Electronic Components
BC-Driven Breakthrough: TCL Solar's Value Leap from Wafer Leadership to Tier 1 Module Supplier
SHANGHAI, June 5, 2026 /PRNewswire/ -- Amid the PV industry's shift toward
high-quality sustainable growth showcased at SNEC 2026, BC pioneer TCL Solar
has transformed from a top global wafer producer into a Tier 1 module supplier.
Sungrow Expands Residential ESS Portfolio with Next-Gen Solution for Reliable Backup Power
HEFEI, China, June 5, 2026 /PRNewswire/ -- Sungrow, the globally leading PV
inverter and energy storage system provider, unveiled its next-generation
residential energy storage solution, expanding its power range from 5 kW to 12
kW with the introduction of the new MG12RL hybrid inverter.
SEMI Reports Global Semiconductor Equipment Billings Increased 14% Year-Over-Year in Q1 2026
Record Quarterly Equipment Billings Reflect Continued AI-Driven Investment
MILPITAS, Calif., June 5, 2026 /PRNewswire/ -- SEMI
Delta Thailand Showcases Integrated Building Automation Solutions for Smarter, Healthier and More Sustainable Spaces at NOVA Expo 2026
BANGKOK, June 4, 2026 /PRNewswire/ -- Delta Electronics (Thailand) Public
Company Limited
ViewSonic Showcases AI-Enabled Learning and Integrated Visual Solutions Expansion
TAIPEI, June 3, 2026 /PRNewswire/ -- ViewSonic Corp.
Quobly secures €115 million Series A to bring silicon-based quantum computers to market
GRENOBLE, France, June 3, 2026 /PRNewswire/ -- Quobly, a French quantum computing company, today announced the closing of a €115 million Series A financing to accelerate the industrialization of its silicon-based quantum computers and bring its first commercial product to market by the end of 202...
Reshaping PV Value: Sungrow Renewables Launches Smart Module in a Landmark Industry Debut
SHANGHAI, June 2, 2026 /PRNewswire/ -- On June 1, Sungrow Renewables held its 2026 Intelligent Technology Conference in Shanghai. Sungrow Renewables unveiled its new iBuilding BIPV 2.0 power plant solution and officially introduced the world's first self-developed high-efficiency smart PV module....
ASUS Unveils Revolutionary ProArt PCs Powered by NVIDIA RTX Spark at COMPUTEX 2026
* New ProArt AI PCs Powered by NVIDIA RTX Spark
ASUS introduces ProArt laptops
Supermicro Introduces DCBBS Blueprints for NVIDIA Vera Rubin NVL72 and NVIDIA HGX™ Rubin NVL8, Built to Scale from 5MW to 1GW as an End-to-End Total Solution
* End-to-End Blueprint Scalable from a 5MW to 1GW Power Envelope with full facility-side infrastructure for either single-tenant or multi-tenant deployments * DLC-2 Direct Liquid Cooling: engineered for near total heat capture, power efficiency, and lower noise with full stack integration of ...
JA Solar Leads the Post‑Cycle PV Market with Dual‑Technology Breakthroughs and Integrated Solutions
BEIJING, June 1, 2026 /PRNewswire/ -- JA Solar recently outlined its strategic
roadmap for the post‑cycle photovoltaic (PV) market, reaffirming its leadership
across TOPCon and BC technologies while advancing toward a fully integrated
energy‑solutions model.
Supermicro Launches New Server Solutions with Intel Xeon 6+ Processors to Reduce TCO and Accelerate Time-to-Online for Large-Scale Cloud and Data Centers
* 12 new systems across Hyper, SuperBlade®, FlexTwin™, and GrandTwin® families offer industry-leading core density with up to 576 efficiency cores per server * Breakthrough performance-per-watt and energy efficiency designed to lower TCO and reduce power consumption in high-density cloud and ...
Infineon Joins NVIDIA's MGX™ AI Factory Ecosystem to Transform Power Delivery Architecture for Next-Generation AI Server Racks
MUNICH, May 29, 2026 /PRNewswire/ -- Infineon Technologies (FSE: IFX) (OTCQX: IFNNY), a leading provider of power systems and IoT, has joined NVIDIA's MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon's power management solutions will support...
ABB report shows how a 0.2 percent motor efficiency gain could unlock billions for industry
* Report examines a decade of data for over 1,000 large motors and generators delivered globally by ABB's Västerås facility in Sweden * The specification gap between standard and Top Industrial Efficiency (TIE) option could be costing global operators up to $12 billion over a 25-year asset li...
Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution
Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution including support for AP Memory's Xccela™ PSRAM and the latest LVpSRAM™ SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- Arasan Chip Systems, a leading provider of IP for mobile and automobile SoC's, is ...
Powermat Technologies and Anker Innovations Announce Patent License Agreement and Strategic Collaboration
TEL AVIV, Israel and SHENZHEN, China, May 28, 2026 /PRNewswire/ -- Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker Innovations Co., Ltd., a world leader in consumer electronics, today announced a patent license ...
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors
Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI
and HPC Accelerate Demand for Advanced Packaging Technologies
MILPITAS, Calif., May 27, 2026 /PRNewswire/ -- SEMI
Bulletin from the Extraordinary General Meeting of AB Electrolux
The Extraordinary General Meeting of AB Electrolux was held in Stockholm on May 27, 2026 STOCKHOLM, May 27, 2026 /PRNewswire/ -- Amendment of the Articles of Association The General Meeting resolved, in accordance with the Board's proposal, to adjust the limits for the minimum and maximum shar...
Apacer Showcases Edge AI Storage Power at COMPUTEX 2026
TAIPEI, May 27, 2026 /PRNewswire/ -- As Edge AI applications rapidly transition from proof-of-concept to real-world deployment, the growing demands for high bandwidth, thermal efficiency, and sustained computing performance are driving increasing demand for reliable industrial-grade storage solut...
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026
~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging i...
ISDN's IDI Dynamics debuts high-speed laser marker for semiconductor assembly and test (OSAT)
New High-speed Laser Marker delivers 2.5x higher chip throughput (units per
hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly &
Test (OSAT)manufacturers drive productivity of valuable production floor space
SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics
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