Computer Hardware
TeamGRIT Accelerates Japan Expansion Through Joint Venture to Build Next-Generation Robotics Infrastructure
TOKYO, Dec. 19, 2025 /PRNewswire/ -- TeamGRIT, a Korea-based robotics software company specializing in ultra-low-latency communication and integrated robot operations, is strengthening its presence inJapan through a joint venture–driven expansion strategy, aiming to enable practical autonomy for ...
Trina Storage Completes 5MWh LSFT at Maximum Severity -- Surpassing the Industry's Highest Safety Standards
CHANGZHOU, China, Dec. 18, 2025 /PRNewswire/ -- Recently, Trina Storage has successfully completed a full-container 5MWh Large-Scale Fire Test (LSFT) of its self-developed Elementa 2 Pro system under extreme conditions, achieving zero thermal propagation, full structural integrity, and validated ...
Ricoh recognised as a Top 5 global AV Integrator in SCN Top 50 Systems Integrators 2025
Third consecutive year in the global Top 5 TOKYO, Dec. 18, 2025 /PRNewswire/ -- Ricoh has been recognised as one of the world's leading audiovisual (AV) integrators by US publication, Systems Contractor News (SCN), ranking fourth in the SCN Top 50 Systems Integrators 2025 list. This marks the th...
FutureMain to Revolutionize Industrial Maintenance with Vertical AI Solution 'ExRBM' at CES 2026
LAS VEGAS and SEOUL, South Korea, Dec. 18, 2025 /PRNewswire/ -- FutureMain
USI Invests in Optical Transceiver Manufacturing Capacity and Launches the Expansion Plan for the Second Plant in Vietnam
SHANGHAI, Dec. 17, 2025 /PRNewswire/ -- Global investment in computing infrastructure is accelerating, driving technology upgrades and service innovation across the artificial intelligence industry and its supply chain. Since the beginning of the year, USI has actively expanded its data center b...
LG Innotek Showcases 'Future Car Innovation Solutions' Ushering in the AIDV Era at CES 2026
* Autonomous driving concept car and two EV mockups equipped with 35 core components * Showcasing of AI software‑based smart and safe mobility functions through 'integrated convergence solutions' SEOUL, South Korea, Dec. 16, 2025 /PRNewswire/ -- OnDecember 16, LG Innotek (CEO Moon Hyuksoo) an...
Avnet and AMD Showcase Scalable AI Solutions to Accelerate Australia's Tech Leadership
SYDNEY, Dec. 15, 2025 /PRNewswire/ -- Avnet and AMD have wrapped up the inaugural 'AMD on Wheels' national roadshow, bringing cutting-edge AI and high-performance computing solutions to innovation hubs acrossAustralia. The initiative reaffirmed the partners as definitive industry leaders by demo...
Anker Celebrates the Year-End in Malaysia on Next-Gen Charging, Audio, and Smart Home Innovations
Anker rolls out its most exciting lineup yet this year-end promotion, featuring special offers across its latest Nano Series chargers, soundcore audio innovations, and eufy smart home devices KUALA LUMPUR, Malaysia, Dec. 12, 2025 /PRNewswire/ -- As the year-end shopping season begins, Anker Inno...
Anker Celebrates the Year-End in Singapore on Next-Gen Charging, Audio, and Smart Home Innovations
Anker rolls out its most exciting lineup yet this year-end promotion, featuring special offers across its latest Nano Series chargers, soundcore audio innovations, and eufy smart home devices SINGAPORE, Dec. 12, 2025 /PRNewswire/ -- As the year-end shopping season begins, Anker Innovations energ...
Plume Joins Connectivity Standard Alliance as Participant Member To Help Shape the Future of Connected Experiences and Services in the Home
PALO ALTO, Calif., Dec. 10, 2025 /PRNewswire/ -- Plume
Supermicro Expands NVIDIA Blackwell Portfolio with New 4U and 2-OU (OCP) Liquid-Cooled NVIDIA HGX B300 Solutions Ready for High-Volume Shipment
* Introducing 4U and 2-OU (OCP) liquid-cooled NVIDIA HGX B300 systems for high-density hyperscale and AI factory deployments, supported by Supermicro Data Center Building Block Solutions® with DLC-2 and DLC technology, respectively * 4U liquid-cooled NVIDIA HGX B300 systems designed for stand...
USI Integrates Vacuum Printing Encapsulation and Copper Pillar Transfer Technology to Advance System-Level Packaging Applications
SHANGHAI, Dec. 10, 2025 /PRNewswire/ -- USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer technology, the company said. After three years of development, the process is now being used in capsule ...
Axcelis to Showcase Advanced Ion Implant Solutions at SEMICON Japan 2025
BEVERLY, Mass., Dec. 10, 2025 /PRNewswire/ -- Axcelis Technologies
DEEPX Launches DX-H1 V-NPU: The 30W Single-Card Solution That Challenges GPU Dominance
Recently recognized with a CES 2026 Innovation Award, the solution combines video decoding, AI inference, and encoding on a single chip, offering 80% hardware cost savings compared to GPU architectures. LAS VEGAS and SEOUL, South Korea, Dec. 9, 2025 /PRNewswire/ -- Ahead of CES 2026, DEEPX, a pi...
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
TAIPEI, Dec. 9, 2025 /PRNewswire/ -- Data Center AI Chip Shipments Continue to Grow According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip catego...
DEEPX- Announces Ultra-Efficient AI Video Analytics Solution Based on AmpereOne® Platform
A New Architecture That Outperforms Traditional CPU + GPU Systems by a Wide Margin SANTA CLARA, Calif. and SEOUL, South Korea, Dec. 8, 2025 /PRNewswire/ -- DEEPX, a leader in ultra-low-power on-device AI semiconductors, announced on the 8th the launch of a next-generation AI video analytics plat...
Goodix Powers Samsung's Galaxy Z TriFold with Advanced Foldable Touch and Fingerprint Solutions
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- Goodix Technology today announced that its industry‑leading main & sub touchscreen controller and ultra‑narrow side‑key capacitive fingerprint solution are featured in Samsung's first multi-folding phone, Galaxy Z TriFold. Leveraging Goodix's advanced...
ASUS IoT and CTHINGS.CO Forge Partnership to Accelerate Scalable Edge AI and IoT Solutions
Smart connectivity made simple with scalable edge AI and 5G-ready IoT solutions KEY POINTS * Unified edge intelligence: ASUS IoT gateways and CTHINGS.CO Orchestra enable faster, more secure, and easily managed IoT deployment * Smarter operations: Real-time analytics and automation deliver pre...
Orbbec and Advantech Showcase NVIDIA Accelerated Physical AI Platform for Next-Generation Robotics at iREX 2025
TOKYO, Dec. 3, 2025 /PRNewswire/ -- Orbbec
Chinese Robotics Company PaXini Shines at iREX 2025, Demonstrating Top-Tier Global Embodied Intelligence Strength
TOKYO, Dec. 4, 2025 /PRNewswire/ -- The International Robot Exhibition (iREX
2025), a leading global robotics event running fromDecember 3rd to 6th in
Tokyo, Japan. PaXini Tech
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