E&R Highlights Laser and Plasma Technologies for Advanced Packaging at SEMICON Taiwan 2025
KAOHSIUNG, Aug. 29, 2025 /PRNewswire/ -- As AI, HPC, and 5G drive semiconductor
innovation, advanced packaging has become the next strategic focus. Yole Group
projects the market to exceedUSD 50 billion by 2025, with fan-out panel-level
packaging (FOPLP) growing more than 15% annually.
E&R Showcases Next-Gen Laser and Plasma Solutions with Strategic Partners at SEMICON SEA 2025 in Singapore
KAOHSIUNG, May 9, 2025 /PRNewswire/ -- E&R Engineering Corp. is proud to announce its participation at SEMICON Southeast Asia 2025, held at the Sands Expo & Convention Centre,Singapore from May 20 to 22. With over 30 years of dedication in the semiconductor industry, E&R will unveil its latest i...
E&R to Showcase Glass Substrates and Advanced Technologies at SEMICON Taiwan 2024
KAOHSIUNG, Aug. 26, 2024 /PRNewswire/ -- E&R (8027.TWO), an advanced Laser & Plasma Provider, marks its 30th anniversary with significant advancements in technology and research. At SEMICON Taiwan 2024, E&R will present several core themes, including glass substrates as a critical material for ne...
E&R Engineering Corp. Unveils Cutting-Edge Solutions at Semicon SEA 2024 in Kuala Lumpur
KAOHSIUNG, May 19, 2024 /PRNewswire/ -- The advanced laser and plasma solution provider from Taiwan, E&R Engineering Corp., is confirmed to attend the feast in Semiconductor industry, Semicon SEA 2024, held inKuala Lumpur, Malaysia. With the 30-year dedication in the semiconductor industry, E&R h...
E&R: Leading SiC Process Integration Advance Solutions for Process Yield Enhancement
KAOHSIUNG, Nov. 3, 2023 /PRNewswire/ -- Silicon Carbide (SiC) is pivotal in semiconductors, with E&R Technology committed to boosting process yields via vital SiC integration solutions. SiC surpasses silicon with high-temperature resilience, superior voltage tolerance, potent power capabilities, ...
