Semiconductors
GIGABYTE Collaborates with NVIDIA® on GeForce RTX™ 50 Series and PRAGMATA™ Bundle
TAIPEI, April 22, 2026 /PRNewswire/ -- GIGABYTE, the world's leading computer brand, announces the collaboration with NVIDIA for the PRAGMATA™ GeForce RTX 50 Series game bundle across eligible graphics cards, desktops, and laptops powered by NVIDIA GeForce RTX™ 5070 or above GPUs and Laptop GPUs....
Arasan acheives the Industrys First ASIL-D Certification for its CAN XL IP Core
Arasan announces the industry's first ASIL-D Certification for its CAN XL IP. The certification also covers Arasan's CAN FD IP and CAN 2.0 IP. SAN JOSE, Calif., Apr. 21, 2026 /PRNewswire/ -- Arasan Chip Systems, the industry's leading provider of IP for Mobile and Automobile SoC's, announced tod...
RoboSense Unveiled EOCENE SPAD-SoC Architecture and Chipsets Phoenix and Peacock: Ushering the LiDAR Industry into the Image-grade Era of High-Definition 3D Perception
* RoboSense debuted the EOCENE SPAD-SoC architecture, enabling rapid incubation of a diverse chipset portfolio while streamlining R&D workflows to deliver significant structural cost advantages. * RoboSense launched the Phoenix chipset, the industry's first automotive-grade monolithic SPAD-So...
DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Next-Generation Physical AI Compute Platform for Robotics
Collaboration targets DX-M2-based robotic AI infrastructure, expanding into VLA and VLM technologies for next-generation intelligent robots SEOUL, South Korea, April 21, 2026 /PRNewswire/ -- DEEPX (CEO Lokwon Kim), a pioneer in ultra-low-power AI semiconductor technology, and Hyundai Motor Group...
Mitate Zepto Technica Joins JST's Next-generation Edge AI Semiconductor R&D Program as Social Implementation Partner
- MZT to Lead Product Commercialization through Its Genome-analysis Accelerator "RASEN" - TOKYO, April 20, 2026 /PRNewswire/ -- Mitate Zepto Technica, Inc. (hereinafter "MZT"), based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Gene...
SK hynix Begins Mass Production of 192GB SOCAMM2 'Setting a New Standard for AI Server Memory Performance'
- Mass production of 192GB high capacity products designed for the NVIDIA Vera Rubin platform - Maximizes power efficiency by featuring high density DRAM based on the latest 1cnm process - Company to closely collaborate with NVIDIA to solve bottlenecks in AI infrastructure and provide...
LG Innotek to Supply Cutting-Edge Automotive Wi-Fi 7 Communication Module to a leading European automotive parts company
* Order value of approximately USD 68M with mass production to begin in 2027 * Offering data transmission speed three times faster, with no speed degradation even with multiple devices connected simultaneously * Changing perception of car considered as 'a second living space'…Trend enhancing...
Efficiently Managing Hundreds of Billions of Quality Inspection Data: Dataram IDM Empowers PCB Enterprises to Build World-Class Quality Systems
TAIPEI, April 16, 2026 /PRNewswire/ -- As Smart Manufacturing becomes the core driver of industrial transformation, the electronic assembly industry—led by PCB (Printed Circuit Boards)—is undergoing a profound digital revolution. In high-precision production environments, the widespread adoption ...
Artilux Announces Inception™: A Hybrid Optoelectronic Architecture for the Next-Generation AI Computing
HSINCHU, April 15, 2026 /PRNewswire/ -- Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS proces...
Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
Through the collaboration, Silicon Box will work with industry leaders to advance automotive-grade chiplet devices with advanced packaging. SINGAPORE, April 15, 2026 /PRNewswire/ -- Silicon Box, an industry leader in advanced semiconductor packaging solutions, today announced that it has formall...
Tageos Launches World's First FlexIC-based RFID Product Lines Powered by Pragmatic Semiconductor Technology
Partnership delivers industry-leading sustainable innovation to unlock market opportunity for low-carbon NFC connectivity at scale. * The new Tageos 'EOS Lite' and 'EOS Zero® Lite' product lines are purpose-built solutions, minimizing carbon footprint through innovative antenna designs, ultra-...
Nuvoton Releases Industry-leading-class High-power Violet Laser Diode (402 nm, 4.5 W) -- 1.5 times Higher Output Than Its Conventional Product
KYOTO, Japan, April 15, 2026 /PRNewswire/ -- Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced on April 15 that it will start mass production of a "high-power violet laser diode (402 nm, 4.5 W)" that achieves industry-leading-class (*1) optical output in a 9.0 mm diameter CAN pa...
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
Americas and APAC Region Reported Double-Digit Year-over-Year Revenue Increase MILPITAS, Calif., April 13, 2026 /PRNewswire/ -- Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quar...
Supermicro Introduces Compact, Energy-Efficient Systems to Accelerate Adoption of Intelligent Edge AI
* Purpose-built edge AI systems support real-time inferencing and business-critical workloads across retail, manufacturing, healthcare, and enterprise environments * Flexible configurations deliver data center-class performance in space- and power-constrained edge deployments * Advanced sec...
HKEX Advances Index Ecosystem with Two Tech-Focused Benchmarks
* HKEX launches the HKEX KRX Semiconductor Index and the HKEX Tech & US Tech 100 Index * These mark the latest development in HKEX's index strategy, expanding its proprietary and co‑branded benchmark offerings * HKEX enters licensing agreements with 5 issuers to develop ETFs in Hong Kong tr...
Breaking the Bottleneck in Medical Imaging Core Components: VITAL MedTech Unveils Its Vertical Integration Solution from Materials to Medical Systems at CMEF 2026
SHANGHAI, April 13, 2026 /PRNewswire/ -- At CMEF 2026, VITAL MedTech, the
healthcare unit of VITAL MATERIALS, unveiled a full range of innovations based
on its semiconductor core technologies. It demonstrated its full vertical
integration across core materials, chips, and medical systems.
DEEPX Showcases Physical AI Ecosystem with Partners at Japan IT Week 2026, Spearheading Korea-Japan AI Cooperation
TOKYO, April 13, 2026 /PRNewswire/ -- DEEPX, a leading physical AI semiconductor company led by CEO Lokwon Kim, successfully participated in Japan IT Week 2026 at Tokyo Big Sight. Collaborating with key local partners, DEEPX showcased its mass-produced DX-M1 chip, accelerating its strategic expan...
JCET Releases 2025 Annual Report, Posts Record-High Full-Year Revenue and Higher Profit Before Tax
SHANGHAI, April 9, 2026 /PRNewswire/ -- Today, JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, released its 2025 Annual Report. JCET reported record full-year revenue of RMB 38.87 billion in 2025, up 8.1% year-on-year....
JCET Releases 2025 Annual Report, Posts Record-High Full-Year Revenue and Higher Profit Before Tax
SHANGHAI, April 9, 2026 /PRNewswire/ -- Today, JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, released its 2025 Annual Report. JCET reported record full-year revenue of RMB 38.87 billion in 2025, up 8.1% year-on-year....
Cyient Semiconductor Announces Successful Close of Majority Investment in Kinetic Technologies
Enabling end-to-end custom power semiconductor innovation from India for global markets with an $85M investment SAN JOSE, Calif. and HYDERABAD, India, April 8, 2026 /PRNewswire/ -- Cyient Semiconductors today announced the successful close of its USD $85 million majority‑stake investment in Kine...
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