Semiconductors

Airoha Technology Partners with E Ink for Global Debut of 4.2-Inch Ripple™ ESL at Computex 2026

ZHUBEI CITY, June 1, 2026 /PRNewswire/ -- Airoha Technology today announced its inaugural exhibition at the ePaper Pavilion during Computex 2026. Leveraging 20 years of deep technological expertise in wireless transmission, Airoha's Bluetooth® audio chips have earned widespread adoption and valid...

2026-06-01 18:01 3660

MediaTek Collaborates with NVIDIA on the RTX Spark to Power the Next Wave of Windows PC Experiences

MediaTek brings its design expertise in CPU performance and power efficiency to the groundbreaking RTX Spark, bringing local personal agents, advanced content creation, and gaming together in small, ultra-efficient Windows PCs TAIPEI, June 1, 2026 /PRNewswire/ -- MediaTek today announced its role...

2026-06-01 13:30 3395

PATRIOT MEMORY TO UNVEIL NEXT-GEN AI MEMORY AND STORAGE INFRASTRUCTURE AT COMPUTEX 2026

Featured showcase includes the flagship Viper Steel 5 Infinite DDR5, high-performance PCIe Gen5 SSDs, and advanced ACPI enterprise memory solutions designed for the intelligence era TAIPEI, June 1, 2026 /PRNewswire/ -- Patriot Memory, a global leader in high-performance memory and storage soluti...

2026-06-01 10:00 5446

/C O R R E C T I O N -- SEMIFIVE/

In the news release, SEMIFIVE and ICY Tech Achieve Successful Tape-out of 8nm eMRAM-Based Edge AI SoC, Targeting First Commercialization in Asia, issued 07-May-2026 by SEMIFIVE over PR Newswire, we are advised by the company that changes have been made. The complete, corrected release follows: S...

2026-05-29 12:28 9117

Infineon Joins NVIDIA's MGX™ AI Factory Ecosystem to Transform Power Delivery Architecture for Next-Generation AI Server Racks

MUNICH, May 29, 2026 /PRNewswire/ --  Infineon Technologies (FSE: IFX) (OTCQX: IFNNY), a leading provider of power systems and IoT, has joined NVIDIA's MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon's power management solutions will support...

2026-05-29 09:15 5583

SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026

SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2026 in San Jose. At this forum, Brandon Cho, CEO and co-founder of SEMIFIVE...

2026-05-29 06:03 5263

Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution

Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution including support for AP Memory's Xccela™ PSRAM and the latest LVpSRAM™ SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- Arasan Chip Systems, a leading provider of IP for mobile and automobile SoC's, is ...

2026-05-28 23:15 5628

4th CISCE Showcases Innovation Driving Global Supply Chains

More Than 160 Global Launches and Debuts; Dedicated AI Zone to Make First Appearance BEIJING, May 28, 2026 /PRNewswire/ -- The 4th China International Supply Chain Expo (CISCE) will take place in Beijing from June 22 to 26. Li Xingqian, Vice Chairman of the China Council for the Promotion of Int...

2026-05-28 16:18 5240

ASPEED Technology and Lattice Semiconductor Announce Strategic Partnership to Advance Next-Generation Control for Datacenter Management

‒ Integration of Lattice FPGA Technology into ASPEED's AST1840 Platform Enables Flexible, Expandable Control for Modern Server Architectures ‒ HSINCHU and HILLSBORO, Ore., May 28, 2026 /PRNewswire/ -- ASPEED Technology, the global leader in Baseboard Management Controllers (BMC) and Lattice Semi...

2026-05-28 15:30 6953

Longsys to Showcase Innovative Edge AI Storage Solutions at COMPUTEX 2026

TAIPEI, May 28, 2026 /PRNewswire/ -- Global AI is shifting from cloud infrastructure to edge devices, driving strong demand for high-performance storage. The storage sector, a core enabler of AI, has entered a transformative era. Embracing COMPUTEX 2026's official theme "AI together", Longsys (3...

2026-05-28 14:09 7558

AuthenX to Unveil Detachable 2D FAU Technology at COMPUTEX 2026, Eliminating the Optical Packaging Bottleneck for Next-Gen AI and HPC Clusters

Integrating 12-inch CMOS Meta-Lenses into a multi-row 2D array, AuthenX delivers ultra-low loss and high alignment tolerance to seamlessly scale 3.2T to 12.8T CPO deployments. TAIPEI, May 28, 2026 /PRNewswire/ -- AuthenX Inc., a leading innovator in high-speed optical interconnect solutions, tod...

2026-05-28 14:00 4070

LG Display begins mass production of world's first 240Hz RGB Stripe OLED, expanding premium monitor market

SEOUL, South Korea, May 27, 2026 /PRNewswire/ -- LG Display, the world's leading innovator of display technologies, announced todaythat it will begin mass production of the world's first 240Hz RGB Stripe OLED panel, accelerating its push into the premium monitor market.

2026-05-28 09:00 4293

SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends for Semiconductors

Report Projects 67.2% CAGR for Glass Core Substrates from 2028 to 2040 as AI and HPC Accelerate Demand for Advanced Packaging Technologies MILPITAS, Calif., May 27, 2026 /PRNewswire/ -- SEMI

2026-05-27 22:00 3870

HKC Corporation Limited to Showcase World-First Display Technologies from HKC, ANTGAMER and KOORUI at COMPUTEX TAIPEI 2026

NEW YORK, May 27, 2026 /PRNewswire/ -- HKC, ANTGAMER and KOORUI will jointly exhibit at COMPUTEX TAIPEI 2026, taking place from June 2 to 5, 2026, under the shared theme "Win Beyond the Frame." The three brands will present a new generation of display technologies designed to push the boundaries ...

2026-05-27 21:00 3608

LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC

* LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies * To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology * To highlight RF‑SiP substrates that adopt a groundbreaking appli...

2026-05-27 20:00 6358

NOVOSENSE Presents Semiconductor Technologies for xEV Powertrain and ADAS at Automotive Engineering Exposition 2026

YOKOHAMA, Japan, May 27, 2026 /PRNewswire/ -- NOVOSENSE (688052.SH | 02676.HK) is exhibiting atAutomotive Engineering Exposition 2026, held from May 27 to 29 atPACIFICO Yokohama, Booth No. 206. NOVOSENSE presents its automotive-grade automotivesemiconductor solutions for xEV powertrain, ADAS, bod...

2026-05-27 18:30 5733

Domestic Display Chip Leader Viewtrix Technology Listed on Hong Kong Stock Exchange

SHANGHAI, May 27, 2026 /PRNewswire/ -- Viewtrix Technology, a portfolio company of Qiming Venture Partners and a leading display chip design enterprise in China, successfully listed on the Hong Kong Stock Exchange, marking the sixth IPO for Qiming Venture Partners since the beginning of the year....

2026-05-27 16:51 8939

HUAWEI Presents the Tau Scaling Law, Enabling Breakthroughs in Transistor Density and System Performance

BEIJING, May 27, 2026 /PRNewswire/ -- A news report from China Daily: He Tingbo, President of HUAWEI’s Semiconductor Business Department, delivers a ...

2026-05-27 14:27 5579

USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026

~ Enabling Next-Generation Power Solutions ~ SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging i...

2026-05-27 07:00 7352

ISDN's IDI Dynamics debuts high-speed laser marker for semiconductor assembly and test (OSAT)

New High-speed Laser Marker delivers 2.5x higher chip throughput (units per hour) in a 22% smaller footprint, helping Outsourced Semiconductor Assembly & Test (OSAT)manufacturers drive productivity of valuable production floor space SINGAPORE, May 26, 2026 /PRNewswire/ -- IDI Dynamics

2026-05-26 08:40 13834
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