Semiconductors
Boosting Bandwidth with Minimal Footprint: Cervoz's 2.5GbE M.2 2230 (A+E) Ethernet Card
TAIPEI, July 15, 2024 /PRNewswire/ -- As 4K streaming and IoT applications
strain traditional Gigabit networks, Cervoz, a leader in industrial-grade
storage, memory, and expansion cards, introduces its new2.5GbE M.2 2230 (A+E
key) PCIe Ethernet Card
2024-07-15 21:30
3603
Govee Lights Up Summer with Unbelievable Prime Day Discounts - Transform Your Home into a Staycation Oasis
HONG KONG, July 15, 2024 /PRNewswire/ -- Govee
2024-07-15 20:01
3049
Nano Labs Announces Receipt of Deficiency Letters from Nasdaq
HANGZHOU, China, July 12, 2024 /PRNewswire/ -- Nano Labs Ltd (Nasdaq: NA) ("we," the "Company" or "Nano Labs"), a leading fabless integrated circuit design company and product solution provider in China, today announced that it received a notification letter datedJuly 11, 2024 (the "Deficiency Le...
2024-07-13 04:30
7354
ChipMOS SCHEDULES SECOND QUARTER 2024 FINANCIAL RESULTS CONFERENCE CALL
HSINCHU, July 10, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-07-10 18:20
2870
ChipMOS REPORTS 6.7% YoY INCREASE IN 2Q24 REVENUE AND 7.2% YoY INCREASE IN JUNE 2024 REVENUE
HSINCHU, July 10, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-07-10 18:00
4491
SurplusGLOBAL to Present SemiMarket Parts Mall at SEMICON WEST 2024
SEOUL, South Korea, July 9, 2024 /PRNewswire/ -- SurplusGLOBAL, a leading provider in the legacy semiconductor equipment and parts market, is attending SEMICON WEST 2024 fromJuly 9 to 11 in San Francisco, California. The company will introduce the SemiMarket Parts Mall, a comprehensive marketplac...
2024-07-09 22:00
3978
DFI Launches COM Express Mini Type 10 Module with Intel Atom® x7000RE Series Processors
Delivering High Performance, Energy Efficiency, and Enhanced Reliability for
Advanced Industrial and IoT Applications
TAIPEI, July 9, 2024 /PRNewswire/ -- DFI
2024-07-09 19:00
3487
SK hynix Develops PCB01 for Artificial Intelligence PCs
* Development of PCB01, 5th generation of 8-channel PCIe, to be followed by mass production within this year * PCB01, industry's best SSD for PCs, optimized for on-device AI * Advancement in NAND solution to extend success story of HBM, solidify leadership in AI memory space SEOUL, South Kor...
2024-06-28 08:08
3553
Delta Electronics and Texas Instruments Unveil Joint Innovation Laboratory to Develop Advanced Power Systems for Electric Vehicles
TAIPEI, June 21, 2024 /PRNewswire/ -- Delta, a global leader in power management and a provider of IoT-based smart green solutions, today announced the establishment of a joint innovation laboratory with Texas Instruments (TI), a global semiconductor leader. With TI's innovative technologies and ...
2024-06-21 15:00
4265
M31 Announces the Launch of Advanced LPDDR Memory IP to Support HPC Applications
HSINCHU, June 19, 2024 /PRNewswire/ -- M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), announced the launch of the latest LPDDR memory IP solution to meet the growing demand in the high-performance computing (HPC) application market, even looking beyond ...
2024-06-19 18:18
3025
Nota AI®, Leading AI Optimization Company, Secures $19.9 Million Series C Funding to Pioneer On-Device Generative AI
* Cumulative funding reaches approximately $42.6 million since inception, solidifying Nota AI's position as Korea's leading on-device AI innovator * IPO preparations for 2025 are underway with strong backing from lead underwriter * Participation from global AI semiconductor CVC and major AI ...
2024-06-18 21:00
4124
Chipsea Unveils Latest PC Technologies at COMPUTEX, Expanding Global Reach
SHENZHEN, China, June 18, 2024 /PRNewswire/ -- During COMPUTEX Taipei 2024 held fromJune 4th to 7th, Chipsea Technologies (Shenzhen) Corp. (Chipsea) highlighted its significant contributions to the field of integrated circuit design and its latest strides in microcontroller and sensing (MCU) tec...
2024-06-18 19:16
3413
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
Developing HPC Chiplet Platform to Feature LPDDR6 Memory Interface SEOUL, South Korea, June 12, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Te...
2024-06-13 06:00
3688
ChipMOS SHAREHOLDERS APPROVE CASH DIVIDEND DISTRIBUTION OF NT$1.80 PER COMMON SHARE OR APPROXIMATELY US$1.11 PER ADS
HSINCHU, June 12, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-06-12 21:10
4777
DIGITIMES Asia: Nvidia CEO Jensen Huang talks about partners, growing competition
TAIPEI, June 12, 2024 /PRNewswire/ -- According to the news report from the
technology-focused media DIGITIMES Asia
2024-06-12 19:57
3740
DECO's mmWave Wireless Connection Solution Unveiled at InfoComm, accelerating the Wireless Era of LED Display
LAS VEGAS, June 12, 2024 /PRNewswire/ -- From June 12 to 14, 2024, the InfoComm 2024 audiovisual display and systems integration exhibition was held at theLas Vegas Convention Center, USA. DECO INTEGRATION TECHNOLOGY CO., LTD. (hereinafter referred to as "DECO"), a leading innovator in millimeter...
2024-06-12 14:00
2670
SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform
The HPC platform to be built on Samsung SF4X with LPDDR6 Memory Interface
SEOUL, South Korea, June 11, 2024 /PRNewswire/ -- SEMIFIVE, a leading SoC
design platform, announced today it has joinedArm Total Design
2024-06-12 06:00
3696
ROHM's New "TRCDRIVE pack (TM)" with 2-in-1 SiC Molded Module: Significantly Reduces xEV Inverter Size
- Industry-leading* Power Density Achieved by Integrating 4th Generation SiC MOSFETs in Compact Package - KYOTO, Japan, June 11, 2024 /PRNewswire/ -- ROHM Co., Ltd. has developed four models as part of the TRCDRIVE pack (TM) series with 2-in-1 SiC molded modules (two of 750V-rated: BSTxxxD08P4A1...
2024-06-11 16:00
2574
LG Innotek solidifying its position as a leader in camera modules through innovative AI processes
* The initial yield, which determines profitability and customer confidence, is solved with the 'AI process recipe'. * AI that has been trained on tens of millions of data points has reduced the defect rate of key inspection items by up to 90%. * Effective in enhancing cost competitiveness.....
2024-06-10 20:00
3923
Samsung reportedly achieves technical breakthrough, stacking 3D DRAM to 16 layers
TAIPEI, June 5, 2024 /PRNewswire/ -- According to the news report from the
technology-focused media DIGITIMES Asia
2024-06-05 16:32
2669
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