Semiconductors
ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability
MUNICH, May 29, 2024 /PRNewswire/ -- ERS electronic
DIGITIMES Asia: Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers
Jessica Tsai, Taipei; Jack Wu, DIGITIMES Asia Wednesday 29 May 2024
TAIPEI, May 29, 2024 /PRNewswire/ -- According to the news report from the
technology-focused media DIGITIMES Asia
Computex '24: Join Us to Unlock Infinite Possibilities in AI
Etron Tech Showcases MemorAiLink Platform: Revolutionizing Heterogeneous Integration in Semiconductor Development Now with Customer Products Entering Mass Production LAS VEGAS and TAIPEI, May 28, 2024 /PRNewswire/ -- As Artificial Intelligence (AI) continues to thrive, the global tech industry i...
SEMIFIVE Signs MOU with Atron Technologies to Collaborate on Semiconductor Design
Expected to expand global business in the Chinese market SEOUL, South Korea, May 23, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced its agreement of MOU withChina-based Atron Technologies, on May 23, 2024. T...
Computex 2024: DeCloak Intelligences Showcases DeCloakVision Multi-Modal AI Privacy-Enhanced Monitoring System Offering the Optimal Balance between Public Safety & Personal Privacy
LAS VEGAS and TAIPEI, May 23, 2024 /PRNewswire/ -- DeCloak Intelligences, a subsidiary of Etron Technology (TPEx: 5351), has won the CES Innovation Award for two consecutive years and its privacy system has also been recognized with the Excellent Manufacturer Innovation Product Award inTaiwan. De...
S2C and Sirius Wireless Collaborate on Wi-Fi 7 RF IP Verification System
SAN JOSE, Calif., May 21, 2024 /PRNewswire/ -- Sirius Wireless partnered with FPGA prototyping expert S2C to develop the Wi-Fi 7 RF IP Verification System, enhancing working efficiency and accelerating time-to-market for clients. Wi-Fi 7 is the latest Wi-Fi technology, with speeds of up to 30Gbp...
Compact Solutions, Mighty Results: Cervoz Unleashes the Power of Edge Computing
TAIPEI, May 20, 2024 /PRNewswire/ -- Cervoz Technology, a leader in
industrial-grade storage, memory, and expansion solutions, is powering the
evolution of edge computing with its innovative solutions.
E&R Engineering Corp. Unveils Cutting-Edge Solutions at Semicon SEA 2024 in Kuala Lumpur
KAOHSIUNG, May 19, 2024 /PRNewswire/ -- The advanced laser and plasma solution provider from Taiwan, E&R Engineering Corp., is confirmed to attend the feast in Semiconductor industry, Semicon SEA 2024, held inKuala Lumpur, Malaysia. With the 30-year dedication in the semiconductor industry, E&R h...
MetisX, a fabless startup in South Korea, raises $44M in Series A funding
SEOUL, South Korea, May 13, 2024 /PRNewswire/ -- MetisX, a fabless startup based inSouth Korea, has recently secured $44 million in Series A funding, bringing its total funding to over$50 million. The company, established in 2022, focuses on developing intelligent memory solutions using Compute E...
SK hynix Develops Next-Generation Mobile NAND Solution ZUFS 4.0
* Mass production of industry's best-performing product for on-device AI smartphones to begin in 3Q * Performance degradation over time improved, while lifetime increased by 40% * SK hynix to expand leadership in AI memory space with strong presence in NAND solutions following success of HBM...
Mr. Kong, Nano Labs' Chairman and CEO, Increased His Shareholding in the Company
HANGZHOU, China , May 7, 2024 /PRNewswire/ -- Nano Labs Ltd (Nasdaq: NA) ("we," the "Company" or "Nano Labs"), a leading fabless integrated circuit design company and product solution provider inChina, announced today that Mr. Jianping Kong, the Company's chairman and chief executive officer, inf...
Revolutionizing Communication: ChatGPT-Powered Translator Earbuds A8 with Screen to Debut on Kickstarter
SHENZHEN, China, May 1, 2024 /PRNewswire/ -- Wooask announces the launch of
TransBuds A8 onKickstarter
Tungray Technologies Inc Announces Partial Exercise of Underwriter's Over-Allotment Option
SINGAPORE, April 30, 2024 /PRNewswire/ -- Tungray Technologies Inc (the "Company" or "Tungray") (NasdaqCM: TRSG), a provider of customized industrial manufacturing solutions to Original Equipment Manufacturers (OEMs) in the semiconductors, printers, electronics, and home appliances industries, to...
SK hynix Announces 1Q24 Financial Results
* Revenues at 12.43 trillion won, operating profit at 2.886 trillion won, net profit at1.917 trillion won * 1Q revenues all-time high, operating profit 2nd highest for 1Q result * NAND turns around on rise in eSSD sales, product prices * To continue to work towards improving earnings with l...
SEMIFIVE Collaborates with MetisX in Developing CXL-based Memory Accelerator Chip
- Collaboration on prototype design and mass product development with Samsung Foundry's 4nm process technology SEOUL, South Korea, April 24, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced a collaboration wit...
Tungray Technologies Inc Announces Closing of Initial Public Offering
SINGAPORE, April 23, 2024 /PRNewswire/ -- Tungray Technologies Inc (the "Company" or "Tungray") (NasdaqCM: TRSG), a provider of customized industrial manufacturing solutions to Original Equipment Manufacturers (OEMs) in the semiconductors, printers, electronics, and home appliances industries, to...
DEEPX Expands First-Generation AI Chips into Intelligent Security and Video Analytics Markets
Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024. LAS VEGAS and SEOUL, South Korea, April 19, 2024 /PRNewswire...
SK hynix Partners with TSMC to Strengthen HBM Technological Leadership
* SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technology * SK hynix will adopt TSMC's cutting-edge foundry process to advance HBM4 performance * Product Design-Foundry-Memory trilateral collaboration to break memory performance limits for AI a...
Tungray Technologies Inc Announces Pricing of Initial Public Offering
SINGAPORE, April 18, 2024 /PRNewswire/ -- Tungray Technologies Inc ("Tungray" or the "Company" or "Tungray") (NasdaqCM: TRSG), a provider of customized industrial manufacturing solutions to Original Equipment Manufacturers (OEMs) in the semiconductors, printers, electronics, and home appliances i...
M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
HSINCHU, April 18, 2024 /PRNewswire/ -- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that its 5nm advanced process IP solution for high-speed interface IPs such as MIPI C/D-PHY, and memory interface ONFI v5.1 I/O, have completed sili...
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