BILLERICA, Mass. and SHANGHAI, October 19, 2011 /PRNewswire-Asia/ -- In a move that expands its customer base in China, NEXX Systems [NEXX] shipped a Stratus electrochemical deposition tool to a leading IC manufacturer, Nantong Fujitsu Microelectronics Co. Ltd. (NFME). NEXX provides the global semiconductor industry with productive, flexible and efficient deposition technology for advanced packaging applications. Headquartered in China's Jiangsu province, NFME selected the Stratus over competitive tools because of its process and productivity leadership for Copper Pillar and RDL advanced packaging applications.
The deal represents a new milestone for NEXX. Earlier this year, the company invested in expanding its infrastructure and added personnel to support China's growing IC and advanced packaging market. A Shanghai office was opened to deliver its commitment to "close-to-the-customer" support.
NEXX System's expansion is a response to a rising demand from China's top packaging companies for industry-leading process tools. Brandon Prior, semiconductor market analyst at Prismark Partners LLC remarks that, "China already represents over 20% of the semiconductor packaging industry, and is rapidly becoming a key region for advanced package solutions which are driving overall industry growth. Advanced package solutions such as Wafer Level CSP (WLCSP), fan out wafer level CSP, Through Silicon Vias [TSVs], and copper pillar bumps help market leaders define their competitive advantages among mobile electronics."
NEXX Systems
NFME is a technology and market leader that focuses on testing and assembling semiconductors for more than half of the top semiconductor manufacturers. Commenting on the partnership with NEXX, NFME's president, member of board, Mr. Shilei said, "Delivering advanced products to our diverse international customer base is our top corporate priority. This means continually investing in cutting-edge process technologies to build the highest-quality ICs. We're impressed by NEXX's dedication to helping us meet our technical and economic needs. We firmly believe that the Stratus tool can help us keep pace with our aggressive technology roadmap."
NEXX'S CEO Tom Walsh paid tribute to NFME for its ambitious migration into new packaging areas. "We are delighted to partner with NFME and we're pleased to be shipping a Stratus tool to their Chinese facility. They are truly advancing technologies to enable the development of tomorrow's consumer mobile ICs. We're looking forward to working with them to help them execute their product strategy with our innovative deposition solutions."
To learn more about NEXX Systems' Stratus electrochemical deposition tool, please click here
To learn more about Nantong Fujitsu Microelectronics Co. Ltd., please click here
To learn more about NEXX Systems, please click here
