Semiconductors
ROHM's New High Anti-surge Chip Resistors in "SDR01 Series" Achieve 0.33W Rated Power in 0402 Size
KYOTO, Japan, Sept. 11, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the "SDR01 Series" of high anti-surge chip resistors, achieving a high rated power of 0.33W in the 0402 (1005 Metric) size. Designed for electronic equipment where mounting densities continue to increase, the series is well...
2026-09-11 15:00
1659
Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
Arasan Chip Systems, announces its participation at the MIPI I3C® Interop Session in Taipei with its I3C® Host IP, I3C® Dual IP and I3C® Device IP on Oct 19-20, 2026 SAN JOSE, Calif., Sept. 10, 2026 /PRNewswire/ -- Arasan Chip Systems announces its participation in the I3C® Interoperability Sess...
2026-09-10 23:10
2605
MICROIP Secures Major US$20 Million Smart Residential Community Contract in Taiwan, Accelerating Edge AI Commercialization
Deploying Next-Generation Edge AI Architecture; New Project Secures Long-Term Revenue Visibility Starting October 2026 TAIPEI, Sept. 10, 2026 /PRNewswire/ -- MICROIP (TPEx: 7796), a leading provider of custom ASIC design services and Edge AI software-hardware integrated solutions, today announce...
2026-09-10 22:07
4639
Insta360 Launches Luna Pro: Leica Co-Engineered Gimbal Camera for Everyday Vlogging
LOS ANGELES, Sept. 10, 2026 /PRNewswire/ -- Insta360 today announced Luna Pro,
its newest addition to Luna Series gimbal cameras co-engineered with Leica.
2026-09-10 21:00
4801
IBM, Lockheed Martin Announce Swiss Quantum Innovation Hub at ETH Zurich, Anchored by Switzerland's First IBM Quantum Computer
In an extension of ongoing collaboration, IBM and Lockheed Martin plan to initiate research projects with select Swiss academic institutions. The Swiss National Supercomputing Centre at ETH Zurich will host an IBM Quantum System Two, expanding access across Swiss institutions to fuel the country...
2026-09-10 15:00
2159
Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers
- Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials - TOKYO, Sept. 10, 2026 /PRNewswire/ -- Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter "Taiyo Holdings"), based in Tokyo, presented a pa...
2026-09-10 15:00
2353
Tulip Unveils Global Imaging Patent Licensing Program
Tulip Imaging provides access to more than 125,000 patents from Canon, Sony, Huawei, and OPPO covering foundational image and information processing technologies LONDON, Sept. 10, 2026 /PRNewswire/ -- Tulip Licensing Ltd today announced the launch of Tulip Imaging, a new patent licensing program...
2026-09-10 08:00
3464
Silicon Motion Earns ISO/SAE 21434 Automotive Cybersecurity Process Certification
Certification validates that the company's automotive cybersecurity engineering and management processes meet internationally recognized requirements TAIPEI and MILPITAS, Calif., Sept. 9, 2026 /PRNewswire/ -- Silicon Motion Technology Corporation (NasdaqGS: SIMO), a global leader in designing and...
2026-09-09 21:00
2918
LattePanda Launches the LattePanda Mu Ultra: A Micro x86 Compute Module for On-Device AI
SHANGHAI, Sept. 9, 2026 /PRNewswire/ -- LattePanda Team
2026-09-09 20:00
2298
SK keyfoundry Expands Collaboration with Elmos on 130nm Technology and Signs Long-Term Wafer Supply Agreement
SEOUL, South Korea, Sept. 9, 2026 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has recently signed an agreement with Elmos Semiconductor SE(hereafter referred to as Elmos), a leading global supplier of mixed-signal semiconductors for the automotive indust...
2026-09-09 19:00
2327
DB HiTek Completes Reliability Qualification for 8-Inch 1,200 V SiC MOSFET Process
* Establishes World's First Complete 8-Inch SiC Foundry Process Flow * Provides First- and Second-Generation PDKs to Customers, with Third-Generation PDK Scheduled for November; Expected to Shorten Product Development Time by More Than One Year SEOUL, South Korea, Sept. 9, 2026 /PRNewswire/ -...
2026-09-09 09:00
2447
Axcelis to Build New Manufacturing Facility in Pyeongtaek, Korea
BEVERLY, Mass., Sept. 8, 2026 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today announced plans to invest $35 million in its global manufacturing infrastructure through the construction of a n...
2026-09-08 20:00
4656
Quantinuum Finalizes $100 Million CHIPS R&D Award with U.S. Department of Commerce to Advance Trapped-Ion Quantum Computer Manufacturing in the US
* The federal funding supports critical R&D and U.S. quantum semiconductor manufacturing capabilities needed to scale fault-tolerant trapped-ion quantum computing. * Company partnering with GlobalFoundries to fabricate next-gen ion traps and control electronics, and Monarch Quantum to develop...
2026-09-08 19:30
4873
Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection
HSINCHU, Sept. 8, 2026 /PRNewswire/ -- Spirox (TWSE: 3055), today hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications. Spirox also ...
2026-09-08 18:00
2640
Karrie International's First Batch Vera Rubin Deliveries and Rising ASIC Server Volume Drive Expected Q4 Revenue Record
HONG KONG, Sept. 8, 2026 /PRNewswire/ -- Global leading server mechanical engineering solutions provider – Karrie International Holdings Limited ("Karrie International" or the "Company", together with its subsidiaries, the "Group"; stock code: 1050.HK) announced that the first batch of NVIDIA Ver...
2026-09-08 16:14
2284
Fujitsu develops diamond-spin quantum computer prototype
New diamond-spin quantum computer prototype incorporating tin-vacancy (SnV) centers into photonic integrated circuits marks significant step toward quantum computing scalability KAWASAKI, Japan, Sept. 8, 2026 /PRNewswire/ -- Fujitsu today announced that it has developed the world's first working...
2026-09-08 15:15
2009
SEMIFIVE Commences Mass Production of HyperAccel's LLM AI Inference Accelerator 'Bertha' on Samsung 4nm, Spurring Growth Momentum
* Secures initial mass production contract for HyperAccel's AI inference accelerator, Bertha, with follow-on purchase orders anticipated as services expand * Delivers a complete turnkey solution for a large-area "Big Die" chip of more than 500 mm², validating cutting-edge process leadership ...
2026-09-08 13:20
2141
FILM & TAPE EXPO 2026 to Connect Global Buyers with Asia's Advanced Film, Tape and Coating Technologies
SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ -- Held by Kuozhan Exhibition Services (Shanghai) Limited, as part of ASIA MATERIAL WEEK, FILM & TAPE EXPO 2026 will also benefit from cross-industry connections spanning high-performance materials, adhesives, chemical raw materials and CMF technologie...
2026-09-08 10:00
3728
C-TOUCH & DISPLAY SHENZHEN 2026 to Showcase Breakthroughs in Micro LED Optical Interconnects, AI+AR Smart Glasses and TGV Glass Substrates
SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ -- As the global display and smart interaction industry enters a new phase of technological convergence and application expansion, C-TOUCH & DISPLAY SHENZHEN 2026 is set to spotlight emerging technologies and high-growth applications fromOctober 27-29, ...
2026-09-08 10:00
4117
USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing
NANTOU, Sept. 8, 2026 /PRNewswire/ -- USI today announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, an...
2026-09-08 07:00
2283
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30354