Semiconductors
Visitor Guide for electronica Shanghai 2026 Released: Complete Directory of 2,000+ Exhibitors and Online/Offline Events Unveiled
SHANGHAI, June 30, 2026 /PRNewswire/ -- As the countdown to electronica Shanghai 2026 begins, the annual Visitor Guide has been formally released. This comprehensive guide unveils the complete floor plans, a full directory of over 2,000 exhibitors, concurrent technical forum agendas, the online l...
2026-06-30 18:03
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MDT Showcases Full Portfolio of TMR and AMR Magnetic Sensors at Electronica Shanghai 2026
— Vertically Integrated Manufacturing Ensures Stable, Scalable Supply of
High-Performance Magnetic Sensors
SHANGHAI, June 30, 2026 /PRNewswire/ -- MultiDimension Technology
2026-06-30 13:15
2553
SEMI Projects 300mm Memory Equipment Investment to Surpass $50 Billion in 2026
AI-driven Demand for HBM, DDR5 and Data Storage Lifts Memory Investment Outlook, With Spending Projected to Approach $80 Billion by 2029 MILPITAS, Calif., June 29, 2026 /PRNewswire/ -- Worldwide 300mm fab equipment investment in the memory sector is projected to surpass $50 billion for the first...
2026-06-29 22:00
2487
DEEPX and Sixfab Launch 'DEEPX AI HAT' to Drive Edge Physical AI on Raspberry Pi
SEOUL, South Korea, June 26, 2026 /PRNewswire/ -- DEEPX, an on-device AI semiconductor pioneer, today announced that its ultra-low-power NPU technology is powering the Sixfab AI HAT+ for Raspberry Pi 5, a new edge AI acceleration board developed by Sixfab, an edge AI hardware solutions company an...
2026-06-26 20:00
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MetaOptics Begins Shipment of Metalens Smartphone and AI Smart Glasses to European and Japanese Customers for Evaluation
SINGAPORE, June 26, 2026 /PRNewswire/ -- MetaOptics Ltd. (Catalist: 9MT) ("MetaOptics" or the "Company"), a leading-edge semiconductor optics company pioneering metalens technology, today announced that it has begun shipping evaluation units of its metalens-integrated 5G smartphone and AI smart g...
2026-06-26 18:11
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DEEPX and Sixfab Launch 'DEEPX AI HAT' to Drive Edge Physical AI on Raspberry Pi
* Partnership delivers high-performance, low-power AI acceleration directly to the global Raspberry Pi ecosystem * Eliminates cloud dependency for real-time inference in robotics and smart automation * Rolls out production-ready Starter Kit and SDKs to lower entry barriers for global develo...
2026-06-26 15:30
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IBM Debuts World's First Sub-1 Nanometer Chip Technology
Built with revolutionary "nanostack" 3D chip architecture, IBM's sub-1 nm chip
to propel semiconductor industry forward for the next decade
YORKTOWN HEIGHTS, N.Y., June 25, 2026 /PRNewswire/ -- IBM (NYSE: IBM
2026-06-25 18:00
4971
SK keyfoundry Develops 'Bi-SCR-Based On-Chip EMC Protection Technology' to Enhance Automotive Semiconductor Reliability
SEOUL, South Korea, June 25, 2026 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has recently developed a 'Bi-SCR (Bi-directional Silicon Controlled Rectifier)-based On-Chip EMC protection technology' capable of dramatically enhancing the EMC (ElectroMagnet...
2026-06-25 08:00
4926
SPHERE AX Partners with U.S. AI Semiconductor Company Blaize at the National Assembly
Korea-U.S. Physical AI Cooperation Gets Underway -- Joint Development of AI Semiconductor-Based Products EL DORADO HILLS, Calif. and SEOUL, South Korea, June 24, 2026 /PRNewswire/ -- SPHERE AX (CEO: Yunha Park), a company specializing in Vision AI and Edge AI Computing, announced that it si...
2026-06-24 18:00
13865
ATLANT 3D, A*STAR IMRE and NAMIC Sign MoU to Advance AI-Driven Materials Discovery in Singapore
COPENHAGEN, Denmark and SINGAPORE, June 24, 2026 /PRNewswire/ -- ATLANT 3D, the A*STAR Institute of Materials Research and Engineering (A*STAR IMRE), and the National Additive Manufacturing Innovation Cluster (NAMIC), a national platform hosted by A*STAR, have signed a Memorandum of Understanding...
2026-06-24 15:30
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electronica Shanghai 2026: High-quality Industrial Enterprises Gather at this Can't-miss Electronics Event !
SHANGHAI, June 23, 2026 /PRNewswire/ -- electronica Shanghai 2026 will take place fromJuly 1 to 3, 2026 at the Shanghai New International Expo Centre (SNIEC),in halls W1-W5 and N1-N5. It is expected to attract a total of over 2,000 high-quality exhibitors from domestic and international markets s...
2026-06-23 17:30
5513
Innoscience's current products are not affected by both rulings of the Munich Regional Court
MUNICH, June 18, 2026 /PRNewswire/ -- Innoscience today announced that the Munich Regional Court has just issued a pair of rulings, from which it could be confirmed that Innoscience's currently marketed gallium nitride ("GaN") power device products fall outside the scope of Infineon's asserted Ge...
2026-06-19 11:24
4959
Infineon wins patent infringement case against Innoscience
MUNICH, June 19, 2026 /PRNewswire/ -- The District Court Munich, Germany (Landgericht München I) today ruled in favor of Infineon Technologies in two further of the patent infringement cases – specifically one based on a patent one based on a utility model – concerning gallium nitride (GaN) techn...
2026-06-19 02:05
7482
ARTERY MCU Adds BGA100 Package to Boost Dexterous Hand and Robot Joint Control Applications
HSINCHU, June 18, 2026 /PRNewswire/ -- In response to the rapid development of the humanoid robot, dexterous hand, and smart robot markets, Artery Technology announces the addition of a BGA100 package option to its high-performance AT32F435/437 MCU series, further expanding its product portfolio....
2026-06-18 19:18
3587
Floadia Releases Automotive Embedded Flash IP on TSMC 180BCD Gen3 Platform
TOKYO, June 18, 2026 /PRNewswire/ -- Floadia Corporation (hereinafter "Floadia"), a Tokyo, Japan-based developer of embedded flash IP (eFlash IP), has announced the release of its latest automotive eFlash IP, G1, implemented on TSMC's 180BCD Gen3 process platform. The newly released IP is designe...
2026-06-18 14:00
6043
Nuvoton Technology Corporation Strengthens Tethered XR Glass SoC Business Through Collaboration With Qualcomm Technologies
HSINCHU, June 17, 2026 /PRNewswire/ -- Nuvoton Technology Corporation announced its collaboration with Qualcomm Technologies, Inc. to strengthen its system-on-chip (SoC) business for tethered XR glass applications. By combining Nuvoton's low-power, XR-optimized SoCs with Qualcomm's Snapdragon® XR...
2026-06-18 08:00
3335
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
- Delivers 12-high HBM4E samples to major customers - Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency - Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability - SK hynix strengthens its AI leadership with ...
2026-06-18 07:35
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Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System
* World's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer line * Omni x-series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing applications. * Supports FOPLP, CoPoS, and T...
2026-06-15 16:25
3046
Mouser Brings Innovation to NEPCON Thailand 2026
BANGKOK, June 15, 2026 /PRNewswire/ -- Mouser Electronics
2026-06-15 16:06
5417
Innoscience Secures Final Victory in Patent Lawsuit as China's Supreme Court Upholds Injunction Against Infineon GaN Products
SUZHOU, China, June 13, 2026 /PRNewswire/ -- In a landmark decision for the global semiconductor industry, the Supreme People's Court of China has officially issued a final review decision sustaining a sales injunction against Infineon Technologies. The ruling means that effective immediately, In...
2026-06-13 16:46
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Week's Top Stories
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