Semiconductors
JCET Reports 42.7% YoY Surge in Q1 2026 Net Profit Attributable to Shareholders
SHANGHAI, April 28, 2026 /PRNewswire/ -- JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2026. For the quarter, the company reported revenue of RMB 9.17 b...
ROHM Launches Ultra-compact Wireless Power Chipset for Wearables
KYOTO, Japan, April 28, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed a wireless power supply IC chipset consisting of the receiver (ML7670) and transmitter (ML7671) compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands. ML767x ch...
Mouser Electronics New Product Insider: Over 9,000 New Parts Added in First Quarter of 2026
SHANGHAI, April 27, 2026 /PRNewswire/ -- As an authorized distributor, Mouser
Electronics
SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM
* SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM * Contributed to the global AI computing ecosystem via stable mass production across all HBM generations * Company committed to becoming a premier leader in AI innovation through collaboration with glo...
NYSE Content Update: AI Company Vast Data Announces $30 Billion Valuation
NYSE issues a pre-market daily advisory direct from the trading floor. NEW YORK, April 24, 2026 /PRNewswire/ -- The New York Stock Exchange (NYSE) provides a daily pre-market update directly from the NYSE Trading Floor. Access today's NYSE Pre-market update for market insights before trading begi...
Zhejiang unicorn ranks grow to 58 as Hangzhou tightens lead, top ranking shows
Province adds three unicorns, expands high-growth pipeline Hangzhou accounts for 83% as new entrants and startups scale up HANGZHOU, China, April 24, 2026 /PRNewswire/ -- Zhejiang's roster of unicorn companies has expanded to 58 as of April 2026, highlighting the province's growing role as a hub ...
Arasan Announces immediate availability of its UFS 5.0 Host controller IP
Arasan announces the immediate availability of its UFS 5.0 Host Controller IP. The UFS 5.0 Host IP is already in use by Tester Companies for compliance and production testing. SAN JOSE, Calif., April 23, 2026 /PRNewswire/ -- Arasan extends its long history of support for JEDEC and MIPI standards...
MetaOptics achieves a progressive milestone in securing design/evaluation orders for its metalenses and modules from world-class customers
SINGAPORE, April 23, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") is pleased to announced that it has achieved a progressive milestone in securing design/evaluation orders of its metalenses and modules from w...
SK hynix Announces 1Q26 Financial Results
* Reports revenues of 52.5763 trillion won, operating profit of 37.6103 trillion won, net profit of 40.3459 trillion won * Record-high quarterly performance driven by increased sales of high value-added products from strong AI demand * By launching advanced products, the company will try to ...
GIGABYTE Collaborates with NVIDIA® on GeForce RTX™ 50 Series and PRAGMATA™ Bundle
TAIPEI, April 22, 2026 /PRNewswire/ -- GIGABYTE, the world's leading computer brand, announces the collaboration with NVIDIA for the PRAGMATA™ GeForce RTX 50 Series game bundle across eligible graphics cards, desktops, and laptops powered by NVIDIA GeForce RTX™ 5070 or above GPUs and Laptop GPUs....
Arasan acheives the Industrys First ASIL-D Certification for its CAN XL IP Core
Arasan announces the industry's first ASIL-D Certification for its CAN XL IP. The certification also covers Arasan's CAN FD IP and CAN 2.0 IP. SAN JOSE, Calif., Apr. 21, 2026 /PRNewswire/ -- Arasan Chip Systems, the industry's leading provider of IP for Mobile and Automobile SoC's, announced tod...
RoboSense Unveiled EOCENE SPAD-SoC Architecture and Chipsets Phoenix and Peacock: Ushering the LiDAR Industry into the Image-grade Era of High-Definition 3D Perception
* RoboSense debuted the EOCENE SPAD-SoC architecture, enabling rapid incubation of a diverse chipset portfolio while streamlining R&D workflows to deliver significant structural cost advantages. * RoboSense launched the Phoenix chipset, the industry's first automotive-grade monolithic SPAD-So...
DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Next-Generation Physical AI Compute Platform for Robotics
Collaboration targets DX-M2-based robotic AI infrastructure, expanding into VLA and VLM technologies for next-generation intelligent robots SEOUL, South Korea, April 21, 2026 /PRNewswire/ -- DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group...
Mitate Zepto Technica Joins JST's Next-generation Edge AI Semiconductor R&D Program as Social Implementation Partner
- MZT to Lead Product Commercialization through Its Genome-analysis Accelerator "RASEN" - TOKYO, April 20, 2026 /PRNewswire/ -- Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Gene...
SK hynix Begins Mass Production of 192GB SOCAMM2 'Setting a New Standard for AI Server Memory Performance'
- Mass production of 192GB high capacity products designed for the NVIDIA Vera Rubin platform - Maximizes power efficiency by featuring high density DRAM based on the latest 1cnm process - Company to closely collaborate with NVIDIA to solve bottlenecks in AI infrastructure and provide...
LG Innotek to Supply Cutting-Edge Automotive Wi-Fi 7 Communication Module to a leading European automotive parts company
* Order value of approximately USD 68M with mass production to begin in 2027 * Offering data transmission speed three times faster, with no speed degradation even with multiple devices connected simultaneously * Changing perception of car considered as 'a second living space'…Trend enhancing...
Efficiently Managing Hundreds of Billions of Quality Inspection Data: Dataram IDM Empowers PCB Enterprises to Build World-Class Quality Systems
TAIPEI, April 16, 2026 /PRNewswire/ -- As Smart Manufacturing becomes the core driver of industrial transformation, the electronic assembly industry—led by PCB (Printed Circuit Boards)—is undergoing a profound digital revolution. In high-precision production environments, the widespread adoption ...
Artilux Announces Inception™: A Hybrid Optoelectronic Architecture for the Next-Generation AI Computing
HSINCHU, April 15, 2026 /PRNewswire/ -- Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS proces...
Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
Through the collaboration, Silicon Box will work with industry leaders to advance automotive-grade chiplet devices with advanced packaging. SINGAPORE, April 15, 2026 /PRNewswire/ -- Silicon Box, an industry leader in advanced semiconductor packaging solutions, today announced that it has formall...
Tageos Launches World's First FlexIC-based RFID Product Lines Powered by Pragmatic Semiconductor Technology
Partnership delivers industry-leading sustainable innovation to unlock market opportunity for low-carbon NFC connectivity at scale. * The new Tageos 'EOS Lite' and 'EOS Zero® Lite' product lines are purpose-built solutions, minimizing carbon footprint through innovative antenna designs, ultra-...
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