SMIC Holds 2007 Technology Symposium in Beijing

BEIJING, Oct. 17 /Xinhua-PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI and HKSE: 981) held its technology symposium in Beijing on October 17, 2007, attracting approximately 300 customers, design services providers, technology partners, and vendors.

(Logo: http://www.prnasia.com/sa/200611101605-min.jpg )

"Mutual Success Through Collaboration and Innovation" was the topic of the 2007 symposium. In the opening speech, SMIC Vice President, Ms. Esther Liu reviewed SMIC's accomplishments through the theme of collaboration and innovation. She thanked all of the customers, partners, and vendors for their continuous support to SMIC and looked forward to further collaboration and mutually beneficial relationships.

Dr. Liang Sheng, Vice President of Beijing Semiconductor Industry Association, spoke at the symposium emphasizing SMIC's critical role in Beijing's IC industry and he hoped to see more cooperation in all areas to develop the industry. Dr. Sun Yuning, President of IGRS Engineering Lab Ltd and Mr. Liu Guangjun, Director of Datang Mobile Communications Equipment CO., LTD, gave keynote presentations at the symposium.

In addition, SMIC presented its latest developments in advanced logic technologies, mixed-signal, RF, spice modeling, memory, embedded memory technology, High Voltage, sensor, and display technologies.

The symposium also featured an exhibition where design services and assembly partners displayed their products and services.

About SMIC

Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the top semiconductor foundries in the world and the largest and most advanced foundry in Mainland China. Headquartered in Shanghai, SMIC provides integrated circuit manufacturing service at 0.35um to 90nm and finer line technologies. SMIC has a 300mm wafer fabrication facility (fab) under start-up and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and an in-house assembly and testing facility in Chengdu. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab under construction in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation. For more information, please visit Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) manufacturing service at 0.35um to 90nm and finer line technologies. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) under pilot production and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and an in-house assembly and testing facility in Chengdu. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab under construction in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation. For more information, please visit http://www.smics.com .

Safe Harbour Statement

Information provided in this press release may contain statements relating to current expectations, estimates, forecasts and projections about future events that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. These forward-looking statements, including (state specific forward-looking statement, e.g. forecast, future plans etc.) generally relate to the company's plans, objectives and expectations for future operations and are based upon management's current estimates and projections of future results or trends. Actual future results may differ materially from those projected as a result of certain risks and uncertainties. For a discussion of such risks and uncertainties, see "Risk Factors" in the Company's Annual Report on Form 20-F filed on June 29, 2007 with the U.S. Securities and Exchange Commission. These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.