Electronic Components
AuthenX to Unveil Detachable 2D FAU Technology at COMPUTEX 2026, Eliminating the Optical Packaging Bottleneck for Next-Gen AI and HPC Clusters
Integrating 12-inch CMOS Meta-Lenses into a multi-row 2D array, AuthenX delivers ultra-low loss and high alignment tolerance to seamlessly scale 3.2T to 12.8T CPO deployments. TAIPEI, May 28, 2026 /PRNewswire/ -- AuthenX Inc., a leading innovator in high-speed optical interconnect solutions, tod...
2026-05-28 14:00
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Powermat Technologies and Anker Innovations Announce Patent License Agreement and Strategic Collaboration
TEL AVIV, Israel and SHENZHEN, China, May 28, 2026 /PRNewswire/ -- Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker Innovations Co., Ltd., a world leader in consumer electronics, today announced a patent license ...
2026-05-28 09:00
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SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors
Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI
and HPC Accelerate Demand for Advanced Packaging Technologies
MILPITAS, Calif., May 27, 2026 /PRNewswire/ -- SEMI
2026-05-27 22:00
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LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
* LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies * To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology * To highlight RF‑SiP substrates that adopt a groundbreaking appli...
2026-05-27 20:00
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Bulletin from the Extraordinary General Meeting of AB Electrolux
The Extraordinary General Meeting of AB Electrolux was held in Stockholm on May 27, 2026 STOCKHOLM, May 27, 2026 /PRNewswire/ -- Amendment of the Articles of Association The General Meeting resolved, in accordance with the Board's proposal, to adjust the limits for the minimum and maximum shar...
2026-05-27 17:53
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Apacer Showcases Edge AI Storage Power at COMPUTEX 2026
TAIPEI, May 27, 2026 /PRNewswire/ -- As Edge AI applications rapidly transition from proof-of-concept to real-world deployment, the growing demands for high bandwidth, thermal efficiency, and sustained computing performance are driving increasing demand for reliable industrial-grade storage solut...
2026-05-27 13:05
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USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging i...
2026-05-27 07:00
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ISDN's IDI Dynamics debuts high-speed laser marker for semiconductor assembly and test (OSAT)
New High-speed Laser Marker delivers 2.5x higher chip throughput (units per
hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly &
Test (OSAT)manufacturers drive productivity of valuable production floor space
SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics
2026-05-26 08:40
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PROMISE Technology Brings Sustainability Focus to AI Storage at COMPUTEX 2026
TAIPEI, May 25, 2026 /PRNewswire/ -- PROMISE Technology, a global innovator in enterprise storage solutions, announced it will showcase its latest AI-optimized storage portfolio at COMPUTEX 2026, highlighting a strategic focus on performance, storage expansion, and energy efficiency. Taking plac...
2026-05-25 10:00
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ASTRI Congratulates Dr Lai Ka‑ying on Joining Shenzhou‑23 Mission
Showcasing Hong Kong's R&D Strength and Advancing Space Technology Applications HONG KONG, May 23, 2026 /PRNewswire/ -- The Hong Kong Applied Science and Technology Research Institute (ASTRI) warmly congratulates Dr Lai Ka‑ying on her selection as a member of the Shenzhou‑23 crew, serving as a pa...
2026-05-23 15:31
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Hisense Introduces UR8 with Natural and Real Color, Bringing Next-Generation RGB MiniLED Technology to More Homes
QINGDAO, China, May 22, 2026 /PRNewswire/ -- Hisense, a leading brand in global consumer electronics and home appliances, today introduced the UR8, an accessible RGB MiniLED TV series designed to bring next-generation display technology, natural and real color, immersive entertainment, and advanc...
2026-05-22 17:00
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Shanghai Electric Marks International Day for Biological Diversity with Localized Green Practices
SHANGHAI, May 22, 2026 /PRNewswire/ -- On the occasion of International Day for Biological Diversity on May 22, Shanghai Electric (SEHK: 02727, SSE: 601727) is highlighting localized green practices across its factories and project sites, underscoring how industrial projects can reduce environmen...
2026-05-22 15:20
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IBM and U.S. Department of Commerce Announce America's First Purpose-Built Quantum Foundry, Supported by Proposed $1 Billion CHIPS Award
Powered by IBM's decades-long quantum leadership, initiative will accelerate
American quantum innovation and enable advanced quantum wafer production for a
broad range of companies
WASHINGTON and ARMONK, N.Y., May 21, 2026 /PRNewswire/ -- Today, IBM (NYSE:
IBM
2026-05-21 20:11
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VTech Announces FY2026 Annual Results
Higher gross profit margin despite lower revenue and profit * Group revenue declined 6.9% to US$2,027.5 million * Gross profit margin improved from 31.5% to 32.7% * Profit attributable to shareholders of the Company decreased 14.5% to US$134.1 million * Final dividend of US36.0 cents per o...
2026-05-21 19:00
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Innodisk Launches High-Speed 10GbE LAN Series to Power Next-Generation Edge AI Networking
TAIPEI, May 20, 2026 /PRNewswire/ -- Innodisk, a leading global AI solution
provider, today launched itsHigh-Speed 10GbE LAN Series
2026-05-20 13:31
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Android 17 Beta Now Available for vivo X300 Pro and iQOO 15
SHENZHEN, China, May 20, 2026 /PRNewswire/ -- vivo today announced the release of Android 17 Beta 3 for its flagship vivo X300 Pro and iQOO 15 smartphones. This release provides developers with early access to explore and test the new Android features on vivo devices, ensuring a seamless and opti...
2026-05-20 08:00
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Embodied Intelligence Era Arrives: ROBOTECH ASIA Debuts at NEPCON ASIA 2026 with Mass Smart Production Solutions
SHENZHEN, China, May 19, 2026 /PRNewswire/ -- Booth bookings are now officially open for NEPCON ASIA 2026, Asia's premier electronics manufacturing exhibition. Expanding to an impressive 90,000 square meters, the event will serve as a one-stop hub for connecting upstream and downstream sectors—en...
2026-05-19 21:09
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ROHM's Scalable Power Supply Solutions for Automotive SoCs; Combining PMIC and DrMOS for Optimal SoC Power Design and Future Performance
KYOTO, Japan, May 19, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed a configurable power supply solution that combines the PMIC BD968xx-C Series with the DrMOS BD96340MFF-C, targeting automotive SoCs (Systems on a Chip) used in applications such as ADAS (Advanced Driver Assistance Systems), D...
2026-05-19 15:00
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TDConnex wins Leading Innovator of the Year award for Electronics at India's 2026 MSME Awards
TDConnex was one of two recipients in the Electronics category for the prestigious national MSME award in India for 2026. CHENNAI, India, May 18, 2026 /PRNewswire/ -- TDConnex, a global leader in micro-precision manufacturing, has been named Leading Innovator of the Year — Electronics at the 202...
2026-05-18 12:05
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SEMIFIVE Reports 137% YoY Revenue Growth in Q1 2026, Accelerating Its Rise as a Key Global Player in AI ASIC
* Revenue reached KRW 47.9 billion and new orders totaled KRW 55.4 billion, marking a record-breaking performance and signaling the beginning of full-scale growth. * Overseas ASIC development revenue, including North America and Japan, exceeded 60% of totalASIC development revenue, strengthen...
2026-05-17 15:45
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