Computer Hardware
Play Without Limits, Create Without Compromise: Philips Evnia 34M2C8600PC Redefines the Gaming & Creator Workspace with Ultrawide QD-OLED Penta Tandem
SINGAPORE, Sept. 10, 2026 /PRNewswire/ -- Philips Evnia announced the launch of the 34M2C8600PC, a flagship 34-inch curved display engineered to eliminate the compromise between tournament-level gaming speed and color critical creative precision. Built on cutting-edge QD-OLED Penta Tandem technol...
DIMAAG and Toshiba Collaborate on SCiB™ - Based Energy Storage for the ZettaWatt™ Power Platform for AI Data Centers
FREMONT, Calif. and HOUSTON, Sept. 10, 2026 /PRNewswire/ -- DIMAAG-AI, Inc. (DIMAAG) and Toshiba International Corporation (TIC), a Toshiba America Inc. (TAI) Group Company and a wholly owned subsidiary of Toshiba Corporation (Toshiba), today announced a collaboration to develop next-generation e...
SuperX Announces an Update on the Progress of Share Repurchases Program, to Demonstrate Confidence in Long-Term Growth Value
SINGAPORE, Sept. 9, 2026 /PRNewswire/ -- SuperX AI Technology Limited (NASDAQ: SUPX) ("SuperX" or the "Company"), a Nasdaq-listed full-stack AI infrastructure solutions provider, today announced an update on the progress of its share repurchase program, demonstrating the Board's and management's ...
LattePanda Launches the LattePanda Mu Ultra: A Micro x86 Compute Module for On-Device AI
SHANGHAI, Sept. 9, 2026 /PRNewswire/ -- LattePanda Team
DFI Introduces One Board, Two CPU Generations Mini-ITX Platform to Advance Physical AI for Robotics and Automation
TAIPEI, Sept. 9, 2026 /PRNewswire/ -- DFI, a Qisda Group company and a global
leader in embedded motherboards and industrial computers, introduces the
ARH171/ARH173
Democratizing Aerospace-Grade Manufacturing: FibreSeek Opens Global Pre-Sale for FibreSeeker 3
Following a $4.7M Kickstarter Campaign, the 3D printing company FibreSeek Releases Limited 500-Unit Pre-Sale with Exclusive Early Bird Offers for Australia and the US market SYDNEY, Sept. 9, 2026 /PRNewswire/ -- Following a record-shattering Kickstarter campaign that raised nearly $4.7 million f...
DB HiTek Completes Reliability Qualification for 8-Inch 1,200 V SiC MOSFET Process
* Establishes World's First Complete 8-Inch SiC Foundry Process Flow * Provides First- and Second-Generation PDKs to Customers, with Third-Generation PDK Scheduled for November; Expected to Shorten Product Development Time by More Than One Year SEOUL, South Korea, Sept. 9, 2026 /PRNewswire/ -...
Quantinuum Finalizes $100 Million CHIPS R&D Award with U.S. Department of Commerce to Advance Trapped-Ion Quantum Computer Manufacturing in the US
* The federal funding supports critical R&D and U.S. quantum semiconductor manufacturing capabilities needed to scale fault-tolerant trapped-ion quantum computing. * Company partnering with GlobalFoundries to fabricate next-gen ion traps and control electronics, and Monarch Quantum to develop...
Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection
HSINCHU, Sept. 8, 2026 /PRNewswire/ -- Spirox (TWSE: 3055), today hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications. Spirox also ...
Karrie International's First Batch Vera Rubin Deliveries and Rising ASIC Server Volume Drive Expected Q4 Revenue Record
HONG KONG, Sept. 8, 2026 /PRNewswire/ -- Global leading server mechanical engineering solutions provider – Karrie International Holdings Limited ("Karrie International" or the "Company", together with its subsidiaries, the "Group"; stock code: 1050.HK) announced that the first batch of NVIDIA Ver...
SKF advances Insight bearing technology through collaboration with Sentea
SKF Core, a new integrated hardware platform, simplifies deployment of SKF Insight bearings, powered by fiber-optic sensing technology, and expands bearing intelligence applications. This, and other SKF solutions, will be showcased at AMB 2026 in Stuttgart. GOTHENBURG, Sweden, Sept. 8, 2026 /PRN...
Fujitsu develops diamond-spin quantum computer prototype
New diamond-spin quantum computer prototype incorporating tin-vacancy (SnV) centers into photonic integrated circuits marks significant step toward quantum computing scalability KAWASAKI, Japan, Sept. 8, 2026 /PRNewswire/ -- Fujitsu today announced that it has developed the world's first working...
Orbbec Showcases Advanced Robotic Perception and Data Collection Solutions at Logis-Tech Tokyo 2026
TOKYO, Sept. 8, 2026 /PRNewswire/ -- Orbbec, a leading provider of robotics and
AI vision, is showcasing its latest robotic perception and data collection
solutions atLogis-Tech Tokyo 2026, addressing practical challenges in
logistics, warehousing and industrial automation.
Infinix Globally Launches XPAD 30 Pro: The Ultimate All-Round Companion for Youth Learning and Entertainment
HONG KONG, Sept. 8, 2026 /PRNewswire/ -- Today, Infinix officially launched the XPAD 30 Pro, an all-round smart tablet engineered for university students and young professionals. The XPAD 30 Pro series meets Gen Z's needs for efficient learning, mobile productivity, and immersive entertainment. I...
USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing
NANTOU, Sept. 8, 2026 /PRNewswire/ -- USI today announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, an...
GEEKOM Launches A5 2027 Edition Mini PC, Built for Productivity That Lasts
TAIPEI, Sept. 7, 2026 /PRNewswire/ -- GEEKOM
Another Versatile Android Tablet Alternative: Huion Kamvas Pad 12 Unveiled
LOS ANGELES, Sept. 7, 2026 /PRNewswire/ -- Today, Huion officially announced its new Android tablet, the Kamvas Pad 12, one year following the launch of its Kamvas Slate tablet series. As an industry-leading manufacturer and innovator, Huion has expanded its product lineup to adapt to today's com...
TCL Showcases AI Inspired Life at IFA 2026 Through Its Screen Universe
From next-generation displays and AI-powered smart home experiences to sports-inspired moments, TCL presents an immersive vision of everyday life in the AI era. BERLIN, Sept. 5, 2026 /PRNewswire/ -- TCL unveiled its vision for an AI Inspired Life at IFA 2026 through the "Inspiration Habitat," an...
SCANOLOGY Sets New Benchmarks in Large-Scale and Portable 3D Measurement with TrackScan Sharp-Z and TrackScan GO
HANGZHOU, China, Sept. 4, 2026 /PRNewswire/ -- SCANOLOGY, a global provider of
3D scanning and inspection solutions, has introducedTrackScan Sharp-Z
Lexar Unveils Muse, the World's Thinnest Portable SSD, at IFA 2026
Lexar marks its 30th anniversary by introducing the world's thinnest portable SSDand showcases their line-up of next generation AI storage technologies at IFA 2026 BERLIN, Sept. 4, 2026 /PRNewswire/ -- Lexar, a global leader in memory and storage solutions, today unveiled its latest storage inno...
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