Semiconductors
China's Tech Rising Star Zhongwei Sail Breaks Micro LED Barriers; First Solutions Set for Global Debut at AES in UAE
DUBAI, Dec. 16, 2025 /PRNewswire/ -- Beijing Zhongwei Sail Technology Co., Ltd. ("ZW-Sail"), a pioneer in Micro LED semiconductor micro-display systems, today announced the successful tape-out of its first process verification chip. Achieving critical performance breakthroughs, the company's inau...
S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development
SAN JOSE, Calif., Dec. 16, 2025 /PRNewswire/ -- S2C, MachineWare, and Andes Technology today announced a collaborative co-emulation solution designed to address the increasing complexity of RISC-V-based chip design. The solution integrates MachineWare's SIM-V virtual platform, S2C's Genesis Archi...
Global Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027, SEMI Reports
Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 TOKYO, Dec. 16, 2025 /PRNewswire/ -- Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of$133 billion...
LG Innotek Showcases 'Future Car Innovation Solutions' Ushering in the AIDV Era at CES 2026
* Autonomous driving concept car and two EV mockups equipped with 35 core components * Showcasing of AI software‑based smart and safe mobility functions through 'integrated convergence solutions' SEOUL, South Korea, Dec. 16, 2025 /PRNewswire/ -- OnDecember 16, LG Innotek (CEO Moon Hyuksoo) an...
GIBO Announces Strategic Collaboration with E Total Technology Sdn Bhd to Accelerate Deployment of AI Compute Centers Featuring NVIDIA's Most Advanced Chips
KUALA LUMPUR, Malaysia, Dec. 15, 2025 /PRNewswire/ -- GIBO Holdings Ltd. (NASDAQ: GIBO) today announced a strategic collaboration withMalaysia-based technology and infrastructure solutions providerE Total Technology Sdn Bhd, under which the parties will work together on the planning, site sourcin...
SEMIFIVE Secures AI Semiconductor Design Projects in Japan, Accelerating Global Expansion with New Local Subsidiary
- Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC - Establishes a subsidiary in Japan to strengthen global reach SEOUL, South Korea, Dec. 11, 2025 /PRNewswire/ -- SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ li...
Meishilong Electronics Clinches 2025 Global Electronic Component Distributor "Annual Growth Star Award" - Dual Consecutive Wins Reinforce Industry Leadership
Global Recognition Validates Company's Commitment to Quality, Innovation and Customer-Centric Solutions SHENZHEN, China, Dec. 11, 2025 /PRNewswire/ -- Shenzhen Meishilong Electronic Technology Co., Ltd. (MSL MEISHILONG), a leading global distributor of electronic components, has been formally ho...
VisIC Technologies Announces $26M Round B Investment Led by Global Semiconductor Leader; Hyundai Motor Company and Kia (Together as "HKMC") Joins as Strategic Investor
NESS ZIONA, Israel, Dec. 10, 2025 /PRNewswire/ -- VisIC Technologies Ltd., a pioneer in Gallium Nitride (GaN) power semiconductors for electric mobility, today announced the successful second closing of its Round B funding, securing $26 million. The round was led by a global semiconductor leader, ...
VisIC Technologies Announces $26M Round B Investment Led by Global Semiconductor Leader; Hyundai Motor Company and Kia (Together as "HKMC") Joins as Strategic Investor
NESS ZIONA, Israel, Dec. 10, 2025 /PRNewswire/ -- VisIC Technologies Ltd., a pioneer in Gallium Nitride (GaN) power semiconductors for electric mobility, today announced the successful second closing of its Round B funding, securing $26 million. The round was led by a global semiconductor leader, ...
Axcelis to Showcase Advanced Ion Implant Solutions at SEMICON Japan 2025
BEVERLY, Mass., Dec. 10, 2025 /PRNewswire/ -- Axcelis Technologies
DEEPX Launches DX-H1 V-NPU: The 30W Single-Card Solution That Challenges GPU Dominance
Recently recognized with a CES 2026 Innovation Award, the solution combines video decoding, AI inference, and encoding on a single chip, offering 80% hardware cost savings compared to GPU architectures. LAS VEGAS and SEOUL, South Korea, Dec. 9, 2025 /PRNewswire/ -- Ahead of CES 2026, DEEPX, a pi...
Jiangyin Concludes Golden Autumn Investment Month with 208 Projects Totaling RMB68 Billion
JIANGYIN, China, Dec. 9, 2025 /PRNewswire/ -- The 2025 Jiangyin Symposium on Economic and Trade Cooperation was held onDecember 6, hosted by the Jiangyin Municipal Committee and Government. Marking the culmination of this year's Golden Autumn Investment Month, which featured more than 50 promotio...
Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography
Breakthrough enables scalable, high-precision biosensing applications in life sciences and healthcare LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ -- * Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV lithography on 300mm wafers. This innovation ...
ASPEED Technology Wins GSA Best Financially Managed Semiconductor Company Award
HSINCHU, Dec. 9, 2025 /PRNewswire/ -- ASPEED Technology, the world's leading provider of Baseboard Management Controller (BMC) SoCs, today announced that it has been awarded the 2025"Best Financially Managed Semiconductor Company Award" (Achieving Up toUS$1 Billion in Annual Sales) at the Global ...
Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030
TAIPEI, Dec. 9, 2025 /PRNewswire/ -- Data Center AI Chip Shipments Continue to Grow According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip catego...
Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach
Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures LEUVEN, Belgium, Dec. 9, 2025 /PRNewswire/ -- * Imec presents the first comprehensive thermal study ...
PCBAIR Unveils 8-Layer Glass Core PCB Manufacturing for Next-Gen AI & HPC
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL). The new glass substrates achieve superior signal inte...
Navitas, Cyient Semiconductors enter into a strategic partnership to accelerate GaN adoption in India's AI, Mobility, Industrial, and Energy Markets
TORRANCE, Calif. and HYDERABAD, India, Dec. 8, 2025 /PRNewswire/ -- Navitas
Semiconductor
DEEPX- Announces Ultra-Efficient AI Video Analytics Solution Based on AmpereOne® Platform
A New Architecture That Outperforms Traditional CPU + GPU Systems by a Wide Margin SANTA CLARA, Calif. and SEOUL, South Korea, Dec. 8, 2025 /PRNewswire/ -- DEEPX, a leader in ultra-low-power on-device AI semiconductors, announced on the 8th the launch of a next-generation AI video analytics plat...
MetaOptics to Showcase Five Breakthrough Metalens-Powered Products at CES 2026
SINGAPORE, Dec. 8, 2025 /PRNewswire/ -- MetaOptics Ltd. (Catalist: 9MT) ("MetaOptics" or the "Company"),a leading-edge semiconductor optics company pioneering metalens technology, will unveil five new proprietary metalens-powered consumer electronics at CES 2026 fromJanuary 6-9, 2026, in Las Veg...
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