Semiconductors
NX Group Presents Logistics Strategy to Support Semiconductor Ecosystem Development at SEMICON India 2026
- Group Holds MOU Signing Ceremony with ISM and Introduces Its Initiatives in Indian Market - TOKYO, Oct. 19, 2026 /PRNewswire/ -- The NX Group, consisting of companies under NIPPON EXPRESS HOLDINGS, INC., participated in the three-day SEMICON India 2026, held in New Delhi, India, from Thursday,...
GMIF2026: AI Inference Powers the "Token Factory" and Drives System-Level Rethinking of Memory & Storage
SHENZHEN, China, Oct. 19, 2026 /PRNewswire/ -- The 5th GMIF Innovation Summit (
Global Memory Innovation Forum 2026
Advantech and DEKRA Sign MOU to Advance Industrial Cybersecurity Compliance
Collaboration supports EU CRA readiness and cybersecurity planning for industrial and edge AI applications. TAIPEI, Oct. 16, 2026 /PRNewswire/ -- Advantech, a global leader in IoT intelligent systems and embedded platforms, has signed a memorandum of understanding (MOU) with DEKRA, a global test...
Discover More on One Trip: C-TOUCH & DISPLAY, FILM & TAPE EXPO and ITWA 2026 Open October 27
Global buyers can explore advanced displays, functional materials, robotics, electronics manufacturing and intelligent technologies through a connected exhibition program in Shenzhen, China. SHENZHEN, China, Oct. 15, 2026 /PRNewswire/ -- As artificial intelligence, advanced electronics and intel...
LITEON Showcases at NVIDIA MGX Ecosystem at OCP, Highlighting 800 VDC Power Technologies to Advance Next-Generation AI Infrastructure
SAN JOSE, Calif., Oct. 15, 2026 /PRNewswire/ -- LITEON Technology (2301.tw) is invited to participate in the NVIDIA MGX Ecosystem Ceremony held during the 2026 OCP Global Summit. Representing LITEON were John Chang, General Manager of LITEON Cloud Infrastructure Platform and Solution SBG, Bob Wen...
TGE Value Creative Solutions Celebrates Recent NYSE Listing: NYSE Content Update
NYSE issues a pre-market daily advisory direct from the trading floor. NEW YORK, Oct. 15, 2026 /PRNewswire/ -- The New York Stock Exchange (NYSE) provides a daily pre-market update directly from the NYSE Trading Floor. Access today's NYSE Pre-market update for market insights before trading begin...
ModelBest and OpenBMB Launch MiniCPM-V 4.7, Bringing a 35B Multimodal MoE Model to Phones and Tablets With About 3 GB of Memory
BEIJING, Oct. 15, 2026 /PRNewswire/ -- ModelBest and the OpenBMB community announced the release of MiniCPM-V 4.7, the latest addition to their open-source on-device multimodal model series. Available in 35B-A3B and 1B versions, the release brings advanced image, document and video understanding ...
Samsung Semiconductor Highlights 400+ Layer V-NAND and zNAND-O at GMIF2026 as Foundation for Agentic AI
SHENZHEN, China, Oct. 15, 2026 /PRNewswire/ -- The 5th GMIF Innovation Summit (
Global Memory Innovation Forum 2026
Brightray Signs Letter of Intent for Planned 10MW AI Data Center Project in the United States
Brightray expands into the world's largest data center market with its first U.S. project letter of intent, targeting delivery within one year with Brightray prefabricated data center solution to support next-generation AI compute deployment SINGAPORE, Oct. 14, 2026 /PRNewswire/ -- Brightray Sci...
IBM and Siemens Collaborate on Research to Advance Nanostack Architecture
Collaboration aims to accelerate development of the manufacturing and design
capabilities needed for future nanostack generations
ALBANY, N.Y., Oct. 14, 2026 /PRNewswire/ -- Today, IBM (NYSE: IBM
PEGATRON Brings AI Infrastructure from Design to Deployment at OCP Global Summit 2026
SAN JOSE, Calif., Oct. 14, 2026 /PRNewswire/ -- PEGATRON, a globally recognized provider of comprehensive AI infrastructure and server solutions, will showcase its capabilities in developing and manufacturing next-generation AI infrastructure at OCP Global Summit 2026. Under the theme "Scaling In...
Altair Semiconductor Integrates Iridium NTN Direct into ALT1350 and ALT1550 Cellular IoT Chipsets
MCLEAN, Va., Oct. 14, 2026 /PRNewswire/ -- Iridium Communications Inc.
Solidion Technology Reaffirms Commitment to Address Growing Energy Storage Needs of AI Data Centers
Solidion's patented anode technology and PEAK UPS design target the space,
lifespan and cost demands of AI-scale infrastructure.
DALLAS, Oct. 14, 2026 /PRNewswire/ -- Solidion Technology, Inc.
UfiSpace Demonstrates 1.6T AI Fabric Thermal Feasibility with Live Liquid Cooling Platform at OCP Global Summit 2026
Highlights Validation-Ready 102.4T Tomahawk 6 Liquid and Air-Cooled Platforms, and Deep-Buffered Routers, Delivering the Thermal and Connectivity Foundation to Empower Scale-Up, Scale-Out, and Scale-Across AI Clusters. SAN JOSE, Calif., Oct. 14, 2026 /PRNewswire/ -- UfiSpace, a global leader in ...
CyberTAN Unveils Pallas Series Liquid-Cooled 102.4 Tbps Ethernet Switch Platform Blueprint at OCP Global Summit 2026
Collaborates with Marvell on Full Liquid-Cooled 102.4 Tbps T100 Ethernet Switch
Platform Blueprint
SAN JOSE, Calif., Oct. 13, 2026 /PRNewswire/ -- CyberTAN Technology, Inc.
SmartSens Showcases Automotive Vision Sensing Portfolio at AutoSens Europe 2026
SmartSens presents automotive-grade image sensors and integrated imaging-and-computing solutions for a range of vehicle applications BARCELONA, Spain, Oct. 13, 2026 /PRNewswire/ -- At AutoSens Europe 2026, held from September 22 to 24 at La Farga de L'Hospitalet in Barcelona, SmartSens, a techno...
Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates, SEMI Projects
U.S. Construction Pipeline Expands Amid Strong Global 300mm Investment SAN FRANCISCO, Oct. 13, 2026 /PRNewswire/ -- SEMICON West -- Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest300mm Fab Outlook ...
Supermicro Expands Integrated Open Compute Project Portfolio to Accelerate Rack-Scale AI Data Center Deployments
* Integrated Open Compute Project (OCP) based portfolio spans rack-scale AI/HPC systems, ORv3 and ORW racks, 48V DC power, networking, and liquid cooling solutions to enable higher-density compute in existing and new data centers * Portfolio extends from infrastructure to intelligent operatio...
Moët Hennessy, Analog Devices and UC Davis Join Forces to Advance Wine Production Through Breakthrough Chemical Signature Detection Technology Leveraging AI
Researchers have demonstrated the ability to identify the complex chemical signatures emitted from grapes and wine to predict quality risks in wine production faster and more affordably than conventional methods. TAIPEI, Oct. 13, 2026 /PRNewswire/ -- Moët Hennessy, the wine and spirits division ...
KES 2026 | Fibocom LE270-KR Secures KC Certification and KT Network Approval, Supporting Smart Metering and Other IoT Deployments
SEOUL, South Korea, Oct. 13, 2026 /PRNewswire/ -- At KES 2026, the Korea
Electronics Show, Fibocom is showcasing its LE270-KR LTE Cat.1 bis wireless
communication module, presenting a low-power cellular connectivity solution for
smart metering and other IoT applications.
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