Electronic Components
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026 in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE...
2026-05-29 06:03
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ABB report shows how a 0.2 percent motor efficiency gain could unlock billions for industry
* Report examines a decade of data for over 1,000 large motors and generators delivered globally by ABB's Västerås facility in Sweden * The specification gap between standard and Top Industrial Efficiency (TIE) option could be costing global operators up to $12 billion over a 25-year asset li...
2026-05-28 23:34
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Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution
Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution including support for AP Memory's Xccela™ PSRAM and the latest LVpSRAM™ SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- Arasan Chip Systems, a leading provider of IP for mobile and automobile SoC's, is ...
2026-05-28 23:15
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AuthenX to Unveil Detachable 2D FAU Technology at COMPUTEX 2026, Eliminating the Optical Packaging Bottleneck for Next-Gen AI and HPC Clusters
Integrating 12-inch CMOS Meta-Lenses into a multi-row 2D array, AuthenX delivers ultra-low loss and high alignment tolerance to seamlessly scale 3.2T to 12.8T CPO deployments. TAIPEI, May 28, 2026 /PRNewswire/ -- AuthenX Inc., a leading innovator in high-speed optical interconnect solutions, tod...
2026-05-28 14:00
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Powermat Technologies and Anker Innovations Announce Patent License Agreement and Strategic Collaboration
TEL AVIV, Israel and SHENZHEN, China, May 28, 2026 /PRNewswire/ -- Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker Innovations Co., Ltd., a world leader in consumer electronics, today announced a patent license ...
2026-05-28 09:00
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SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors
Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI
and HPC Accelerate Demand for Advanced Packaging Technologies
MILPITAS, Calif., May 27, 2026 /PRNewswire/ -- SEMI
2026-05-27 22:00
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LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
* LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies * To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology * To highlight RF‑SiP substrates that adopt a groundbreaking appli...
2026-05-27 20:00
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Bulletin from the Extraordinary General Meeting of AB Electrolux
The Extraordinary General Meeting of AB Electrolux was held in Stockholm on May 27, 2026 STOCKHOLM, May 27, 2026 /PRNewswire/ -- Amendment of the Articles of Association The General Meeting resolved, in accordance with the Board's proposal, to adjust the limits for the minimum and maximum shar...
2026-05-27 17:53
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Apacer Showcases Edge AI Storage Power at COMPUTEX 2026
TAIPEI, May 27, 2026 /PRNewswire/ -- As Edge AI applications rapidly transition from proof-of-concept to real-world deployment, the growing demands for high bandwidth, thermal efficiency, and sustained computing performance are driving increasing demand for reliable industrial-grade storage solut...
2026-05-27 13:05
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USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging i...
2026-05-27 07:00
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ISDN's IDI Dynamics debuts high-speed laser marker for semiconductor assembly and test (OSAT)
New High-speed Laser Marker delivers 2.5x higher chip throughput (units per
hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly &
Test (OSAT)manufacturers drive productivity of valuable production floor space
SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics
2026-05-26 08:40
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PROMISE Technology Brings Sustainability Focus to AI Storage at COMPUTEX 2026
TAIPEI, May 25, 2026 /PRNewswire/ -- PROMISE Technology, a global innovator in enterprise storage solutions, announced it will showcase its latest AI-optimized storage portfolio at COMPUTEX 2026, highlighting a strategic focus on performance, storage expansion, and energy efficiency. Taking plac...
2026-05-25 10:00
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ASTRI Congratulates Dr Lai Ka‑ying on Joining Shenzhou‑23 Mission
Showcasing Hong Kong's R&D Strength and Advancing Space Technology Applications HONG KONG, May 23, 2026 /PRNewswire/ -- The Hong Kong Applied Science and Technology Research Institute (ASTRI) warmly congratulates Dr Lai Ka‑ying on her selection as a member of the Shenzhou‑23 crew, serving as a pa...
2026-05-23 15:31
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Hisense Introduces UR8 with Natural and Real Color, Bringing Next-Generation RGB MiniLED Technology to More Homes
QINGDAO, China, May 22, 2026 /PRNewswire/ -- Hisense, a leading brand in global consumer electronics and home appliances, today introduced the UR8, an accessible RGB MiniLED TV series designed to bring next-generation display technology, natural and real color, immersive entertainment, and advanc...
2026-05-22 17:00
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Shanghai Electric Marks International Day for Biological Diversity with Localized Green Practices
SHANGHAI, May 22, 2026 /PRNewswire/ -- On the occasion of International Day for Biological Diversity on May 22, Shanghai Electric (SEHK: 02727, SSE: 601727) is highlighting localized green practices across its factories and project sites, underscoring how industrial projects can reduce environmen...
2026-05-22 15:20
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IBM and U.S. Department of Commerce Announce America's First Purpose-Built Quantum Foundry, Supported by Proposed $1 Billion CHIPS Award
Powered by IBM's decades-long quantum leadership, initiative will accelerate
American quantum innovation and enable advanced quantum wafer production for a
broad range of companies
WASHINGTON and ARMONK, N.Y., May 21, 2026 /PRNewswire/ -- Today, IBM (NYSE:
IBM
2026-05-21 20:11
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VTech Announces FY2026 Annual Results
Higher gross profit margin despite lower revenue and profit * Group revenue declined 6.9% to US$2,027.5 million * Gross profit margin improved from 31.5% to 32.7% * Profit attributable to shareholders of the Company decreased 14.5% to US$134.1 million * Final dividend of US36.0 cents per o...
2026-05-21 19:00
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Innodisk Launches High-Speed 10GbE LAN Series to Power Next-Generation Edge AI Networking
TAIPEI, May 20, 2026 /PRNewswire/ -- Innodisk, a leading global AI solution
provider, today launched itsHigh-Speed 10GbE LAN Series
2026-05-20 13:31
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Android 17 Beta Now Available for vivo X300 Pro and iQOO 15
SHENZHEN, China, May 20, 2026 /PRNewswire/ -- vivo today announced the release of Android 17 Beta 3 for its flagship vivo X300 Pro and iQOO 15 smartphones. This release provides developers with early access to explore and test the new Android features on vivo devices, ensuring a seamless and opti...
2026-05-20 08:00
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Embodied Intelligence Era Arrives: ROBOTECH ASIA Debuts at NEPCON ASIA 2026 with Mass Smart Production Solutions
SHENZHEN, China, May 19, 2026 /PRNewswire/ -- Booth bookings are now officially open for NEPCON ASIA 2026, Asia's premier electronics manufacturing exhibition. Expanding to an impressive 90,000 square meters, the event will serve as a one-stop hub for connecting upstream and downstream sectors—en...
2026-05-19 21:09
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