Semiconductors
M31 Once Again Ranked Among Forbes' "Asia 200 Best Under a Billion" List
HSINCHU, Oct. 23, 2024 /PRNewswire/ -- M31 Technology Corporation (M31), a leading global developer of silicon intellectual property (IP), has once again been recognized by the prestigious financial magazineForbes Asia. M31 has been ranked in the "2024 Forbes Asia Best Under a Billion" list, high...
2024-10-23 17:23
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NOVOSENSE's High-Performance Sensor Solutions for Automotive Safety and Efficiency
SHANGHAI, Oct. 23, 2024 /PRNewswire/ -- As automobile safety and comfort standards rise, the demand for high-performance sensors is surging. NOVOSENSE Microelectronics, a global supplier of automotive chips, offers an extensive portfolio of automotive-grade sensor products, ranging from current s...
2024-10-23 15:26
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ChipMOS SCHEDULES THIRD QUARTER 2024 FINANCIAL RESULTS CONFERENCE CALL
HSINCHU, Oct. 17, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-10-17 18:00
4468
SurplusGLOBAL Accelerates Innovation in Semiconductor Equipment and Parts Ecosystem with AI... Appoints Dr. Benjamin Jeong as Chief AI Officer
SEOUL, South Korea, Oct. 14, 2024 /PRNewswire/ -- SurplusGLOBAL, a platform company specializing in semiconductor equipment and parts, is accelerating innovation in the semiconductor distribution industry by incorporating artificial intelligence (AI) technology. Aiming to expand its AI-driven bu...
2024-10-14 19:00
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21st TAITA Annual Conference Explores Taiwan's AI Era Strategies in the Global Tech Supply Chain
TAIPEI, Oct. 13, 2024 /PRNewswire/ -- The upcoming 21st TAITA-SV Annual Conference, scheduled forSaturday, October 19, 2024, at the Hyatt Regency Hotel inSanta Clara, California, will focus on the theme "Taiwan's Strategic Layout in the AI Era." The conference will explore howTaiwan leverages its...
2024-10-14 10:32
2485
The GMIF2024 Annual Awards Revealed: Micron, Silicon Motion, Western Digital, and More Companies Make the List
SHENZHEN, China, Oct. 12, 2024 /PRNewswire/ -- On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) was successfully concluded in Renaissance Shenzhen Bay Hotel. The event was hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Associ...
2024-10-12 17:32
5479
SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel
Collaboration on design and development using 4nm process technology, with mass production targeted for Q1 2026 SEOUL, South Korea, Oct. 10, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the conclusion of a...
2024-10-11 06:00
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ChipMOS REPORTS 8.7% YoY INCREASE IN 3Q24 REVENUE AND 1.2% YoY DECREASE IN SEPTEMBER 2024 REVENUE
HSINCHU, Oct. 9, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150
2024-10-09 18:00
4242
Rise of cloud and edge AI applications paves way for new semiconductor opportunities; wafer foundries become crucial, says DIGITIMES Research
TAIPEI, Oct. 7, 2024 /PRNewswire/ -- With the rapid development of the global
generative AI market, the semiconductor industry is undergoing unprecedented
transformation. DIGITIMES Research released thelatest AI Chips Special Report
2024-10-08 09:19
2163
LG Innotek Becomes Industry's First to Use AI to Prevent Input of Defective Raw Materials in Production
* Achieved early detection of cause of defects in raw materials through AI, becoming "first to overcome this challenge in the industry" * Applied to high-value semiconductor substrates, analyzing raw material defects in only one minute * Reduces defect analysis time by up to 90% SEOUL, South...
2024-10-07 20:00
2788
Hesai and SAIC Volkswagen Sign New Partnership on Automotive Lidar Program
SHANGHAI, Oct. 1, 2024 /PRNewswire/ -- Hesai Technology (Nasdaq: HSAI), the global leader in lidar technology, announced today the signing of a cooperation framework with SAIC Volkswagen. The cooperation will establish a strong foundation for Hesai and SAIC Volkswagen to build a new ecosystem fo...
2024-10-01 20:30
2632
ITECH Showcases Innovative High Power Density Power Supplies at The Battery Show North America
DETROIT, Sept. 30, 2024 /PRNewswire/ -- ITECH Electronics, a trusted global symbol of innovation in power electronics testing instruments and solutions, ready to present its latest power testing instruments atThe Battery Show North America, Oct.7-10, inDetroit. The company will show cutting-edge...
2024-09-30 22:00
1825
Embracing the AI Era for a Win-Win Future of Memory Industry: The GMIF2024 Innovation Summit Successfully Held in Shenzhen
SHENZHEN, China, Sept. 30, 2024 /PRNewswire/ -- In the golden glow of autumn, Shenzhen brings all together to convene a grand celebration. On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) has been successfully concluded in Shenzhen. The event was hosted by the...
2024-09-30 21:28
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M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
Redefining High-Speed Data Storage HSINCHU, Sept. 26, 2024 /PRNewswire/ -- M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), today announced that its cutting-edge ONFi5.1 I/O IP achieved silicon validation on the TSMC 5nm (N5) process. The two annou...
2024-09-26 15:30
2885
New Short Film Takes Behind-the-scenes Look at Next-generation GaN Power Semiconductor Device Development
KYOTO, Japan, Sept. 26, 2024 /PRNewswire/ -- - Making GaN Easy to Use: Engineering Challenges from R&D to Practical Application - ROHM Co., Ltd. has released the sixth German-language installment in the "Stories of Manufacturing" series of short films, this time taking viewers behind the scene...
2024-09-26 15:00
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SK hynix Begins Volume Production of the World's First 12-Layer HBM3E
* The company plans to supply the highest-performing, highest-capacity 12-layer HBM3E to customers by the end of the year * DRAM chips made 40% thinner to increase capacity by 50% at the same thickness as the previous 8-layer product * The company to continue HBM's success with outstanding p...
2024-09-26 08:00
2623
SK hynix Applies CXL Optimization Solution to Linux
* HMSDK, a proprietary memory control solution lauded for its performance, is now available on Linux, the world's largest open source operating system * HMSDK optimizes performance between heterogeneous memories, increasing bandwidth by 30% and performance by over 12% * The company will fost...
2024-09-23 08:00
2475
Discover the Star-Studded Lineup for GMIF2024 Innovation Summit in Shenzhen on September 27
SHENZHEN, China, Sept. 19, 2024 /PRNewswire/ -- On September 27, 2024, the " Third GMIF2024 Innovation Summit (Global Memory Innovation Forum)" will be held at the Renaissance Shenzhen Bay Hotel. The event is hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Associat...
2024-09-19 15:51
2479
MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit
SAN JOSE, Calif., Sept. 14, 2024 /PRNewswire/ -- From September 10-12, 2024, MSquare Technology made a standout appearance at the highly anticipated AI Hardware & Edge AI Summit in San Jose. With 1,500+ attendees and 75+ stellar speakers from the industry leaders, the summit provided MSquare, a l...
2024-09-14 12:46
2994
SK hynix Develops PEB110 E1.S for Data Centers
* New SSD delivers 2x performance, over 30% greater power efficiency than previous generation by applying 5th-generation PCIe * Mass production to begin in Q2 next year following customer qualification * SK hynix to enhance data center SSD portfolio to meet diverse customer needs * Company t...
2024-09-11 08:00
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