Semiconductors

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universa...

2025-07-15 22:54 1975

ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025

All Geographic Regions Reported Growth, with Americas, EMEA, and Japan Recording Double Digit Increases MILPITAS, Calif., July 15, 2025 /PRNewswire/ -- Electronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million regi...

2025-07-15 22:00 1464

FIC Global Leads the Switch from Electrons to Photons for AI Factories

With 16 years of expertise in optical communications, FIC Global is powering the next wave of advancement for AI with leading-edge optical transceivers up to 1.6T and beyond. TAIPEI, July 15, 2025 /PRNewswire/ -- As artificial intelligence continues to reshape the global economy, fiber optic con...

2025-07-15 20:09 1425

NX Group Receives Intel's 2025 EPIC Supplier Award

- Only Logistics Provider Selected from All of Intel's Global Supply Chains - TOKYO, July 15, 2025 /PRNewswire/ -- The NX Group has received the 2025 EPIC Supplier Award from Intel Corporation ("Intel"), the world's leading semiconductor manufacturer. The award recognizes outstanding companies in...

2025-07-15 15:00 1533

SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging and Strengthen Competitiveness in Automotive High-Performance Semiconductors

SEOUL, South Korea, July 15, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on ...

2025-07-15 08:00 1930

SolidVue and Lumotive Collaborate to Advance Next-Generation LiDAR Systems

SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- SolidVue, a leader in SPAD sensor IC technology, announced a strategic collaboration with Lumotive, a US-based pioneer in programmable optical semiconductors, to develop next-generation LiDAR systems. The partnership brings together industry-leadi...

2025-07-14 22:00 1742

JNTC Unveils Next-Generation Glass Substrate for Semiconductors

Carving Semiconductors into Glass, the Dream Material SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- JNTC Co., Ltd. (KOSDAQ: 204270), a leading advanced materials company, hosted a product launch onJune 30 at the Korea Exchange Conference Hall, unveiling its new Through-Glass-Via (TGV) glass ...

2025-07-14 20:00 1830

SurplusGLOBAL Receives Minister of Trade Award at '2025 Trade Security Day'

SEOUL, South Korea, July 11, 2025 /PRNewswire/ -- SurplusGLOBAL Receives Minister of Trade Award at '2025 Trade Security Day' * Leading Private Sector Company in Strategic M...

2025-07-11 20:00 2209

Mouser Electronics New Product Insider: Over 15,000 New Parts Added in Second Quarter of 2025

SHANGHAI, July 11, 2025 /PRNewswire/ -- Mouser Electronics , Inc., As an authorized distributor, Mouser Electronics , Inc. is focused on the rapid introduction of new electronic components and technologies, giving customers an edge and helping sp...

2025-07-11 18:41 2888

SurplusGLOBAL Receives Minister of Trade Award at '2025 Trade Security Day'

SEOUL, South Korea, July 11, 2025 /PRNewswire/ -- SurplusGLOBAL Receives Minister of Trade Award at '2025 Trade Security Day' * Leading Private Sector Company in Strategic M...

2025-07-11 09:00 2154

Arasan Announces immediate availability of its Total IP for Embedded USB2 (eUSB2) with Controller and PHY

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its Embedded USB2 (eUSB2) IP Core. SAN JOSE, July 11, 2025 /PRNewswire/ -- Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automob...

2025-07-11 07:00 2199

NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities

SHENZHEN, China, July 10, 2025 /PRNewswire/ -- Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore po...

2025-07-10 21:00 2004

Pixelworks' Shanghai-based Subsidiary Awarded Local Government Subsidies

Newly Received Subsidies Recognize Pixelworks Shanghai's Contributions to Technology Innovation and Advanced R&D Capabilities PORTLAND, Ore., July 10, 2025 /PRNewswire/ -- Pixelworks, Inc. (NASDAQ: PXLW), a leading provider of innovative video and display processing solutions, today announced i...

2025-07-10 19:00 2341

ChipMOS REPORTS JUNE 2025 AND 2Q25 REVENUE

HSINCHU, July 10, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),...

2025-07-10 18:00 3262

SEMI and Linx Consulting Unveil Wafer Fab Materials Quarterly Report

New Report Offers Timely, Actionable Insights into Global Wafer Fab Materials Markets MILPITAS, Calif., July 7, 2025 /PRNewswire/ -- SEMI, the global industry association advancing the electronics manufacturing and design supply chain, today launched the new Wafer Fab Materials Quarterly report...

2025-07-07 22:00 1551

TECNO POVA 7 Series Earns Global Awards for Trendy, Futuristic Design

HONG KONG, July 7, 2025 /PRNewswire/ -- AI-driven innovative technology brand TECNO has gained global acclaim for its latest POVA 7 Series' refreshing trendy design. The series secured the Golden Award at the New York Product Design Awards and the Platinum Award at the London Design Awards, marki...

2025-07-07 14:00 1526

USI Delivers Full-System JDM Design Services for Level 10 AI Edge Server Platform

SHANGHAI, July 3, 2025 /PRNewswire/ -- USI, Universal Scientific Industrial (Shanghai) Co., Ltd., a global leader in electronic design and manufacturing services, announced the successful delivery of a Level 10 full-system Joint Design Manufacturing (JDM) project, supporting a global customer in ...

2025-07-03 07:30 2625

SEMI and TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database

Expanded Coverage and Enhanced Data Structure Provide Heightened Clarity in a Dynamic Market MILPITAS, Calif., July 1, 2025 /PRNewswire/ -- SEMI and TechSearch International today announced the release of the 2025 edition of the Worldwide Semiconductor Assembly & Test Facility Database, the ind...

2025-07-01 22:00 2112

Synopsys Receives Frost & Sullivan's 2025 Global Technology Innovation Leadership Award for Advancing Analog In-Memory Computing

Synopsys recognized for its comprehensive AI-driven EDA suite and cloud-enabled design environment accelerating analog in-memory computing development—a next-gen solution enabling advanced AI chips SAN ANTONIO, June 27, 2025 /PRNewswire/ -- Frost & Sullivan is pleased to announce thatSynopsys, ...

2025-06-27 00:05 2383

SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI

Global Capacity for 7nm and Below to Reach 1.4 Million Wafers Per Month by 2028  MILPITAS, Calif., June 25, 2025 /PRNewswire/ -- SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today reported findings from its latest300mm Fab ...

2025-06-25 22:00 2411
1 ... 891011121314 ... 112