latest AI-optimized storage portfolio at COMPUTEX 2026, highlighting a strategic focus on performance, storage expansion, and energy efficiency. Taking plac...
2026-05-25 10:00
7490
ASTRI Congratulates Dr Lai Ka‑ying on Joining Shenzhou‑23 Mission
Showcasing Hong Kong's R&D Strength and Advancing Space Technology Applications HONG KONG, May 23, 2026 /PRNewswire/ -- The Hong Kong Applied Science and Technology Research Institute (ASTRI) warmly congratulates Dr Lai Ka‑ying on her selection as a member of the Shenzhou‑23 crew, serving as a pa...
2026-05-23 15:31
6756
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