Semiconductors

Synopsys Design Platform Certified for TSMC's Innovative SoIC Chip Stacking Technology

Close Collaboration Delivers Design Solutions for True 3D Device Integration MOUNTAIN VIEW, Calif., May 7, 2019 /PRNewswire/ -- Highlights: * Efficient support for the new chip stacking technology ensures realization of highest-performing 3D-IC solutions * Solution includes multi-die layout ...

2019-05-07 08:00 343

New generation power module and motor controller from Infineon reduce system cost, improve reliability and lower energy consumption

SINGAPORE, May 7, 2019 /PRNewswire/ -- Designers of Infineon's Home appliances applications such aswashing machines , low-power fridge...

2019-05-07 08:00 492

Synopsys Announces Industry's First DDR5 NVDIMM-P Verification IP for Next-generation Storage-class Memory Designs

Native SystemVerilog VIP Features Built-in Coverage, Verification Planning, Memory-aware Debug, and Performance Analysis MOUNTAIN VIEW, California, May 7, 2019 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of the industry's first verification IP (VIP) for Non-Vol...

2019-05-07 02:40 380

Synopsys Achieves More Than 250 Design Wins with DesignWare IP on TSMC 7nm FinFET Process

Proven Interface, Analog, and Foundation IP Has Enabled Customer Silicon Successes Across a Range of Applications MOUNTAIN VIEW, Calif., May 6, 2019 /PRNewswire/ -- Highlights: * Silicon-proven DesignWare PHY IP on TSMC's 7nm FinFET process includes USB, DDR, LPDDR, HBM, PCI Express, MIPI, Di...

2019-05-06 08:00 326

USI Sponsors Chinese Pair Go Association to Promote Cross-Strait Youth Interaction

SHANGHAI, May 3, 2019 /PRNewswire/ -- USI is pleased to announce the signing ceremony today for the sponsorship of the Chinese B-league Team from the Chinese Pair Go Association (CPGA). Led by coach and champion player Junxun Zhou, the team consisting of Junyen Lin (8 dan, 21), Houhong Hsu (6...

2019-05-03 15:07 675

Moortec Provides Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology

PLYMOUTH, England, May 2, 2019 /PRNewswire/ -- Moortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP). As market leaders, Moortec supported integration and utilization of its process, voltag...

2019-05-02 03:15 668

Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017

MILPITAS, Calif., April 29, 2019 /PRNewswire/ -- Worldwide silicon wafer area shipments dropped 5.6 percent during the first quarter 2019 when compared to the fourth quarter 2018 and are now at their lowest level since the fourth quarter of 2017 after silicon wafer shipments for the most recent q...

2019-04-29 22:00 358

ChipMOS SCHEDULES FIRST QUARTER 2019 FINANCIAL RESULTS CONFERENCE CALL

HSINCHU, Taiwan, April 25, 2019 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services...

2019-04-25 18:00 5890

Nano Dimension Enables a Shorter and Simplified, End-to-End Process for Assembling BGAs and Other SMT Components

NESS ZIONA, Israel, April 25, 2019 /PRNewswire/ -- Nano Dimension Ltd ., a leading additive electronics provider for electronics (NASDAQ, TASE: NNDM), announced today that the company's pioneering DragonFly Pro systems have successfully shortened and simplified the assemb...

2019-04-25 14:28 850

Axis 7th generation of own ARTPEC chip brings powerful capabilities to cameras

TOKYO, April 25, 2019 /PRNewswire/ -- Axis announces the 7th generation of its own ARTPEC chip, optimized for network video. The new chip will power an array of new capabilities and features coming to Axis network cameras. Since the chip is fully developed by Axis, it provides a layer of control ...

2019-04-25 13:30 600

TTM Technologies Purchases Two Nano Dimension Additive Manufacturing Systems, Expanding Total to Three Printers

NESS ZIONA, Israel, April 24, 2019 /PRNewswire/ -- Nano Dimension Ltd

2019-04-24 12:54 880

Success in Japan: Infineon is outgrowing all other leading suppliers of automotive semiconductors

MUNICH and TOKYO, April 24, 2019 /PRNewswire/ -- Strong growth in a strategically important market: According to the latest research from Strategy Analytics*, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) increased its automotive business inJapan by almost 25 percent in 2018. It thus grew fa...

2019-04-24 08:00 5402

Arasan Announces its Total eMMC IP Solution on TSMC 7nm Process Technology

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its eMMCPHY IP on TSMC 7nm Process Technology SAN JOSE, California, April 23, 2019 /PRNewswire/ -- Arasan Chip Systems announced to offer IP solutions on TSMC...

2019-04-23 23:10 290

Sumitomo Chemical starts production at its electronic materials JV in Changzhou National Hi-Tech District

CHANGZHOU, China, April 22, 2019 /PRNewswire/ -- On April 16, 2019, Sumika Electronic Materials (Changzhou) Co., Ltd., held a Grand Opening Ceremony at its facility located in Changzhou National Hi-Tech District (CND).Qiao Jun Jie, Director of CND Administrative Committee and governor of Xinbei d...

2019-04-22 13:15 714

Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems

New Virtualizer Development Kit for ST Stellar Multicore MCU Deployed at Lead Automotive Tier 1 Companies Enabled Early Software Development MOUNTAIN VIEW, California, April 22, 2019 /PRNewswire/ -- Highlights: * VDKs enable software development before hardware availability and accelerate sys...

2019-04-22 08:00 1531

Technoprobe to Acquire Microfabrica

- Combined know-how will fuel greater technological breakthroughs - - Customers to benefit from accelerated pace of innovation - CERNUSCO LOMBARDONE, Italy, April 18, 2019 /PRNewswire/ -- Technoprobe, a global leader in the microelectronics/semiconductor test industry, has reached a definitive a...

2019-04-18 21:00 552

Allegro DVT Introduces the Industry First Real-Time AV1 Video Encoder Hardware IP for 4K/UHD Video Encoding Applications

GRENOBLE, France, April 18, 2019 /PRNewswire/ -- Allegro DVT, a leading provider of video semiconductor IP solutions, today announced the availability of its AL-E210 multi-format video encoder hardware IP which adds support for the new AV1 video format developed by the Alliance for Open Media (AO...

2019-04-18 15:00 820

L-com Launches Right-Angle USB 3.0 Cable Assemblies with Female Connectors

IRVINE, Calif., April 18, 2019 /PRNewswire/ -- L-com, an Infinite Electronics brand, and a preferred manufacturer of wired and wireless connectivity products, announced today that it has introduced a new line of right-angleUSB 3.0 cable assemblies with female connectors.

2019-04-18 13:15 450

HP Takes the Lead with TUV Rheinland Low Blue Light Certification for the World's First AMOLED Notebook

TAIPEI, April 18, 2019 /PRNewswire/ -- The recent Eye Comfort certification of a Samsung display by TUV Rheinland has been followed by an announcement from HP that its new notebook with AMOLED panels is the first AMOLED notebook in the world to pass the TUV Rheinland Low Blue Light certification....

2019-04-18 09:18 906

Huawei Announces that the Atlas AI Computing Platform is Ready for Commercial Scaling

SHENZHEN, China, April 17, 2019 /PRNewswire/ -- During the Intelligent Computing Tour forChina staged in Shenzhen, Huawei announced the official launch of the Atlas AI computing platform to the market, unlocking a new chapter on the Atlas commercial roadmap.

2019-04-17 22:37 745
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